標(biāo)題: Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito [打印本頁(yè)] 作者: informed 時(shí)間: 2025-3-21 18:49
書(shū)目名稱Recent Progress in Lead-Free Solder Technology影響因子(影響力)
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書(shū)目名稱Recent Progress in Lead-Free Solder Technology被引頻次
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書(shū)目名稱Recent Progress in Lead-Free Solder Technology讀者反饋
書(shū)目名稱Recent Progress in Lead-Free Solder Technology讀者反饋學(xué)科排名
作者: 易彎曲 時(shí)間: 2025-3-21 21:42
Tin Whiskers Growth in Electronic Assemblieswth is induced by the relaxation of the compressive stress in the tin layer. Besides, the driving force for whisker growth increases with the temperature (<150?°C). Yet, annealing at 150?°C could reduce the whisker growth because grain coarsening reduces the inner compressive stress.作者: 整潔漂亮 時(shí)間: 2025-3-22 02:54 作者: 表狀態(tài) 時(shí)間: 2025-3-22 07:41
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Soldersain parameters and setup, and latest developments on the surface-modified ceramic-reinforced composite lead-free solders. Finally, the chapter also summarised and discussed the advantages, current trends, and significant findings in this field.作者: 開(kāi)花期女 時(shí)間: 2025-3-22 12:41 作者: 過(guò)分 時(shí)間: 2025-3-22 14:31 作者: 社團(tuán) 時(shí)間: 2025-3-22 18:13 作者: Generalize 時(shí)間: 2025-3-22 21:39
Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder current electronics packaging desired performances. One of the leading choices in upgrading the existing lead-free alloys is by ceramic composite technology approach. The addition of ceramic particles into lead-free solder has altered and subsequently improved monolithic solder’s microstructural, p作者: 額外的事 時(shí)間: 2025-3-23 04:57 作者: Aviary 時(shí)間: 2025-3-23 06:58
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders solders. It is commonly known that composite solders experienced significant aggregation and non-wetting issues between the ceramic reinforcements and solder matrix, which makes the addition of the reinforcement phase inefficient in improving the properties of lead-free solders. Surface modificatio作者: accrete 時(shí)間: 2025-3-23 11:40 作者: 很像弓] 時(shí)間: 2025-3-23 14:10
Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder P an enhanced joining technique and reliable soldering material for the tiny solder junction. However, sophisticated assembly procedures for tiny components using nano-reinforced solder paste on real surface mount devices continue to be a significant research gap. Thus, the purpose of this work is to作者: 男學(xué)院 時(shí)間: 2025-3-23 18:11
Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bion behavior of Sn–0.7Cu (SC07) lead-free solder alloy are presented. The addition of Fe and Bi to the SC07 alloy leads to significant changes in the microstructure and chemical state of tin. The minor addition of Fe to binary SC07 alloys leads to the formation of an intermetallic FeSn. compound with作者: 叢林 時(shí)間: 2025-3-24 00:50
The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experime. The surface finishes selected in this study are electroless nickel immersion gold (ENIG) and hot air solder levelling (HASL). The Pb-free solder ball used is SAC-x Ni (x?=?0.5 wt.% and x?=?1.0 wt.%) with a diameter of 500?μm. All the samples were subjected to the isothermal ageing process. The int作者: 浮雕 時(shí)間: 2025-3-24 05:50 作者: 嘲弄 時(shí)間: 2025-3-24 09:53
Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compounnnections for the circuit’s functionality. Various types of surface finishes are often applied onto the Cu pad of the PCB to protect the Cu pad prior to the soldering process. Furthermore, the application of surface finishes is to ensure good solderability. An intermetallic compound (IMC) layer form作者: enfeeble 時(shí)間: 2025-3-24 12:26
Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of nducted whereby the excessive growth of IMC could lead to solder joint failure. Thus, many attempts have been made to determine the actual IMC thickness. Average values of IMC thickness are always used to represent the IMC layer. However, precise, and true representation of the IMC layer growth in t作者: HPA533 時(shí)間: 2025-3-24 15:24 作者: Interlocking 時(shí)間: 2025-3-24 21:02
Reliability Analysis on the Flexible Printed Circuit Board After Reflow Solderingsues in the manufacturing assembly process. This chapter details a reliability study to verify the solder joint bonding capability between the FPCB and BGA packages to withstand the pulling out load. The results revealed that the fracture mode on the FPCB occurred between the interface of the copper作者: 漂亮才會(huì)豪華 時(shí)間: 2025-3-25 00:22 作者: Ballad 時(shí)間: 2025-3-25 06:47 作者: theta-waves 時(shí)間: 2025-3-25 08:30 作者: Campaign 時(shí)間: 2025-3-25 12:17 作者: A簡(jiǎn)潔的 時(shí)間: 2025-3-25 18:00 作者: 草率男 時(shí)間: 2025-3-25 20:38 作者: 時(shí)代錯(cuò)誤 時(shí)間: 2025-3-26 03:09 作者: 使迷醉 時(shí)間: 2025-3-26 05:46 作者: Contend 時(shí)間: 2025-3-26 09:29
ns across complexes or pathways. Finally, we discuss how these evolutionary observations are being used to interpret cross-species chemical-genetic studies and how they might shape therapeutic strategies. Together, these interaction networks offer us an unprecedented level of detail into how genotyp作者: JUST 時(shí)間: 2025-3-26 14:46
Norainiza Saud,Mohd Arif Anuar Mohd Salleh,Rita Mohd Said,Flora Somidin,Nur Syahirah Mohamad Zaimi,Mcting these synthetic systems to experimental laboratory evolution provides a mechanistic understanding on important evolutionary questions, such as: Why did particular regulatory network topologies evolve and not others? What happens if we rewire regulatory networks? Could an expanded genetic code 作者: 愉快么 時(shí)間: 2025-3-26 19:15
Mohd Mustafa Al Bakri Abdullah,Mohd Arif Anuar Mohd Salleh,Nur Nadiah Izzati Zulkifli,Nur Syahirah Mcting these synthetic systems to experimental laboratory evolution provides a mechanistic understanding on important evolutionary questions, such as: Why did particular regulatory network topologies evolve and not others? What happens if we rewire regulatory networks? Could an expanded genetic code 作者: AMOR 時(shí)間: 2025-3-26 21:30
in particular, his founding of the Institute of Evolution in the University of Haifa and now the pending establishment of the International Graduate School of Evolution. The research program of Eibi Nevo, in collaboration with numerous colleagues and students in Israel and across the world, encompasses divers978-90-481-6457-8978-94-017-0443-4作者: 存在主義 時(shí)間: 2025-3-27 04:41 作者: IDEAS 時(shí)間: 2025-3-27 05:27 作者: aspect 時(shí)間: 2025-3-27 09:31
the order Cantharellales. 4) Proof of evolutionary advancement of brown-rot fungi; considerable devaluation of the type of rot as a character in taxonomy Basidiomycetes. 5) Proof of secondary origins of corticioid and gasteroid forms. Any phylogenetic reconstruction of Homobasidiomycetes phylogeny s作者: 不能根除 時(shí)間: 2025-3-27 17:19
F. Muhamad Razizy,N. Zhen Zhang,M. S. Hashim,O. Saliza Azlina,O. Shahrul Azmirin particular, his founding of the Institute of Evolution in the University of Haifa and now the pending establishment of the International Graduate School of Evolution. The research program of Eibi Nevo, in collaboration with numerous colleagues and students in Israel and across the world, encompasses divers978-90-481-6457-8978-94-017-0443-4作者: BINGE 時(shí)間: 2025-3-27 18:03 作者: ANNUL 時(shí)間: 2025-3-27 23:52 作者: 構(gòu)成 時(shí)間: 2025-3-28 03:15
M. A. Bakar,A. Jalar,A. Atiqah,N. Ismailtion of populations and their interrelationships. HLA distribution data have made major contributions, for example, to theories of the migration of early farmers across Europe. The selective basis for the generation and maintenance of the HLA polymorphism almost certainly lies in the importance of i作者: sorbitol 時(shí)間: 2025-3-28 09:10 作者: Adenocarcinoma 時(shí)間: 2025-3-28 10:44
Muhammad Iqbal Ahmad,Mohd Sharizal Abdul Aziz,C. Y. Khor backgrounds and fundamental philosophical questions such as the paradoxical problem of change, existence and creation. He introduces the scientists involved, their research results and theories, and discusses the evolution of evolutionary theory against the background of Creationism and Intelligent Design.978-3-642-44356-5978-3-642-14896-5作者: 嚴(yán)峻考驗(yàn) 時(shí)間: 2025-3-28 18:36 作者: Cardioplegia 時(shí)間: 2025-3-28 21:26 作者: burnish 時(shí)間: 2025-3-29 00:05
Development of Geopolymer Ceramic-Reinforced Solder used in applications such as solid-state batteries and electrochemical sensors. The chapter encapsulates the properties of geopolymer ceramics as a reinforcement material in solder application. It also includes a discussion and examples of the geopolymer ceramic synthesis and fabrication. The advan作者: 認(rèn)識(shí) 時(shí)間: 2025-3-29 05:26 作者: 商談 時(shí)間: 2025-3-29 07:14 作者: Immunization 時(shí)間: 2025-3-29 14:50
The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimeion analysis. These two analyses successfully simulate the thermal distribution on the PCB package. The total deformation and equivalent stress of the PCB package were yet to be determined. It can be observed that the equivalent stress decreased when the isothermal ageing duration was getting longer作者: ventilate 時(shí)間: 2025-3-29 18:13
Solder Paste’s Rheology Data for Stencil Printing Numerical Investigationsne plate design. The distance between two parallel plates can be manipulated accordingly which affects the usage of parallel plate design. Only the top spindle can be modified to adjust the angle of the top plate when using a cone plate design. The specific spindle type selected depends on the spind作者: GEST 時(shí)間: 2025-3-29 22:04
2364-3293 cs (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.978-3-030-93443-9978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307 作者: 事先無(wú)準(zhǔn)備 時(shí)間: 2025-3-30 02:49
Leong Wai Keong,Ahmad Azmin Mohamad,Muhammad Firdaus Mohd Nazeri作者: 蟄伏 時(shí)間: 2025-3-30 06:56
Mohd Sharizal Abdul Aziz,I. N. Sahrudin,M. S. Rusdi,M. H. H. Ishak,C. Y. Khor,Mohd Arif Anuar Mohd S作者: integrated 時(shí)間: 2025-3-30 10:46 作者: 翅膀拍動(dòng) 時(shí)間: 2025-3-30 13:07 作者: 南極 時(shí)間: 2025-3-30 19:18 作者: 艦旗 時(shí)間: 2025-3-31 00:21 作者: Aids209 時(shí)間: 2025-3-31 02:34
978-3-030-93443-9The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl作者: 外觀 時(shí)間: 2025-3-31 08:44
Recent Progress in Lead-Free Solder Technology978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307 作者: 不給啤 時(shí)間: 2025-3-31 09:34 作者: FEAS 時(shí)間: 2025-3-31 17:11
