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Titlebook: Applications in Electronics Pervading Industry, Environment and Society; APPLEPIES 2023 Francesco Bellotti,Miltos D. Grammatikakis,Riccard

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發(fā)表于 2025-3-21 19:02:55 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱Applications in Electronics Pervading Industry, Environment and Society
期刊簡稱APPLEPIES 2023
影響因子2023Francesco Bellotti,Miltos D. Grammatikakis,Riccard
視頻videohttp://file.papertrans.cn/160/159262/159262.mp4
發(fā)行地址Explores cutting-edge electronic engineering research on industrial and societal applications.Covers a wide spectrum of application domains, from automotive to space and from health to security.Discus
學(xué)科分類Lecture Notes in Electrical Engineering
圖書封面Titlebook: Applications in Electronics Pervading Industry, Environment and Society; APPLEPIES 2023 Francesco Bellotti,Miltos D. Grammatikakis,Riccard
影響因子.This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication, and control. The book is based on the 2023 ApplePies Conference, held in Genoa, Italy, in September 2023, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean, and efficient energy; the environment; and smart, green, and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs tobe directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contri
Pindex Conference proceedings 2024
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Conference proceedings 2024es to develop apace, constantly meeting previously unthinkable targets, further attention needs tobe directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contri
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https://doi.org/10.1007/978-3-658-05396-3d an MSc program on strategy, intending to shape education in that field from a rigorous engineering point of view. We believe that his generous and enthusiastic academic life can be an outstanding example in the face of today’s challenges of Electronic Engineering and higher education in the broade
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Zum Status quo der Emotionspsychologieusion, wire bonding offers advantages for high-speed serial links, and co-design optimizes system performance. Properly designed, wire bonding is an attractive choice for high-speed applications, outperforming flip-chip techniques in bandwidth enhancement.
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Emotionspsychologie im Krankenhauserly combined with adapted Compressed Sensing mechanisms. Importantly, the study analyses the effect of the intrinsic noise that affects digital accelerometer sensors. Results confirm that CNNs can mine information in the compressed domain even in presence of strong noise components, i.e., accuracy
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1876-1100 needs tobe directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contri978-3-031-48123-9978-3-031-48121-5Series ISSN 1876-1100 Series E-ISSN 1876-1119
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Alessandro De Gloria, a Pioneer in Electronic Engineering Applicationsd an MSc program on strategy, intending to shape education in that field from a rigorous engineering point of view. We believe that his generous and enthusiastic academic life can be an outstanding example in the face of today’s challenges of Electronic Engineering and higher education in the broade
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Wire Bonding: Limitations and Opportunities for High-Speed Serial Communicationsusion, wire bonding offers advantages for high-speed serial links, and co-design optimizes system performance. Properly designed, wire bonding is an attractive choice for high-speed applications, outperforming flip-chip techniques in bandwidth enhancement.
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Evaluating the Effect of Intrinsic Sensor Noise for Vibration Diagnostic in the Compressed Domain Userly combined with adapted Compressed Sensing mechanisms. Importantly, the study analyses the effect of the intrinsic noise that affects digital accelerometer sensors. Results confirm that CNNs can mine information in the compressed domain even in presence of strong noise components, i.e., accuracy
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