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Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T

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樓主
發(fā)表于 2025-3-21 17:56:06 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Wafer-Level Chip-Scale Packaging
副標題Analog and Power Sem
編輯Shichun Qu,Yong Liu
視頻videohttp://file.papertrans.cn/1021/1020140/1020140.mp4
概述Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technology.Introduces the development of the analog and power SIP/3D/TSV/sta
圖書封面Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T
描述Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the b
出版日期Book 2015
關鍵詞Analog Technology; Analog and Power Electronic Package; Packaging Technology; Power Electronics; WLCSP A
版次1
doihttps://doi.org/10.1007/978-1-4939-1556-9
isbn_softcover978-1-4939-5438-4
isbn_ebook978-1-4939-1556-9
copyrightSpringer Science+Business Media New York 2015
The information of publication is updating

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沙發(fā)
發(fā)表于 2025-3-21 21:37:35 | 只看該作者
Stackable Wafer-Level Analog Chip-Scale Package,ally mentioned as well. More frequently, heat dissipation is one of the mostly concerned areas for the stacked package. Cost of manufacturing the 3D structure seems to be the main hurdle for wider adoptions of the more aggressive 3D package concepts.
板凳
發(fā)表于 2025-3-22 03:46:07 | 只看該作者
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.
地板
發(fā)表于 2025-3-22 05:40:07 | 只看該作者
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.
5#
發(fā)表于 2025-3-22 10:55:19 | 只看該作者
6#
發(fā)表于 2025-3-22 13:45:48 | 只看該作者
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging,miconductor industry. This chapter covers in more detail how advances in both the analog and power advanced wafer-level package fan-in/fan-out design and 3D integration have co-enabled significant advances in analog and power device capability during recent years. Extrapolating the same trends in re
7#
發(fā)表于 2025-3-22 19:15:35 | 只看該作者
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.
8#
發(fā)表于 2025-3-23 00:24:33 | 只看該作者
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.
9#
發(fā)表于 2025-3-23 02:28:48 | 只看該作者
10#
發(fā)表于 2025-3-23 07:22:23 | 只看該作者
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