Titlebook: Chiplet Design and Heterogeneous Integration Packaging; John H. Lau Book 2023 The Editor(s) (if applicable) and The Author(s), under exclu

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The Character of Scientific ChangeIn this chapter, chiplet design and heterogeneous integration packaging.

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https://doi.org/10.1057/9781403982353Cu-Cu hybrid bonding is one of the flip chip assembly technologies.

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Chiplets Lateral Communications,As mentioned in Chap. ., the key disadvantages of chiplet design and heterogeneous integration packaging are larger packaging size and higher packaging cost.

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Cu-Cu Hybrid Bonding,Cu-Cu hybrid bonding is one of the flip chip assembly technologies.

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John H. LauAddresses chiplet design and heterogeneous integraton packaging both in theory and practice.Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs.Writ

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