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標(biāo)題: Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010 [打印本頁]

作者: GLOAT    時(shí)間: 2025-3-21 18:26
書目名稱Reliability Physics and Engineering影響因子(影響力)




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書目名稱Reliability Physics and Engineering網(wǎng)絡(luò)公開度




書目名稱Reliability Physics and Engineering網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Reliability Physics and Engineering被引頻次




書目名稱Reliability Physics and Engineering被引頻次學(xué)科排名




書目名稱Reliability Physics and Engineering年度引用




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書目名稱Reliability Physics and Engineering讀者反饋




書目名稱Reliability Physics and Engineering讀者反饋學(xué)科排名





作者: COUCH    時(shí)間: 2025-3-21 23:11

作者: 不幸的人    時(shí)間: 2025-3-22 02:43
Increasing the Reliability of Device/Product Designs,Design engineers are continually asked reliability questions such as: (1) . Often the designer will attempt to answer these questions by stating a . which was used for a design
作者: extinguish    時(shí)間: 2025-3-22 07:23
J.W. McPhersonProvides basic Reliability Physics and Engineering tools for Electrical Engineers, Mechanical Engineers, Materials Scientists, and Applied Physicists to build better products.Includes information for
作者: 拔出    時(shí)間: 2025-3-22 11:44

作者: minimal    時(shí)間: 2025-3-22 13:43

作者: 取之不竭    時(shí)間: 2025-3-22 19:20
Failure Rate Modeling, expected failure rate will be an important indicator of future warranty liability. For the customer, the expected failure rate will be an important indicator of future satisfaction. For . applications, it is of paramount importance for one to know that the expected failure rate will be extremely low.
作者: Pudendal-Nerve    時(shí)間: 2025-3-22 23:47
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作者: Immortal    時(shí)間: 2025-3-23 04:43
https://doi.org/10.1007/978-1-4419-6348-2Burnin and Defect Elimination; Failure Rate Reduction; Time-To; Time-To-Failure Modeling; design; develop
作者: Diastole    時(shí)間: 2025-3-23 05:41
J.W. McPhersonThe main result is that for small values of Ac, defined as the (experimentally controllable) jump in mole fraction of solute at the triple junction, the growth velocity of the trailing grain is approximately proportional to (Ac)., but for large positive Ac the velocity is approximately proportional
作者: 詳細(xì)目錄    時(shí)間: 2025-3-23 10:08

作者: CANDY    時(shí)間: 2025-3-23 14:41

作者: 慢慢沖刷    時(shí)間: 2025-3-23 19:54

作者: 弄皺    時(shí)間: 2025-3-23 23:13

作者: 冷漠    時(shí)間: 2025-3-24 05:57
J.W. McPherson to these other cases..All the models discussed in this volume have an interest in problems arising in several research fields such as heat conduction, queuing theory, propagation of fire, interface dynamics, population dynamics, evolution of biological systems with selection mechanisms..In general
作者: Arbitrary    時(shí)間: 2025-3-24 10:26

作者: Infusion    時(shí)間: 2025-3-24 11:30
J.W. McPhersonphase transition (the Stefan problem with a Gibbs-Thomson interface condition) may be found in [3]. It is the purpose of this paper to illustrate that the same formalism can be applied to solve a class of free boundary problems where the boundary condition involves a functional of the whole free bou
作者: 殺死    時(shí)間: 2025-3-24 18:00
J.W. McPhersonphase transition (the Stefan problem with a Gibbs-Thomson interface condition) may be found in [3]. It is the purpose of this paper to illustrate that the same formalism can be applied to solve a class of free boundary problems where the boundary condition involves a functional of the whole free bou
作者: 攤位    時(shí)間: 2025-3-24 19:45
Textbook 20101st editionvoltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop
作者: Monocle    時(shí)間: 2025-3-25 01:25

作者: 有危險(xiǎn)    時(shí)間: 2025-3-25 07:19

作者: plasma    時(shí)間: 2025-3-25 10:29

作者: intelligible    時(shí)間: 2025-3-25 13:15

作者: 壯麗的去    時(shí)間: 2025-3-25 18:11
J.W. McPhersontical analyses, a system of numerical solutions is formulated by special curve-fitting approaches for simple and reliable predictions of heat and mass transfer and hydrodynamics. In view of a shortage of experimental results for velocity field of free convec978-3-642-06710-5978-3-540-29128-2
作者: 有限    時(shí)間: 2025-3-25 22:51

作者: Grandstand    時(shí)間: 2025-3-26 01:33

作者: 敲詐    時(shí)間: 2025-3-26 07:36

作者: Generic-Drug    時(shí)間: 2025-3-26 12:01

作者: 草率女    時(shí)間: 2025-3-26 15:42
Ramp-to-Failure Testing,sacrifice materials/devices), it is generally much more rapid than conventional constant-stress time-to-failure tests. The relative quickness of the test also enables the gathering of more data and thus the gathering of better statistics.
作者: 主動(dòng)    時(shí)間: 2025-3-26 18:09
Introduction,ut). Materials degradation and eventual . are the subjects of .. . is normally associated with understanding the . of failure mechanisms. . is usually associated with establishing: proper ., robust . criteria, and good . for reliable device fabrication and use.
作者: invade    時(shí)間: 2025-3-26 23:57
Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering,th of the materials. Important crystalline defects such as vacancies, dislocations, and grain boundaries are discussed. These crystalline defects can play critically important roles as time-to-failure models are developed for: creep, fatigue, crack propagation, thermal expansion mismatch, corrosion and stress-corrosion cracking.
作者: Flu表流動(dòng)    時(shí)間: 2025-3-27 03:42

作者: Lipoprotein    時(shí)間: 2025-3-27 08:28
Textbook 20101st editioneering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product las
作者: Minatory    時(shí)間: 2025-3-27 10:05

作者: Ophthalmologist    時(shí)間: 2025-3-27 17:40

作者: 種族被根除    時(shí)間: 2025-3-27 19:28

作者: 統(tǒng)治人類    時(shí)間: 2025-3-27 23:00

作者: arthroplasty    時(shí)間: 2025-3-28 05:14
Introduction, automobile tires) are fabricated from materials that will tend to degrade with time. The . will continue until some critical device parameter can no longer meet the required specification for proper device functionality. At this point, one usually says: the device has failed. This failure could be
作者: 進(jìn)入    時(shí)間: 2025-3-28 09:42
Materials and Device Degradation,idence for degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. The finish on a new automobile will oxidize with time. The tight tolerances associated with finely meshed gears will deteriorate with time. The critical parameters associate
作者: 薄荷醇    時(shí)間: 2025-3-28 11:29
From Material/Device Degradation to Time-To-Failure,thods were presented in Chapter 2 which can be used for modeling the time-dependence of degradation. The question that we would like to address in this chapter is --- .? The time-to-failure equations are critically important, for device failure-mechanisms, and will be the focus of the remaining chap
作者: BLANK    時(shí)間: 2025-3-28 15:19

作者: 倔強(qiáng)一點(diǎn)    時(shí)間: 2025-3-28 20:43

作者: Compass    時(shí)間: 2025-3-29 00:54

作者: TIA742    時(shí)間: 2025-3-29 04:48

作者: 樣式    時(shí)間: 2025-3-29 08:06

作者: watertight,    時(shí)間: 2025-3-29 12:47

作者: finite    時(shí)間: 2025-3-29 15:44

作者: 新星    時(shí)間: 2025-3-29 23:38
Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering,which might form. A molecular model is presented so that primary bond formation mechanisms (. and .) can be better understood. How these bonds form and respond to mechanical-stress/loading is very important for engineering applications. A discussion of elasticity, plasticity and bond breakage is pre
作者: 評(píng)論性    時(shí)間: 2025-3-30 02:50

作者: committed    時(shí)間: 2025-3-30 06:15
J.W. McPhersonsion-induced motion of: a grain boundary, the surfaces of the two grains, and the triple junction where they all meet. One of the equations models diffusion along the moving grain boundary; another models the force balance which determines its speed. The remaining two equations model diffusion in th
作者: 飛來飛去真休    時(shí)間: 2025-3-30 10:21

作者: recede    時(shí)間: 2025-3-30 12:30

作者: pacifist    時(shí)間: 2025-3-30 18:50





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