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Titlebook: Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, T; Proceedings of the 2 Christian Franck

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書目名稱Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, T
副標(biāo)題Proceedings of the 2
編輯Christian Franck,Karen Kasza,Cahit Aydiner
視頻videohttp://file.papertrans.cn/224/223470/223470.mp4
叢書名稱Conference Proceedings of the Society for Experimental Mechanics Series
圖書封面Titlebook: Challenges in Mechanics of Biological Systems and Materials, Thermomechanics and Infrared Imaging, T; Proceedings of the 2 Christian Franck
描述.Challenges in Mechanics. of Biological Systems and Materials, Thermomechanics and Infrared Imaging,? Time Dependent Materials and Residual Stress., Volume 2 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the second volume of five from the Conference, brings together contributions to this important area of research and engineering.? The collection presents early findings and case studies on fundamental and applied aspects of Experimental Mechanics, including papers in the following general technical research areas:?..Advanced Thermographic Techniques for SHM..AM Composites and Polymers.Experimental Techniques in Biomechanics and Mechanobiology..Inverse Methodologies and Uncertainties in the Identification of Residual Stresses, Residual Stress IV..Low Cost Thermographic Applications.Multiscale Mechanics of Biological Materials..NDE and Process Monitoring..Residual Stress.Thermomechanics.Time Dependence in Porous and Soft Materials.
出版日期Conference proceedings 2024
關(guān)鍵詞Biomechanical Engineering; Infrared Imaging; Residual stress; Time dependent materials; Materials Charac
版次1
doihttps://doi.org/10.1007/978-3-031-50470-9
isbn_softcover978-3-031-50472-3
isbn_ebook978-3-031-50470-9Series ISSN 2191-5644 Series E-ISSN 2191-5652
issn_series 2191-5644
copyrightThe Society for Experimental Mechanics, Inc. 2024
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https://doi.org/10.1007/978-3-031-50470-9Biomechanical Engineering; Infrared Imaging; Residual stress; Time dependent materials; Materials Charac
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978-3-031-50472-3The Society for Experimental Mechanics, Inc. 2024
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