標題: Titlebook: Solder Joint Reliability Assessment; Finite Element Simul Mohd N. Tamin,Norhashimah M. Shaffiar Book 2014 Springer International Publishing [打印本頁] 作者: magnify 時間: 2025-3-21 19:55
書目名稱Solder Joint Reliability Assessment影響因子(影響力)
作者: 緊張過度 時間: 2025-3-21 21:02
https://doi.org/10.1007/978-3-319-00092-3Ball Grid Array BGA; Cohesive Zone Model; Continuum Damage Model; Damage Mechanics; Fatigue Life Predict作者: anatomical 時間: 2025-3-22 02:26
978-3-319-34301-3Springer International Publishing Switzerland 2014作者: 繁重 時間: 2025-3-22 08:30
Solder Joint Reliability Assessment978-3-319-00092-3Series ISSN 1869-8433 Series E-ISSN 1869-8441 作者: 繼而發(fā)生 時間: 2025-3-22 10:19 作者: promote 時間: 2025-3-22 13:54 作者: concentrate 時間: 2025-3-22 18:00
Mechanics of Solder Materials,ess acting at every point in the material. The mechanical behavior of the material is represented using a stress–strain diagram. The diagram is obtained from tension test data on a sample of the material. Procedures for conducting a tension test on metallic materials are well documented in test standards such as ASTM-E8?[.] and ISO 6892 [.].作者: 駁船 時間: 2025-3-22 21:27 作者: Alienated 時間: 2025-3-23 03:55 作者: FECK 時間: 2025-3-23 06:32 作者: 高原 時間: 2025-3-23 10:19
Mohd N. Tamin,Norhashimah M. ShaffiarPresents a systematic approach in performing reliability assessment.Emphazises accurate quantitative assessment through basic understanding of the mechanics of materials.The presented simulation metho作者: 歡樂東方 時間: 2025-3-23 14:49 作者: 無法取消 時間: 2025-3-23 18:35
Overview of the Simulation Methodology,adequately summarizes the various aspects of simulation, including identification of the physical problem of interest, determination of material properties and behavior through mechanical testing, and formulations of governing equations for the finite element (FE) method.作者: 負擔 時間: 2025-3-24 00:38
Essentials for Finite Element Simulation, simulation process with respect to an illustrative problem in the assessment of solder joint reliability. The problem considers a surface mount microelectronic test assembly with a flip-chip package mounted on a Printed Circuit Board (PCB) using an array of solder joints.作者: 芭蕾舞女演員 時間: 2025-3-24 06:06
Mechanics of Solder Materials,ess acting at every point in the material. The mechanical behavior of the material is represented using a stress–strain diagram. The diagram is obtained from tension test data on a sample of the material. Procedures for conducting a tension test on metallic materials are well documented in test stan作者: Conspiracy 時間: 2025-3-24 09:51
Application I: Solder Joint Reflow Process, complete melting, wetting and flowing of the molted solder. During reflow cooling, the solder solidifies, making up the solder joint. Higher reflow temperature also activates a chemical reaction at the solder/pad interface, resulting in the formation of a thin intermetallic layer that improves the 作者: AWE 時間: 2025-3-24 11:18
Damage Mechanics-Based Models, It relates the externally applied load to internal states of the material, namely displacement, strain and stress, and their dependency on temperature and strain rate. The deformation and failure process of a material is a complex process involving nonlinear behavior and different mechanisms.作者: Connotation 時間: 2025-3-24 18:47 作者: Circumscribe 時間: 2025-3-24 22:12
Application IV: Fatigue Fracture Process of Solder Joints,) simulations of the test assembly with BGA solder joints subjected to cyclic flexural loading and torsional loading was described in Sects. 6.3 and 6.4, respectively. The simulations established stress-strain hysteresis behavior of the critical solder joint in the array. Phenomenological fatigue li作者: 者變 時間: 2025-3-25 02:02 作者: asthma 時間: 2025-3-25 03:20 作者: landfill 時間: 2025-3-25 09:54 作者: 軟膏 時間: 2025-3-25 14:30 作者: 破譯 時間: 2025-3-25 19:37 作者: 相信 時間: 2025-3-25 22:21
Mohd N. Tamin,Norhashimah M. Shaffiaroks which are appearing in this field. Why then now a manual on "Membrane Proteins"? The answer is multifold. The protocols which were distributes by the teachers and lecturers at the FEBS-SKMB Course organized in Bern appeared to be very useful not only during the Course to correctly perform the ex作者: ALLEY 時間: 2025-3-26 00:11 作者: Glycogen 時間: 2025-3-26 05:03
Mohd N. Tamin,Norhashimah M. Shaffiars provided by experts in the field.Features key tips and imp.Focusing on model systems for the study of structure, folding, and association in the membrane, .Membrane Proteins: Folding, Association, and Design. presents an overview of methods that can be applied to these intricate systems. The volum作者: 無價值 時間: 2025-3-26 12:19
Mohd N. Tamin,Norhashimah M. Shaffiars provided by experts in the field.Features key tips and imp.Focusing on model systems for the study of structure, folding, and association in the membrane, .Membrane Proteins: Folding, Association, and Design. presents an overview of methods that can be applied to these intricate systems. The volum作者: 坦白 時間: 2025-3-26 14:38 作者: cumber 時間: 2025-3-26 20:22 作者: LATHE 時間: 2025-3-26 22:00 作者: 神化怪物 時間: 2025-3-27 03:54 作者: 有節(jié)制 時間: 2025-3-27 09:09
Application I: Solder Joint Reflow Process,high reliability of the assembly. In this respect, finite element (FE) simulation with an appropriate model for the geometry of the assembly and suitable material models can be employed to describe the mechanics of the materials during the solder joint reflow cooling process.作者: 遭受 時間: 2025-3-27 13:26 作者: 割公牛膨脹 時間: 2025-3-27 16:22 作者: glamor 時間: 2025-3-27 18:19 作者: Prologue 時間: 2025-3-28 00:20
earch teams who study proteins, for example of human fluids, and who will certainly be interested in the application of new but simply described methods. At the same time we present the student with some more complicated physical techniques which are, however, simply described and easy to execute.作者: 同時發(fā)生 時間: 2025-3-28 03:10 作者: 來就得意 時間: 2025-3-28 08:48 作者: 揭穿真相 時間: 2025-3-28 12:11 作者: 機密 時間: 2025-3-28 16:32 作者: Creditee 時間: 2025-3-28 21:02 作者: CAND 時間: 2025-3-29 00:35
Mohd N. Tamin,Norhashimah M. Shaffiarg and avoiding known pitfalls..?.Authoritative and practical, .Membrane Proteins: Folding, Association, and Design. serves as an ideal guide for researchers reaching for the tantalizing possibility of designing novel membrane proteins with tailored functionality.978-1-4939-6021-7978-1-62703-583-5Series ISSN 1064-3745 Series E-ISSN 1940-6029
