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Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B

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發(fā)表于 2025-3-21 16:48:58 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
期刊全稱Bio and Nano Packaging Techniques for Electron Devices
期刊簡稱Advances in Electron
影響因子2023Gerald Gerlach,Klaus-Jürgen Wolter
視頻videohttp://file.papertrans.cn/187/186319/186319.mp4
發(fā)行地址Provides solutions for electron device packaging.Comprehensive review of nanoscale materials for packaging.Lists the future trends in nanobiotechniques.Includes supplementary material:
圖書封面Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B
影響因子.This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the?effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their?application as?packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also?ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers..
Pindex Book 2012
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Platform Technologies for Pico-liter Printing and Nano-imprintingt high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table?11.1). This chapter will introduce design and properties of the respective equipment.
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Nanoparticle-Based Resistors and Conductorsacy on top of components with almost any geometry. Additionally, the alignment of filler particles in an electric field by dielectrophoresis is discussed in detail. This technique enables a high conductivity of the composite at a low filling degree and in general a precise adjustment of the electric
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Bio and Nano Packaging Techniques for Electron DevicesAdvances in Electron
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Koen Lemmink,Michel Brink,Esther Nederhoft high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table?11.1). This chapter will introduce design and properties of the respective equipment.
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