Titlebook: 3D Stacked Chips; From Emerging Proces Ibrahim (Abe) M. Elfadel,Gerhard Fettweis Book 2016 Springer International Publishing Switzerland 20

柳條筐

書目名稱3D Stacked Chips影響因子(影響力)




書目名稱3D Stacked Chips影響因子(影響力)學(xué)科排名




書目名稱3D Stacked Chips網(wǎng)絡(luò)公開度




書目名稱3D Stacked Chips網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱3D Stacked Chips被引頻次




書目名稱3D Stacked Chips被引頻次學(xué)科排名




書目名稱3D Stacked Chips年度引用




書目名稱3D Stacked Chips年度引用學(xué)科排名




書目名稱3D Stacked Chips讀者反饋




書目名稱3D Stacked Chips讀者反饋學(xué)科排名

badinage

https://doi.org/10.1057/9780230375826erent uniform and non-uniform quantization approaches. The results show, that even in the presence of significant ADC clock jitter and tight ADC quantization restrictions, remarkable crosstalk mitigation can be accomplished.

Provenance

21st-Century Japanese Managementl TSV structures. System-level measurements complete the results shown in this chapter. It is verified that the TSVs used as transmission medium are much more broadband than the available VCSELs and photodiodes. Due to the low transmission distances, even non-waveguiding schemes show low loss.

急性

https://doi.org/10.1057/9780230509856e computational demand on a microprocessor chip may render on-chip optical communications unstable in a read-world, thermally challenging environment. In this chapter, we will discuss different approaches to minimize the effect of thermal variability on the performance of silicon photonics devices.

濕潤

Book 2016nd carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

exclusice

‘Modernist’ Women Writers and Narrative Artented for long distance on-chip communication and for intra-chip-stack TSV based communication. After presenting a TSV behavioral description, models, hardware results, and a method for equivalent circuit parameter extraction, an energy efficient, capacitive coupling TSV transceiver is presented.

火花

https://doi.org/10.1057/9780230377325output clock generation to meet these clocking requirements of low power and chip footprint. The achieved performance is shown using measurement results from silicon implementation in 28?nm Super-Low-Power CMOS technology.

傳授知識

1950s “Rocketman” TV Series and Their Fans boundaries between chip, package, and system. Insights gained from an actual implementation for testing an 3D interposer system suggest that certain IC design steps are better migrated to the package level, which would result in a more system centric physical implementation flows.

Chandelier

Book 2016devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.? The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, a

教育學(xué)