標(biāo)題: Titlebook: Nano-Bio- Electronic, Photonic and MEMS Packaging; C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi L Book 2021Latest edition Springer Nat [打印本頁] 作者: 召喚 時間: 2025-3-21 18:56
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging影響因子(影響力)
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging影響因子(影響力)學(xué)科排名
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging網(wǎng)絡(luò)公開度
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging被引頻次
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging被引頻次學(xué)科排名
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging年度引用
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging年度引用學(xué)科排名
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging讀者反饋
書目名稱Nano-Bio- Electronic, Photonic and MEMS Packaging讀者反饋學(xué)科排名
作者: incite 時間: 2025-3-21 20:36 作者: insightful 時間: 2025-3-22 04:13
Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFsth at their root cross-sections (i.e., good “adhesion” to their substrate); withstand high pressure (up to100 psi); exhibit acceptable consistency in their heights and diameters; demonstrate adequate mechanical performance in the post-buckling conditions; exhibit good wettability to the embedding lo作者: 不滿分子 時間: 2025-3-22 06:03 作者: 附錄 時間: 2025-3-22 09:35
Nanobiosensing Electronics and Nanochemistry for Biosensor Packagingation of sensor devices, and the integration of biosensor system with system on package (SOP) are detailed. Finally, the chapter concludes with future trends in biosensor technologies and a brief summary.作者: enfeeble 時間: 2025-3-22 15:41
Book 2021Latest editionable and wearable electronics, stateof the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging.. .Nano- Bio- Electronic, Photonic and MEMS 作者: daredevil 時間: 2025-3-22 20:22 作者: Buttress 時間: 2025-3-22 22:31 作者: Epithelium 時間: 2025-3-23 03:05
Andrew Hunt,Yongdong Jiang,Zhiyong Zhao,Ganesh Venugopal作者: 昏暗 時間: 2025-3-23 07:01 作者: 清醒 時間: 2025-3-23 10:59
C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi LOffers a comprehensive overview of nano and bio packaging that includes electrically conductive nanomaterials, thermal interfacial materials, nanotubes and superhydrophobic self-clean Lotus surfaces, 作者: condescend 時間: 2025-3-23 14:49 作者: Magnitude 時間: 2025-3-23 21:05
http://image.papertrans.cn/n/image/660620.jpg作者: precede 時間: 2025-3-23 23:21 作者: florid 時間: 2025-3-24 06:03
Biomimetic Lotus Effect Surfaces for NanopackagingThis chapter addresses fundamentals on biomimetic nano Lotus surfaces, their chemistry, and nanostructure texture physics. In addition, preparation methodologies for various nano-textured superhydrophobic surfaces, their applications, and future researches are presented.作者: Myelin 時間: 2025-3-24 07:01
Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materialsd CNT integration into circuits and packaging, with focus on CNT transfer technology, are presented. In comparison with CNT-polymer composites, nanographite-polymer composites are more promising for TIM applications, which is discussed together with current thermal measurement techniques, commercialized and non-commercialized.作者: 積習(xí)已深 時間: 2025-3-24 12:23
Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronicse when mounted on the skin. Systematic designs include stretchable interconnects, strain isolation layers, and soft conductive composites. This chapter describes a comprehensive review of soft packaging methods and technologies, including design strategies, materials selection, and system integration.作者: Cpr951 時間: 2025-3-24 16:20
Book 2021Latest edition, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including:.Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical scie作者: 心神不寧 時間: 2025-3-24 22:12
Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chipsup with specialty techniques. This chapter will review these techniques in the specific contexts of the chip applications, as well as materials requirements. In addition, we will highlight common and advanced practices and point out research needs in these areas.作者: intuition 時間: 2025-3-25 01:31
Packaging of Biomolecular and Chemical Microsensorstplate sensors and electrochemical gas sensors, is discussed. Also biomedical sensors and microfluidic devices including microneedles, soft lithography for microchannel fabrication, bonding, and packaging materials are discussed.作者: 緯線 時間: 2025-3-25 05:27 作者: declamation 時間: 2025-3-25 10:10
Some Nanomaterials for Microelectronics and Photonics Packagingsives, molecular wires for electrical interconnects, low-stress and high-thermal conductive flip-chip underfills, high-. dielectric for embedded passives, bio-mimic Lotus effect with both nano- and microsurfaces for self-cleaning and molecular dynamic (MD) simulations for nanomaterial study and prediction, etc.作者: 向外供接觸 時間: 2025-3-25 15:32 作者: 夾克怕包裹 時間: 2025-3-25 19:27
Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic ApplicationsSpray Combustion process as a benchmark and review its capabilities to that of other nanomaterials’ fabrication processes. Examples will mostly be of nanopowders synthesized using nCCVC. Applications of the nanomaterials in the electronic and energy sectors will be discussed.作者: vocation 時間: 2025-3-25 23:01
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectroace showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting point SnAg or SnAgCu alloy nanoparticles could be used for low reflow temperature lead-free interconnect applications.作者: Cupping 時間: 2025-3-26 03:03 作者: 打包 時間: 2025-3-26 08:05 作者: BRIEF 時間: 2025-3-26 12:18
Some Nanomaterials for Microelectronics and Photonics Packagingplications, including carbon nanotubes (CNTs) for electrical/thermal devices, lead-free nanoalloys for lead-free interconnection, nano-conductive adhesives, molecular wires for electrical interconnects, low-stress and high-thermal conductive flip-chip underfills, high-. dielectric for embedded passi作者: 簡略 時間: 2025-3-26 16:32
Nano-conductive Adhesives for Nano-electronics Interconnectionernatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nano-conductive adhesives are becoming more and more important due to the special electrical, mechanical, optical作者: Malaise 時間: 2025-3-26 18:07 作者: Prophylaxis 時間: 2025-3-27 00:51 作者: 漫步 時間: 2025-3-27 03:10
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectro chemical reduction method, and their thermal properties were studied by differential scanning calorimetry. The particle size dependency of the melting temperature and the latent heat of fusion were observed. The wetting test for the as-prepared SnAg and SnAgCu alloy nanoparticle pastes on a Cu surf作者: 橫條 時間: 2025-3-27 06:16 作者: 無政府主義者 時間: 2025-3-27 11:25 作者: Lumbar-Spine 時間: 2025-3-27 14:45 作者: Axon895 時間: 2025-3-27 20:42 作者: 著名 時間: 2025-3-27 22:00 作者: ROOF 時間: 2025-3-28 05:12 作者: 修飾 時間: 2025-3-28 08:45 作者: aerial 時間: 2025-3-28 14:20 作者: 演講 時間: 2025-3-28 15:58 作者: 一個姐姐 時間: 2025-3-28 21:29
Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronicsd electronics for real-time, continuous monitoring of human health and persistent human-machine interfaces. Soft materials have enabled this new class of materials and system integrations, which has significant advantages over the conventional rigid and planar electronics in the design of wearable d作者: 字謎游戲 時間: 2025-3-29 01:38
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