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Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

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發(fā)表于 2025-3-25 04:04:02 | 只看該作者
22#
發(fā)表于 2025-3-25 11:03:01 | 只看該作者
N. R. Strader,J. C. Hardenelopments and Applications in Microbeam Analysis" which th th took place from the 11 to 15 May 1997 in Torquay (UK). EMAS was founded in 1986 by scientists from many European countries in order to stimulate research in microbe am analysis and into its development and application. The society now has
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發(fā)表于 2025-3-25 18:47:00 | 只看該作者
W. Kent Fuchs,Sy-Yen Kuoomic considerations and production rates desired. Batch furnaces have lowest investment costs and are adequate for low to medium production whereas continuous furnaces are more costly but provide higher production rates. strong, well-sintered P/M parts can be obtained in atmos- pheres of nitrogen, d
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發(fā)表于 2025-3-26 03:50:21 | 只看該作者
27#
發(fā)表于 2025-3-26 06:34:42 | 只看該作者
Jack Raffel,Allan H. Anderson,Glenn H. Chapmanods for the efficient modeling and accurate solution of contemporary real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applicat
28#
發(fā)表于 2025-3-26 10:48:14 | 只看該作者
Jack Raffel,Allan H. Anderson,Glenn H. Chapmane efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining
29#
發(fā)表于 2025-3-26 15:52:18 | 只看該作者
30#
發(fā)表于 2025-3-26 18:05:05 | 只看該作者
R. Wayne Johnson,Richard C. Jaeger,Travis N. Blalockof the book up to date, by the addition of a new Chapter 13 which deals with the more important developments that have occurred in the interim. This method has been adopted in order to simplify and to expedite the preparation of the present edition. As with the other Manuals of the Series, the eleme
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