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Titlebook: Wireless Algorithms, Systems, and Applications; 16th International C Zhe Liu,Fan Wu,Sajal K. Das Conference proceedings 2021 Springer Natur

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發(fā)表于 2025-3-28 16:34:31 | 只看該作者
Yaoci Xiang,Chong Zhao,Xing Wei,Yang Lu,Shaofan Liuy acquiring a dominant role. Nonetheless, the debate about how to measure its actual contribution in triggering changes, and innovation to the largest extent, is still on the cutting-edge. What we argue in this chapter is that including the evaluation of services and service solutions into the servi
42#
發(fā)表于 2025-3-28 19:43:11 | 只看該作者
Yun Feng,Baoxu Liu,Yue Zhang,Jinli Zhang,Chaoge Liu,Qixu Liue industry as it stands, including all the major players and.Childhood learning is now more screen-based than ever before, and app developers are flocking in droves to this lucrative and exciting market. The younger generation deserves the best, and growing up in a digital world has made them discer
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發(fā)表于 2025-3-29 01:53:13 | 只看該作者
44#
發(fā)表于 2025-3-29 05:00:05 | 只看該作者
Jian Ding,Dingcheng Wu,Xueyong Xu,Hongli Xu,Liusheng Huangies such as manufacturing, supply chain, and retail.Discusse.Build a strong and efficient IoT solution at industrial and enterprise level by mastering industrial IoT using Microsoft Azure. This book focuses on the development of the industrial Internet of Things (IIoT) paradigm, discussing various a
45#
發(fā)表于 2025-3-29 08:43:22 | 只看該作者
46#
發(fā)表于 2025-3-29 13:59:58 | 只看該作者
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發(fā)表于 2025-3-29 19:15:54 | 只看該作者
48#
發(fā)表于 2025-3-29 23:40:00 | 只看該作者
Sichen Cui,Lailong Luo,Deke Guo,Bangbang Ren,Chao Chen,Tao Chennd methodological innovation.Discusses gathering and analyziThis?volume offers an in-depth description and discussion of?research design for a large-scale investigation of bilingual development. It?introduces and justifies a range of theoretical and methodological innovations,?discusses some of the
49#
發(fā)表于 2025-3-30 03:41:39 | 只看該作者
Shengnan Zhao,Ming Ma,Xiangfu Song,Han Jiang,Yunxue Yan,Qiuliang Xueighboring devices, provides a methodology to evaluate noiseThis book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.? It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others ad
50#
發(fā)表于 2025-3-30 05:02:08 | 只看該作者
Jianjun Lei,Sipei Zhang,Ying Wang,Xunwei Zhao,Ping Gai. Today‘s new homes are technically superior in construction; i.e., they are more energy efficient, weather resistant and maintenance free. However, they also seem to lack the warmth and charm of prewar homes, for which more construction dollars were spent on quality veneers, buUt-in features and ot
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