標(biāo)題: Titlebook: RF and Microwave Microelectronics Packaging; Ken Kuang,Franklin Kim,Sean S. Cahill Book 2010 Springer-Verlag US 2010 3D packaging.RF and m [打印本頁] 作者: sesamoiditis 時(shí)間: 2025-3-21 19:06
書目名稱RF and Microwave Microelectronics Packaging影響因子(影響力)
書目名稱RF and Microwave Microelectronics Packaging影響因子(影響力)學(xué)科排名
書目名稱RF and Microwave Microelectronics Packaging網(wǎng)絡(luò)公開度
書目名稱RF and Microwave Microelectronics Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱RF and Microwave Microelectronics Packaging被引頻次
書目名稱RF and Microwave Microelectronics Packaging被引頻次學(xué)科排名
書目名稱RF and Microwave Microelectronics Packaging年度引用
書目名稱RF and Microwave Microelectronics Packaging年度引用學(xué)科排名
書目名稱RF and Microwave Microelectronics Packaging讀者反饋
書目名稱RF and Microwave Microelectronics Packaging讀者反饋學(xué)科排名
作者: 善于 時(shí)間: 2025-3-21 22:12
Rick Sturdivanttrons traveling through so-called electron lenses, deflection systems, and so on. Instead of considering the shape of the electron trajectories, or ray paths, as caused directly by accelerations due to electric and magnetic forces, the trajectories may be imagined to be the result of refractions of 作者: GENUS 時(shí)間: 2025-3-22 01:28 作者: 反復(fù)無常 時(shí)間: 2025-3-22 04:46
Yiin-Kuen Fuh,Firas Sammoura,Yingqi Jiang,Liwei Lintrons traveling through so-called electron lenses, deflection systems, and so on. Instead of considering the shape of the electron trajectories, or ray paths, as caused directly by accelerations due to electric and magnetic forces, the trajectories may be imagined to be the result of refractions of 作者: 騎師 時(shí)間: 2025-3-22 11:52 作者: 消散 時(shí)間: 2025-3-22 13:00
Mark P. McGrath,Kunia Aihara,Morgan J. Chen,Cheng Chen,Anh-Vu Phamor EBWD investigations was given at the beginning of this chapter. Following that, characteristics, technical requirements and manufacturing methods of feeding wires used for EBWD technology are proposed and discussed. After that, the main technical features of typical EBWD deposits, namely burn los作者: 母豬 時(shí)間: 2025-3-22 19:16 作者: moratorium 時(shí)間: 2025-3-23 00:44 作者: cyanosis 時(shí)間: 2025-3-23 04:51
Jerry Aguirreaniguchi Foundation. The need is now greater than ever for Japan to consider how to strengthen and foster international understanding between nations, peoples and societies, and how to contribute towards the establishment of peace and prosperity in the world. For more than twenty years, I have been 作者: Concomitant 時(shí)間: 2025-3-23 07:08
Jian Yang,Ziliang Wangoundation. The need is now greater than ever for Japan to consider how to strengthen and foster international understanding between nations, peoples and societies, and how to contribute towards the establishment of peace and prosperity in the world. For more than twenty years, I have been supporting作者: 可能性 時(shí)間: 2025-3-23 11:32
Juan L. Sepulveda,Lee J. Vandermarks is because their electrical and magnetic properties show a variety, depending on the constituent elements. Among them, MnSi has been studied most extensively and revealed to be a helical magnet whose Néel temperature T. is 29 K [4]. According to the neutron diffraction experiments performed by ISH作者: 能夠支付 時(shí)間: 2025-3-23 16:38
Jiang Guosheng,Ken Kuang,Danny Zhuteful to Professors A. Baldereschi, R. Car, and A. Quattropani for making these visits possible, and for the splendidly stimulating environment provided. Professors S. Baroni and R. Resta also influenced considerably the presentation of material by constructive help and comments. Most importantly, C作者: 免費(fèi) 時(shí)間: 2025-3-23 20:16
Zhang Hao,Cui Song,Liu Junyongemperature; namely; configuration interaction (CI) and many-body perturbation theory. The second of these approaches applied to molecules has been dealt with in the review by Wilson (1981). Therefore that ground will not be covered in this chapter. However, there has been much progress using the so-作者: Adornment 時(shí)間: 2025-3-23 23:38 作者: Spirometry 時(shí)間: 2025-3-24 02:42
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages,cations to enter the world of high-speed PCB assembly, significantly driving down the cost of high-frequency RF subsystems. Process technology, I/O performance, active device performance, PCB board material selection and test protocol will all be discussed.作者: canvass 時(shí)間: 2025-3-24 10:07 作者: Embolic-Stroke 時(shí)間: 2025-3-24 11:16
RF/Microwave Substrate Packaging Roadmap for Portable Devices, new environmental regulations like ROHS, WEEE and REACH take effect, the necessary cost and performance tradeoffs have to be made to stay competitive in the global market..This chapter discusses the material properties of various substrates and options to meet packaging density and performance need作者: 防御 時(shí)間: 2025-3-24 15:02 作者: 野蠻 時(shí)間: 2025-3-24 19:13 作者: Noisome 時(shí)間: 2025-3-24 23:44
trajectories can thus be obtained by applying the laws of geometric optical image projection. We then require a knowledge of only the positions of the principal planes of the electron lens and the corresponding focal lengths to describe the effect of the lens, rather than needing to have a complete作者: 不發(fā)音 時(shí)間: 2025-3-25 05:11 作者: affect 時(shí)間: 2025-3-25 09:37
Eric A. Sanjuan,Sean S. Cahill trajectories can thus be obtained by applying the laws of geometric optical image projection. We then require a knowledge of only the positions of the principal planes of the electron lens and the corresponding focal lengths to describe the effect of the lens, rather than needing to have a complete作者: phase-2-enzyme 時(shí)間: 2025-3-25 15:27 作者: paradigm 時(shí)間: 2025-3-25 17:54
Edward B. Stoneham trajectories can thus be obtained by applying the laws of geometric optical image projection. We then require a knowledge of only the positions of the principal planes of the electron lens and the corresponding focal lengths to describe the effect of the lens, rather than needing to have a complete作者: Glower 時(shí)間: 2025-3-25 23:27 作者: 寵愛 時(shí)間: 2025-3-26 02:53 作者: fibula 時(shí)間: 2025-3-26 07:14
Thomas Bartnitzek,William Gautier,Guangwen Qu,Shi Cheng,Afshin ZiaeiTaniguchi Foundation only a few years ago through additional funding. In order to effectively translate the objectives of the Foundation into action with the funds available, it becomes necessary to select those fields which are not necessarily in the limelight of popular interest, which means those作者: 植物群 時(shí)間: 2025-3-26 11:26 作者: 捏造 時(shí)間: 2025-3-26 15:17 作者: Discrete 時(shí)間: 2025-3-26 18:41 作者: SEVER 時(shí)間: 2025-3-26 22:13 作者: PALL 時(shí)間: 2025-3-27 02:27
he superconducting gap is estimated to be 2⊿/k.T. = 4.5, indicating that the superconductivity in Y.C. can be described by s-wave strong coupling regime. From specific heat in various magnetic fields, the upper critical field H.(0) is estimated to be 24.7 T.作者: HUSH 時(shí)間: 2025-3-27 06:38 作者: fabricate 時(shí)間: 2025-3-27 12:04 作者: 食物 時(shí)間: 2025-3-27 15:56 作者: 反復(fù)無常 時(shí)間: 2025-3-27 18:08
https://doi.org/10.1007/978-1-4419-0984-83D packaging; RF and microwave microelectronics; composite material; electronic packaging; electronics; h作者: shrill 時(shí)間: 2025-3-28 00:53 作者: Flavouring 時(shí)間: 2025-3-28 04:16 作者: 碳水化合物 時(shí)間: 2025-3-28 07:34
LTCC Substrates for RF/MW Application,h performance up to millimeter-wave region. In our chapter, we will review LTCC fabrication processes, characteristics all of main commercially available LTCC material systems and LTCC current status and trend.作者: FADE 時(shí)間: 2025-3-28 14:08 作者: 高興一回 時(shí)間: 2025-3-28 14:56 作者: 橡子 時(shí)間: 2025-3-28 21:46 作者: 過分 時(shí)間: 2025-3-29 02:54
Millimeter-Wave Chip-on-Board Integration and Packaging,y with the highly-automated die attachment and wire bonding operations used in the plastic packaging industry and places bare millimeter-wave chips in environmentally protected air cavities. Examples of millimeter-wave products utilizing this technology are described, and some price points are given.作者: 無禮回復(fù) 時(shí)間: 2025-3-29 06:58 作者: phlegm 時(shí)間: 2025-3-29 11:17
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages,e problems are driven by consumers’ desire for increasing bandwidth (e.g., portable communications applications) and manufacturers’ desire to drive down system cost (e.g., taking advantage of volume manufacturing processes). This work describes a low-cost plastic QFN package possible of meeting thes作者: finale 時(shí)間: 2025-3-29 14:36
Polymeric Microelectromechanical Millimeter Wave Systems,le filters, phase shifters, waveguide-fed horn antennas and waveguide-based feeding networks. Fundamental issues in polymer metallization process such as conformal and uniform deposition as well as mass transfer and current density effects on the novel in-channel electroplating encapsulation, surfac
