| 期刊全稱 | Advanced Thermal Stress Analysis of Smart Materials and Structures | | 影響因子2023 | Zengtao Chen,Abdolhamid Akbarzadeh | | 視頻video | http://file.papertrans.cn/147/146352/146352.mp4 | | 發(fā)行地址 | A first monograph on thermal stress analysis based on non-Fourier heat conduction theories.Includes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and struct | | 學(xué)科分類 | Structural Integrity | | 圖書封面 |  | | 影響因子 | . .This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.? .The book contains six chapters and starts with a?brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced?through reviewing the methods for solving non-Fourier heat conduction theories and by?presenting transient heat transport in representative homogeneous?and advanced heterogeneous materials. The?book? provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry..A series of uncoupled thermal stress analyses on one-dimensional structures are also included. T | | Pindex | Book 2020 |
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