標(biāo)題: Titlebook: Nanopackaging; Nanotechnologies and James E. Morris Book 2018Latest edition Springer International Publishing AG, part of Springer Nature 2 [打印本頁] 作者: 使無罪 時間: 2025-3-21 17:41
書目名稱Nanopackaging影響因子(影響力)
書目名稱Nanopackaging影響因子(影響力)學(xué)科排名
書目名稱Nanopackaging網(wǎng)絡(luò)公開度
書目名稱Nanopackaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Nanopackaging被引頻次
書目名稱Nanopackaging被引頻次學(xué)科排名
書目名稱Nanopackaging年度引用
書目名稱Nanopackaging年度引用學(xué)科排名
書目名稱Nanopackaging讀者反饋
書目名稱Nanopackaging讀者反饋學(xué)科排名
作者: CRANK 時間: 2025-3-21 20:27
Soft Mold Nanoimprint: Modeling and Simulation,een the nano-patterned mold and the polymer film substrate. It is suggested that a hydrophobic silane coating is necessary for reducing the adhesion force between the mold and the substrate leading to a successful printing result.作者: 變態(tài) 時間: 2025-3-22 00:36 作者: Aids209 時間: 2025-3-22 04:50 作者: Limited 時間: 2025-3-22 12:31
Nano-conductive Adhesives, ECAs in the 1950s [1–3]. Recently, ECA materials have been identified as one of the major alternatives for lead-containing solders for microelectronic packaging applications. There are two types of conductive adhesives: isotropically conductive adhesives (ICAs) and anisotropically conductive adhesives/films (ACAs/ACFs).作者: backdrop 時間: 2025-3-22 15:57 作者: Nuance 時間: 2025-3-22 20:04
nationally recognized contributors, as well as updates in al.This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, a作者: 粗俗人 時間: 2025-3-22 21:41
Nanoparticle Fabrication,ions of physical and chemical processes are reviewed to understand recent progress in the industrial production for metal nanoparticles and related materials. This chapter also describes utilization of the nanomaterials for preparing electric wires, electrodes, and interconnects.作者: 合并 時間: 2025-3-23 01:36 作者: 突襲 時間: 2025-3-23 07:14 作者: 魯莽 時間: 2025-3-23 12:00
978-3-030-07999-4Springer International Publishing AG, part of Springer Nature 2018作者: Classify 時間: 2025-3-23 17:14
James E. MorrisDiscusses the importance of computer modeling in nanopackaging and offers suggestions for implementation.Contains 12 new chapters from internationally recognized contributors, as well as updates in al作者: Habituate 時間: 2025-3-23 21:17
Nanoparticle Properties,ease. The stable interatomic bonding arrangements which exist within large crystals are not satisfied for surface atoms, which therefore become more mobile and more reactive, and nanoparticle properties become dominated by surface properties.作者: 書法 時間: 2025-3-23 23:28 作者: pericardium 時間: 2025-3-24 03:57
for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopacka978-3-030-07999-4978-3-319-90362-0作者: 展覽 時間: 2025-3-24 08:39 作者: 恃強凌弱 時間: 2025-3-24 12:04
Olaf van der Sluis,Nancy Iwamoto,Jianmin Qu,Shaorui Yang,Cadmus Yuan,Willem D. van Driel,G. Q. Zhang作者: 下邊深陷 時間: 2025-3-24 15:38
Yinsheng Zhong,Stephen C. T. Kwok,Matthew M. F. Yuen作者: entitle 時間: 2025-3-24 22:34 作者: Bmd955 時間: 2025-3-25 01:42 作者: Abjure 時間: 2025-3-25 05:43
Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects,tance in order to establish physically correct, unambiguous values of the adhesion properties, which can only be achieved by proper multi-scale techniques..The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the continuum aspects of delamin作者: 最高點 時間: 2025-3-25 09:35
Advances in Delamination Modeling of Metal/Polymer Systems: Atomistic Aspects,tance in order to establish physically correct, unambiguous, values of the adhesion properties, which can only be achieved by proper multi-scale techniques..The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the atomistic aspects of delami作者: 階層 時間: 2025-3-25 13:40
Nanoparticle-Based High-, Dielectric Composites: Opportunities and Challenges,roperties and the long-term stability of capacitors built into PCBs are described. High-k nanocrystalline thin-film layers prepared in various methods are also presented. Brief descriptions of thick-film and ceramic high-k materials with very good reliability and extended operation temperature are i作者: ETCH 時間: 2025-3-25 18:34
Nanostructured Resistor Materials,ts, and improvement of wireability and frequency due to elimination of parasitic inductance. The material, technological, and constructional solutions and their relation with the electrical and stability properties chosen are analyzed in detail for modern microresistors, both described in the litera作者: rods366 時間: 2025-3-25 21:21 作者: 薄荷醇 時間: 2025-3-26 00:54
A Study of Nanoparticles in SnAg-Based Lead-Free Solders,-based solder alloys, did not increase IMC thickness and grain size significantly after the solder reflow process and thermal aging. hence, these nano particles resulted in good drop test performance compared to Cu, Ag, Au, Zn, Al, In, P, Ge, Sb.作者: 不規(guī)則的跳動 時間: 2025-3-26 04:47
Nano-underfills and Potting Compounds for Fine-Pitch Electronics,ve been presented. The use of explicit finite element models for capturing the transient dynamic response under high-g mechanical shock of unpotted and potted electronics assemblies have been discussed.作者: constellation 時間: 2025-3-26 08:31 作者: SPER 時間: 2025-3-26 13:32
High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Naof using the dispersive MWCNT composites for the high SE and suitability for packaging low-cost and high-performance optical transceiver modules used in the fiber-to-the-home (FTTH) lightwave transmission systems.作者: Psa617 時間: 2025-3-26 17:37
Book 2018Latest editiond health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopacka作者: 使無效 時間: 2025-3-26 22:43
James E. Morrisheterologous SARP expression. It is shown that overexpression of papR2 increased the production of predominantly unknown antimicrobial compounds in more than ha978-3-658-44551-5978-3-658-44552-2Series ISSN 2625-3577 Series E-ISSN 2625-3615 作者: nepotism 時間: 2025-3-27 02:22 作者: negotiable 時間: 2025-3-27 08:23
Masahiro Inoue,Yamato Hayashi,Hirotsugu Takizawa,Katsuaki Suganumadditional staining. Cryo-EM, coupled with single-particle image analysis techniques, makes it possible to examine the size, structure and arrangement of coronavirus structural components in fully hydrated, native virions. Two virus purification procedures are described.作者: 貴族 時間: 2025-3-27 11:40 作者: 舊石器 時間: 2025-3-27 14:56
Damian Nowak,Andrzej Dziedzic,Fan Wu,James E. Morrisdditional staining. Cryo-EM, coupled with single-particle image analysis techniques, makes it possible to examine the size, structure and arrangement of coronavirus structural components in fully hydrated, native virions. Two virus purification procedures are described.作者: 得罪 時間: 2025-3-27 20:05 作者: decipher 時間: 2025-3-27 22:39 作者: META 時間: 2025-3-28 02:51
Kyung-Wook Paik,Kyung-Lim Sukdditional staining. Cryo-EM, coupled with single-particle image analysis techniques, makes it possible to examine the size, structure and arrangement of coronavirus structural components in fully hydrated, native virions. Two virus purification procedures are described.作者: headlong 時間: 2025-3-28 06:41 作者: B-cell 時間: 2025-3-28 12:07 作者: Scintigraphy 時間: 2025-3-28 17:41
Masazumi Amagain–immobilized metal nanoparticles based on the binding interaction between viruses and sugar chains. For COVID-19, we have developed and commercialized two molecular diagnosis kits: SUDx SARS-CoV-2 detection kit, and SGNP nCoV/Flu PCR detection kit, for the Japanese market in 2020.作者: 極為憤怒 時間: 2025-3-28 21:03
Pradeep Lall,Saiful Islam,Kalyan Dornala,Jeff Suhling,Darshan Shindeost proteins dynamics. Here, we describe the sample preparation method adapted to profile SARS-CoV-2 -infected cell models, the shotgun proteomics pipeline to record experimental data, and the workflow for data interpretation to analyze infection-induced proteomic changes in a time-resolved manner.作者: legislate 時間: 2025-3-29 02:23
Wood-Hi Cheng,Pi Ling Huang,Chia-Ming Changeplicating violence in the information society. This information expansion (information war) has led to large-scale changes in the security sphere using information and network technologies. During the pandemic, destructive tendencies (transformational, military-political, economic, anthropological 作者: 改良 時間: 2025-3-29 03:35
Nanopackaging: Nanotechnologies and Electronics Packaging, environmental protection, electrical signal and power I/O, and a means of heat dissipation for the Si chip, whether digital or analog, processor, or memory. Level two packaging is then the integration of these packaged chips into a board-level system that similarly provides mechanical support, powe作者: 粗魯?shù)娜?nbsp; 時間: 2025-3-29 07:58
Modelling Technologies and Applications,ew of these technologies from continuum modelling using techniques such as finite elements, atomistic models based on molecular dynamics and optimisation under uncertainty, as well as homogenisation methods that link results across the length and timescales. Challenges for these techniques in terms 作者: 搖晃 時間: 2025-3-29 14:12 作者: Consensus 時間: 2025-3-29 18:41 作者: spinal-stenosis 時間: 2025-3-29 22:09
Soft Mold Nanoimprint: Modeling and Simulation,ithin a limited size chip becomes a challenging issue. Nanoimprint lithography (NIL) provides a low-cost solution in order to cope with the challenge. However, the de-molding process is very critical for determining the printing quality. The interaction between the mold and the substrate greatly aff作者: fodlder 時間: 2025-3-30 02:30 作者: 潔凈 時間: 2025-3-30 06:49 作者: ANIM 時間: 2025-3-30 10:35
Nanoparticle-Based High-, Dielectric Composites: Opportunities and Challenges, and very good stability and functionality, with simultaneous low cost of processing and materials. Usually it is impossible to satisfy all requirements simultaneously; however, different properties can be achieved by application of various technologies, suitable for specified field of application. 作者: 博識 時間: 2025-3-30 15:30
Nanostructured Resistor Materials,its demands both active devices and passives (primarily resistors, capacitors, and inductors but also nonlinear resistors – thermistors and/or varistors, potentiometers, etc.). The aim of this chapter is to present the current situation in the area of surface and embedded (buried) resistors made wit作者: 手工藝品 時間: 2025-3-30 16:45 作者: Psa617 時間: 2025-3-30 22:19
Nano-conductive Adhesives,ielectric properties and thus are electrical insulators. The conductive fillers provide the electrical properties and the polymeric matrix provides mechanical properties. Therefore, electrical and mechanical properties are provided by different components, which is different from metallic solders th作者: 巡回 時間: 2025-3-31 01:36 作者: 采納 時間: 2025-3-31 05:08
Nanoparticles in Microvias,), protection of devices from the environment, and electrical interconnection of components. This electrical interconnection enables distribution of both electronic signals and power throughout the package by means of multiple layers of metal circuit traces. Electrical interconnection between layers作者: Allergic 時間: 2025-3-31 10:13
Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging,ritically on subtractive patterning. Printing, a bottom-up process, plays an important role in this production, especially when nanomaterials are printed. There are many areas in which such printing is used [1], but only electrically conductive structures in electronic packaging are the object of in作者: 新義 時間: 2025-3-31 16:10
A Study of Nanoparticles in SnAg-Based Lead-Free Solders,tting behavior on several substrate platings such as Cu, Ag, Pd, and Au. Recently, due to environmental and health concerns, a variety of new lead-free solders have been developed. Lead-free solders lack the toxicity problems associated with lead-contained solders. However, unlike lead solders, the 作者: nuclear-tests 時間: 2025-3-31 21:11
Nano-underfills and Potting Compounds for Fine-Pitch Electronics,damage interconnects. Mechanical shock during operation may subject the board assemblies to large out-of-plane deformation. Underfills and potting compounds are often used to enhance the harsh environment reliability of electronics through addition of supplemental restraints to allow for increase in作者: 刺激 時間: 2025-3-31 23:21
Carbon Nanotubes: Synthesis and Characterization,echnology.” Carbon nanotubes (CNTs) represent a distinct group of nanostructures of relatively few nanometers in diameter and micrometers in length with unique physical and chemical properties. Structurally based on number of graphitic layers, CNTs are classified as single-walled (SWCNTs) and multiw作者: 領(lǐng)巾 時間: 2025-4-1 02:24
Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications, identified as helical microtubules of graphene sheets rolled around the chiral vector. The quasi-one-dimensional (1D) structure imparts to CNTs’ unique physical and chemical properties that have naturally led to their use in many nanoelectronic device applications. However, these properties of CNTs
