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Titlebook: Advances in Micro and Nano Manufacturing and Surface Engineering; Proceedings of AIMTD M. S. Shunmugam,M. Kanthababu Conference proceedings

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21#
發(fā)表于 2025-3-25 05:52:03 | 只看該作者
https://doi.org/10.1007/978-981-10-2048-3providing the sequential firing-order-based pulse distribution, pulse off time is zero because at any instant at least one or more number of electrodes would be in the pulse on mode. This study outlines a numerical and experimental study of micro-holes array drilling through multiple electrodes in E
22#
發(fā)表于 2025-3-25 08:31:56 | 只看該作者
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發(fā)表于 2025-3-25 14:17:34 | 只看該作者
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發(fā)表于 2025-3-25 17:14:39 | 只看該作者
Computer Conferencing and Content Analysisl. The rGO ink was used to make the conducting patterns, while rGO–MnO. nanocomposite ink is used to fabricate interdigital electrodes for the supercapacitor device. The developed device shows excellent electrochemical performance with the poly(vinyl alcohol) (PVA) 4?M KOH gel electrolyte within a v
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發(fā)表于 2025-3-25 21:48:19 | 只看該作者
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發(fā)表于 2025-3-26 03:51:41 | 只看該作者
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發(fā)表于 2025-3-26 06:04:47 | 只看該作者
2522-5022 discuss the latest advances in?miniature manufacturing, the?machining of miniature components and features as well as?improvement of surface properties.?This volume will be of interest?to academicians, researchers, and practicing?engineers alike..978-981-32-9427-1978-981-32-9425-7Series ISSN 2522-5022 Series E-ISSN 2522-5030
28#
發(fā)表于 2025-3-26 10:13:58 | 只看該作者
https://doi.org/10.1007/978-3-642-77684-7ted with KOH solution shows some heat-affected marks. This is due to low heat-carrying capacity of KOH solution as compared to water. KOH aqueous solution shows better performance in terms of force reduction, whereas pure water shows better cooling property during silicon micro-grinding.
29#
發(fā)表于 2025-3-26 15:46:33 | 只看該作者
30#
發(fā)表于 2025-3-26 19:17:05 | 只看該作者
Rodger Kessler Ph.D,Dale Stafford M.D chip formation. Finally, a brittle mode machining was performed with 1?mm diameter cutter and machining performance was compared with ductile mode machining. It was found that ductile mode machining produced a crack-free surface with surface roughness in the range of 250?nm and edge wall of the slots were free from cracks and damages.
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