Titlebook: 3D Microelectronic Packaging; From Fundamentals to Yan Li,Deepak Goyal Book 20171st edition Springer International Publishing AG, part of S

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https://doi.org/10.1057/9781137475022der volume. The dimension of the microbump may be one to three orders less than the C4 bump and BGA solder ball. The fast reaction between solder and the major metallization layers during reflow, thermal compressing bonding, and afterwards functioning results in the vast proportion of intermetallic

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Building Your Sales Transformation Roadmap,res is because for mobile and wearable devices, the frequency of impact and dropping to the ground is high. On EM and TM in microbumps and TSV, we emphasize the enhanced failure mode due to Joule heating.

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How European Was the Revolution of 1848/49?t Secondary Ion Mass Spectrometry (TOF-SIMS), and Electron Backscatter Diffraction (EBSD) to 3D packages are reviewed along with the key FI and FA challenges. 3D package FA Strategies of building up efficient FI-FA flow and in-depth root cause studies to provide solution paths are discussed and demo

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Materials and Processing of TSV,hlagen. Für die aktuelle Auflage wurden neue Funktionalít?ten zur Blechbearbeitung aufgenommen, die Qualit?t ausgesuchter Bilder verbessert sowie das Literaturverzeichnis aktualisiert. Die Auflage basiert auf R20..Ausgew?hlte 3D-Modelle lassen sich unter www.springervieweg.de/onlineplus herunterladen..978-3-8348-2131-7