標題: Titlebook: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec; Jie Cheng Book 2018 Springer Nature [打印本頁] 作者: 小缺點 時間: 2025-3-21 19:38
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec影響因子(影響力)
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec影響因子(影響力)學科排名
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec網絡公開度
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec網絡公開度學科排名
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec被引頻次
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec被引頻次學科排名
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書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec年度引用學科排名
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec讀者反饋
書目名稱Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec讀者反饋學科排名
作者: consolidate 時間: 2025-3-21 22:27 作者: promote 時間: 2025-3-22 04:10
Conclusions and Recommendations,The thesis presents a systematic research work of the chemical mechanical polishing (CMP) of Ru as a novel diffusion barrier layer for sub-14?nm technology node of the integrated circuit.作者: Alopecia-Areata 時間: 2025-3-22 05:53 作者: 預感 時間: 2025-3-22 12:32 作者: infinite 時間: 2025-3-22 16:42
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec978-981-10-6165-3Series ISSN 2190-5053 Series E-ISSN 2190-5061 作者: paradigm 時間: 2025-3-22 18:52
Introduction,Cu interconnects. It introduces the current situation of sub-14?nm technology node, the CMP technology, and the polishing of Ru as barrier layer material. The difficulties and challenges of Ru CMP are proposed based on the aforementioned discussion. The main research methods and experimental results of the thesis are shown in the last part.作者: Glycogen 時間: 2025-3-22 23:25
Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-Based Slof the material removal rate of Cu to Ru can be evidently improved in the presence of BTA and K.MoO.. The increase of oxidizer content and the reduction of polishing down force could help to further decrease the material removal rate selectivity between Cu and Ru.作者: hereditary 時間: 2025-3-23 02:41 作者: RUPT 時間: 2025-3-23 08:39
2190-5053 corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research..978-981-13-5585-1978-981-10-6165-3Series ISSN 2190-5053 Series E-ISSN 2190-5061 作者: 注意力集中 時間: 2025-3-23 11:03 作者: Agnosia 時間: 2025-3-23 17:00 作者: archaeology 時間: 2025-3-23 20:19 作者: 后天習得 時間: 2025-3-23 23:59
Jie Chengthe statistical foundation of the GEE approach using more general estimation techniques. The book could therefore be used as basis for a course to graduate students in statistics, biostatistics, or econometrics, and will be useful to practitioners in the same fields..978-1-4614-0498-9978-1-4614-0499-6Series ISSN 0930-0325 Series E-ISSN 2197-7186 作者: Chronic 時間: 2025-3-24 03:53
Jie Chengthe statistical foundation of the GEE approach using more general estimation techniques. The book could therefore be used as basis for a course to graduate students in statistics, biostatistics, or econometrics, and will be useful to practitioners in the same fields..978-1-4614-0498-9978-1-4614-0499-6Series ISSN 0930-0325 Series E-ISSN 2197-7186 作者: 獨白 時間: 2025-3-24 09:04 作者: mitten 時間: 2025-3-24 10:43
Jie Chengthe statistical foundation of the GEE approach using more general estimation techniques. The book could therefore be used as basis for a course to graduate students in statistics, biostatistics, or econometrics, and will be useful to practitioners in the same fields..978-1-4614-0498-9978-1-4614-0499-6Series ISSN 0930-0325 Series E-ISSN 2197-7186 作者: 飛來飛去真休 時間: 2025-3-24 18:16 作者: TRUST 時間: 2025-3-24 19:28
Jie Chengthe statistical foundation of the GEE approach using more general estimation techniques. The book could therefore be used as basis for a course to graduate students in statistics, biostatistics, or econometrics, and will be useful to practitioners in the same fields..978-1-4614-0498-9978-1-4614-0499-6Series ISSN 0930-0325 Series E-ISSN 2197-7186 作者: labyrinth 時間: 2025-3-25 01:02 作者: 情愛 時間: 2025-3-25 05:45
Material Removal Mechanism of Cu in KIO4-Based Slurry, proposed based on the chemical-mechanical synergism theory. The results show that the Cu surface films formed in the slurry are complex and vary considerably as a function of the solution pH. Based on the surface film analysis and CMP experimental results, it can be concluded that the controlling f作者: mechanical 時間: 2025-3-25 09:17
Material Removal Mechanism of Ru in KIO4-Based Slurry, be divided into two parts: the direct dissolution of Ru and the passivation of the surface. The surface chemistry, corrosion and passivation properties of Ru were investigated. On the basis, the CMP and CMP-electrochemical experiments were conducted to fully investigate the underlying mechanism of 作者: 有幫助 時間: 2025-3-25 13:18 作者: Embolic-Stroke 時間: 2025-3-25 18:05 作者: 積習難改 時間: 2025-3-25 22:33
Galvanic Corrosion Inhibitors for Cu/Ru Couple During Chemical Mechanical Polishing of Ru,the oxidant in the polishing slurry. This chapter focuses on the investigation of galvanic corrosion inhibitors (BTA and 1, 2, 4-triazole) for Cu/Ru couple in the KIO.-based solutions. The galvanic corrosion current of Cu was directly measured, and the corrosion inhibition efficiencies (.) were calc作者: 看法等 時間: 2025-3-26 02:44 作者: flourish 時間: 2025-3-26 05:19 作者: cumulative 時間: 2025-3-26 10:19 作者: 熱情的我 時間: 2025-3-26 12:50 作者: invade 時間: 2025-3-26 20:31 作者: CANDY 時間: 2025-3-26 22:30 作者: 小畫像 時間: 2025-3-27 03:22
Material Removal Mechanism of Cu in KIO4-Based Slurry,actor during Cu CMP in a KIO.-based slurry is the chemical-mechanical synergistic effect. A high MRR and ideal surface quality could be obtained when abrasion-enhanced corrosion and corrosion-enhanced abrasion effects are high and balanced. Therefore, the weak alkaline slurries are the ideal polishing slurry during the P3 stage of Cu polishing.作者: RLS898 時間: 2025-3-27 08:09 作者: 寒冷 時間: 2025-3-27 12:54 作者: GNAW 時間: 2025-3-27 13:42 作者: 進步 時間: 2025-3-27 17:51 作者: 感情 時間: 2025-3-27 22:31
Jie Chengk, they are derived in a unified way using pseudo maximum li.Generalized estimating equations have become increasingly popular in biometrical, econometrical, and psychometrical applications because they overcome the classical assumptions of statistics, i.e. independence and normality, which are too 作者: decode 時間: 2025-3-28 03:38
Jie Chengk, they are derived in a unified way using pseudo maximum li.Generalized estimating equations have become increasingly popular in biometrical, econometrical, and psychometrical applications because they overcome the classical assumptions of statistics, i.e. independence and normality, which are too 作者: paroxysm 時間: 2025-3-28 08:15
Jie Chengk, they are derived in a unified way using pseudo maximum li.Generalized estimating equations have become increasingly popular in biometrical, econometrical, and psychometrical applications because they overcome the classical assumptions of statistics, i.e. independence and normality, which are too 作者: grandiose 時間: 2025-3-28 11:16
Jie Chengk, they are derived in a unified way using pseudo maximum li.Generalized estimating equations have become increasingly popular in biometrical, econometrical, and psychometrical applications because they overcome the classical assumptions of statistics, i.e. independence and normality, which are too 作者: nurture 時間: 2025-3-28 15:12 作者: Conducive 時間: 2025-3-28 21:41
