SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影響因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, ELECTRICAL

Garfield

SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影響因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)影響因子@(工程，電氣和電子)學科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)總引論文


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)總引論文@(工程，電氣和電子)學科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)影響因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)總引頻次@(工程，電氣和電子)學科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)即時影響因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)即時影響因子@(工程，電氣和電子)學科排名


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(20 21 REV HIST)五年累積影響因子


SCIE(SCI)期刊JOURNAL OF ELECTRONIC PACKAGING(J ELECTRON PACKAGING)五年累積影響因子@(工程，電氣和電子)學科排名

palpitate

Submitted on: 23 November 2011. Revised on: 01 February 2012. Accepted on: 15 February 2012. ___________________JOURNAL OF ELECTRONIC PACKAGING

expository

babble

machination

Submitted on: 12 August 2011. Revised on: 08 September 2011. Accepted on: 26 September 2011. ___________________JOURNAL OF ELECTRONIC PACKAGING

laparoscopy

Submitted on: 14 November 2015. Revised on: 13 March 2016. Accepted on: 06 April 2016. ___________________JOURNAL OF ELECTRONIC PACKAGING

訓誡

Submitted on: 05 July 2001. Revised on: 16 August 2001. Accepted on: 27 September 2001. ___________________JOURNAL OF ELECTRONIC PACKAGING

Receive

Submitted on: 02 April 2000. Revised on: 17 July 2000. Accepted on: 03 September 2000. ___________________JOURNAL OF ELECTRONIC PACKAGING

dysphagia

不在灌木叢中

Submitted on: 20 December 2023. Revised on: 17 January 2024. Accepted on: 11 February 2024. ___________________JOURNAL OF ELECTRONIC PACKAGING