期刊全稱 | Analysis and Simulation of Heterostructure Devices | 影響因子2023 | Vassil Palankovski,Rüdiger Quay | 視頻video | http://file.papertrans.cn/157/156264/156264.mp4 | 發(fā)行地址 | First full and comprehensive modeling of relevant compound semiconductors.Verified by precise simulation of real-state-of-the-art devices in over 25 different simulation examples.Bridges the gap betwe | 學(xué)科分類 | Computational Microelectronics | 圖書封面 |  | 影響因子 | Communication and information systems are subject to rapid and highly so- phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar Transistors (HBTs) and High Electron Mobility Transis- tors (HEMTs), are among the fastest and most advanced high-frequency devices. They satisfy the requirements for low power consumption, medium integration, low cost in large quantities, and high-speed operation capabilities in circuits. In the very high-frequency range, cut-off frequencies up to 500 GHz [557] have been reported on the device level. HEMTs and HBTs are very suitable for high- efficiency power amplifiers at 900 MHz as well as for data rates higher than 100 Gbitfs for long-range communication and thus cover a broad range of appli- cations. To cope with explosive development costs and the competition of today‘s semicon- ductor industry, Technology Computer-Aided Design (TCAD) methodologies are used extensively in development and production. As of 2003, III-V semiconductor HEMT and HBT micrometer and millimeter-wave integrated circuits (MICs and MMICs) are available on six-inch GaAs wafers. SiGe HBT circuits, as part of the CMOS technology on eig | Pindex | Book 2004 |
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