標題: Titlebook: Silver Metallization; Stability and Reliab Daniel Adams,Terry L. Alford,James W. Mayer Book 2008 Springer-Verlag London 2008 Diffusion.PAS. [打印本頁] 作者: Grievous 時間: 2025-3-21 17:54
書目名稱Silver Metallization影響因子(影響力)
書目名稱Silver Metallization影響因子(影響力)學科排名
書目名稱Silver Metallization網(wǎng)絡公開度
書目名稱Silver Metallization網(wǎng)絡公開度學科排名
書目名稱Silver Metallization被引頻次
書目名稱Silver Metallization被引頻次學科排名
書目名稱Silver Metallization年度引用
書目名稱Silver Metallization年度引用學科排名
書目名稱Silver Metallization讀者反饋
書目名稱Silver Metallization讀者反饋學科排名
作者: 不給啤 時間: 2025-3-21 23:12
national comparisons of pupil performance: issues and policy’. It was arranged by two groups within the School of Education at the University, the newly formed Assessment and Evaluation Unit and the Centre for Studies in Science and Mathematics Education. Thejoint interest in international compariso作者: 滲入 時間: 2025-3-22 04:11 作者: assail 時間: 2025-3-22 06:57 作者: insecticide 時間: 2025-3-22 10:57
national comparisons of pupil performance: issues and policy’. It was arranged by two groups within the School of Education at the University, the newly formed Assessment and Evaluation Unit and the Centre for Studies in Science and Mathematics Education. Thejoint interest in international compariso作者: Noctambulant 時間: 2025-3-22 13:46
national comparisons of pupil performance: issues and policy’. It was arranged by two groups within the School of Education at the University, the newly formed Assessment and Evaluation Unit and the Centre for Studies in Science and Mathematics Education. Thejoint interest in international compariso作者: 內疚 時間: 2025-3-22 20:51
national comparisons of pupil performance: issues and policy’. It was arranged by two groups within the School of Education at the University, the newly formed Assessment and Evaluation Unit and the Centre for Studies in Science and Mathematics Education. Thejoint interest in international compariso作者: Ibd810 時間: 2025-3-22 21:16 作者: 山頂可休息 時間: 2025-3-23 03:22
ISA) in 2009. The system ranks as a ‘stunning success’ according to standards of the Organisation for Economic Co-operation and Development (OECD). Shanghai also stands out for having the world’s highest percentage of ‘resilient students’ – students from socio-economically disadvantaged backgrounds 作者: 跳動 時間: 2025-3-23 05:51
by inviting contributors from all over the world to a meeting the major aims of which were to promote an exploration of : - the theoretical foundations of international comparative studies of student performance; - the practical problems of carrying out such studies; - the appropriateness of the as作者: 身心疲憊 時間: 2025-3-23 12:18 作者: Albumin 時間: 2025-3-23 15:36
by inviting contributors from all over the world to a meeting the major aims of which were to promote an exploration of : - the theoretical foundations of international comparative studies of student performance; - the practical problems of carrying out such studies; - the appropriateness of the as作者: nonsensical 時間: 2025-3-23 22:02
by inviting contributors from all over the world to a meeting the major aims of which were to promote an exploration of : - the theoretical foundations of international comparative studies of student performance; - the practical problems of carrying out such studies; - the appropriateness of the as作者: 外面 時間: 2025-3-24 00:05
by inviting contributors from all over the world to a meeting the major aims of which were to promote an exploration of : - the theoretical foundations of international comparative studies of student performance; - the practical problems of carrying out such studies; - the appropriateness of the as作者: hypnogram 時間: 2025-3-24 05:30 作者: 不能仁慈 時間: 2025-3-24 09:20
by inviting contributors from all over the world to a meeting the major aims of which were to promote an exploration of : - the theoretical foundations of international comparative studies of student performance; - the practical problems of carrying out such studies; - the appropriateness of the as作者: HAUNT 時間: 2025-3-24 14:29
of scholarly research and analysis with the author’s unique personal insights, as evidenced by chapters entitled Education is Filling a Bucket and Lighting a Fire and Tiger Mothers, Dragon Children. Drawing on her experience as an education professional and a teacher of teachers, Charlene Tan thoro作者: DOSE 時間: 2025-3-24 17:24 作者: 撫慰 時間: 2025-3-24 20:26
1619-0181 ion and characterization of elemental silver thin films and silver-metal alloys; - formation of diffusion barriers and adhesion promoters; - evaluation of the thermal stability of silver under different anneali978-1-84996-705-1978-1-84800-027-8Series ISSN 1619-0181 Series E-ISSN 2365-0761 作者: OGLE 時間: 2025-3-25 01:29
Book 2008lity issues associated with silver metallization. Readers will learn about the: - preparation and characterization of elemental silver thin films and silver-metal alloys; - formation of diffusion barriers and adhesion promoters; - evaluation of the thermal stability of silver under different anneali作者: Barrister 時間: 2025-3-25 05:32
Thermal Stability,istivity can reduce the . delays and high power consumption. Also, silver has higher electromigration resistance than aluminum and the same or even higher electromigration resistance than copper. However, Ag thin film agglomeration has been observed on many substrates at high temperatures and considered as a drawback of silver metallization.作者: 敬禮 時間: 2025-3-25 09:05
Introduction,resistivity lower than the currently used Al(Cu) alloy [.]. As a result, higher current densities can be imposed on the metal lines and faster switching speeds can be achieved, due to the lower RC time delay [.].作者: lattice 時間: 2025-3-25 13:57
Diffusion Barriers and Self-encapsulation,ors have investigated the behavior of Ag on SiO./Si substrates [.],[.]. The addition of a thin Au layer between the Ag and Si was found to improve the stability of the interface by forming an intermixed region, resulting in a lowering of the interfacial energy of the Ag/Si system [.].作者: Osteoarthritis 時間: 2025-3-25 16:27 作者: Nucleate 時間: 2025-3-25 21:31 作者: cochlea 時間: 2025-3-26 03:18
Introduction,e development of advanced ultra large scale integration (ULSI) and gigascale integration (GSI) technologies will place stringent demands on future interconnect and metallization schemes [.]. To decrease the resistance-capacitance (RC) signal delays, the circuit can be fabricated with a metal having 作者: 變量 時間: 2025-3-26 08:00
Silver Thin Film Characterization,erization is the instrumentations that use X-ray and ion beams to probe the properties of the film. This work discusses two techniques in thin film analysis, Rutherford backscattering spectrometry (RBS) [.],[.] and X-ray diffractrometry (XRD) [.]作者: RODE 時間: 2025-3-26 09:59
Diffusion Barriers and Self-encapsulation,vice reliability. The application of silver in multilevel metallization schemes require thermal stability when in contact with other metal layers and dielectrics. Therefore, developing a suitable diffusion barrier to retard the diffusion of Ag into adjacent materials and to prevent agglomeration is 作者: Mnemonics 時間: 2025-3-26 15:43 作者: 輪流 時間: 2025-3-26 17:54 作者: 外向者 時間: 2025-3-27 00:27 作者: 墻壁 時間: 2025-3-27 04:09 作者: duplicate 時間: 2025-3-27 06:03
Silver Electromigration Resistance,trend to replace Al(Cu) with Cu is becoming apparent for ultra large scale integration (ULSI) applications. Ag, as the most conductive metal, has also drawn attention as an interconnect material for some potential applications in ULSI [.],[.]. Ag has some advantage over Cu in terms of the conductivity.作者: pus840 時間: 2025-3-27 12:50
1619-0181 nterconnect material for integrated circuit technology.Valua.Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been condu作者: Hypomania 時間: 2025-3-27 15:57
978-1-84996-705-1Springer-Verlag London 2008作者: 裹住 時間: 2025-3-27 19:48
Silver Metallization978-1-84800-027-8Series ISSN 1619-0181 Series E-ISSN 2365-0761 作者: 滑動 時間: 2025-3-27 23:31
Daniel Adams,Terry L. Alford,James W. MayerFirst book to discuss current knowledge of silver metallization and its potential as a favourable candidate for implementation as a future interconnect material for integrated circuit technology.Valua作者: Exploit 時間: 2025-3-28 02:35
Silver Thin Film Characterization,erization is the instrumentations that use X-ray and ion beams to probe the properties of the film. This work discusses two techniques in thin film analysis, Rutherford backscattering spectrometry (RBS) [.],[.] and X-ray diffractrometry (XRD) [.]作者: Pituitary-Gland 時間: 2025-3-28 09:27
Summary,ermal stability is covered. During Ti and Al transport to form the encapsulating layers, the Ag films develop <111> texture. Integration with low-K dielectrics such as paralene has been demonstrated. Encapsulated Ag films have superior resistance to electromigration degradation.作者: myalgia 時間: 2025-3-28 11:12 作者: Abjure 時間: 2025-3-28 17:20
https://doi.org/10.1007/978-1-84800-027-8Diffusion; PAS; integrated circuit; metal; static-induction transistor; thin films
