標(biāo)題: Titlebook: NANO-CHIPS 2030; On-Chip AI for an Ef Boris Murmann,Bernd Hoefflinger Book 2020 Springer Nature Switzerland AG 2020 Nano-Electronics.Artifi [打印本頁(yè)] 作者: relapse 時(shí)間: 2025-3-21 19:49
書(shū)目名稱(chēng)NANO-CHIPS 2030影響因子(影響力)
作者: Postmenopause 時(shí)間: 2025-3-22 00:17
Dennis Rich,Andrew Bartolo,Carlo Gilardo,Binh Le,Haitong Li,Rebecca Park,Robert M. Radway,Mohamed M.作者: Conflagration 時(shí)間: 2025-3-22 01:15
Dealing with the Energy Versus Performance Tradeoff in Future CMOS Digital Circuit Design, never fully gone. Careful library design, optimal choice of supply voltages, plural and advanced architectural techniques to deal with timing variability impose themselves. In this chapter an overview of this scenery is given.作者: degradation 時(shí)間: 2025-3-22 06:10
Enabling Domain-Specific Architectures with Programmable Devices,-level processing using CGRA (Coarse Grained Reconfigurable Architecture) is integrated on the same platform. Looking forward, we anticipate that the rising cost of building monolithic devices will also set a disaggregation trend towards using multiple dies. Building systems in the package will prov作者: 和平 時(shí)間: 2025-3-22 10:20 作者: 同來(lái)核對(duì) 時(shí)間: 2025-3-22 13:48 作者: 燦爛 時(shí)間: 2025-3-22 20:48
Heterogeneous 3D Nano-systems: The N3XT Approach?,new transistor and memory technologies, new integration approaches, and new architectures for computation immersed in memory. Nanosystems with such massive benefits are essential for enabling new frontiers of applications across a wide range of domains, from highly energy-constrained and deeply-embedded computing systems all the way to the cloud.作者: GEM 時(shí)間: 2025-3-22 22:20
Digital Neural Network Accelerators, The focus of this chapter is on the inference phase of Deep Neural Networks which are used in many applications today. Their performance will be compared to multi-core-chips, graphics processing units, and field-programmable gate arrays. Based on current applications future requirements for digital accelerator chips will be outlined.作者: Eeg332 時(shí)間: 2025-3-23 03:07
High-Performance Computing Trends,× improvements in energy efficiency and in throughput in the new decade, in order to limit and to manage the data explosion in the INTERNET and in the expected autonomous mobile world. The potential INTERNET energy crisis has been updated in 2018 to a required electric power of 928 GW in 2030, 21% of the expected total global need.作者: overshadow 時(shí)間: 2025-3-23 07:23 作者: atopic-rhinitis 時(shí)間: 2025-3-23 10:48 作者: Acetabulum 時(shí)間: 2025-3-23 14:46
The Memory Challenge in Ultra-Low Power Deep Learning,have storage requirements for both weights and activations that are often not compatible with on-chip memories and/or low cost, low power external memory options. In this chapter, we outline key ideas, recent achievements, and directions for future research towards taming the memory bottleneck for ultra-low power ML circuits and systems.作者: GLEAN 時(shí)間: 2025-3-23 18:14 作者: FLORA 時(shí)間: 2025-3-24 01:01 作者: 連鎖 時(shí)間: 2025-3-24 05:34
Silicon Complementary MOS into Its 7th Decade,imum parasitics, best energy efficiency and?>300?GHz bandwidth. In its sub-threshold mode-of-operation, it offers the most eye-like image sensor, and it allows robust logic operation down to 200?mV. The key future challenge is the efficient 3D integration of trillions of these ideal transistors into intelligent networks.作者: 我怕被刺穿 時(shí)間: 2025-3-24 10:34 作者: scrutiny 時(shí)間: 2025-3-24 11:58 作者: SUGAR 時(shí)間: 2025-3-24 18:54
Machine Learning at the Edge, chapter reviews state-of-the-art approaches and trends for low-energy machine learning inference and training at the edge. It covers dataflow, architecture and circuit design aspects of fully digital processors and mixed analog/digital implementations targeting the microwatts and milliwatts range.作者: Adrenaline 時(shí)間: 2025-3-24 21:06
Nanolithography, opportunities for Nano-Imprint, Multiple-Electron-Bean Direct Writing and Directed Self-Assembly. To support the major drive towards 3D integration, new patterning and precision-alignment techniques will be introduced (Chaps. .–., . and .).作者: Compass 時(shí)間: 2025-3-25 02:07 作者: visual-cortex 時(shí)間: 2025-3-25 06:46 作者: GILD 時(shí)間: 2025-3-25 08:56 作者: 流動(dòng)才波動(dòng) 時(shí)間: 2025-3-25 14:57
978-3-030-18340-0Springer Nature Switzerland AG 2020作者: BLINK 時(shí)間: 2025-3-25 18:04
NANO-CHIPS 2030978-3-030-18338-7Series ISSN 1612-3018 Series E-ISSN 2197-6619 作者: Factual 時(shí)間: 2025-3-25 22:19
Boris Murmann,Bernd HoefflingerPresents key elements of a new epoch in nanoelectronics that follows the end of the Nanometer Roadmap.A timely compendium that will inspire and shape the future of nanoelectronics.Explores the next ge作者: Adornment 時(shí)間: 2025-3-26 01:08 作者: Lymphocyte 時(shí)間: 2025-3-26 08:21 作者: heirloom 時(shí)間: 2025-3-26 09:09 作者: Guaff豪情痛飲 時(shí)間: 2025-3-26 14:21
The Frontiers Collectionhttp://image.papertrans.cn/n/image/660020.jpg作者: 來(lái)這真柔軟 時(shí)間: 2025-3-26 20:46
https://doi.org/10.1007/978-3-030-18338-7Nano-Electronics; Artificial Intelligence; CMOS Chips; Energy Efficiency; 3D Integration; Acquisition of 作者: 流動(dòng)才波動(dòng) 時(shí)間: 2025-3-26 22:38
The New Era of Nano-chips: Green and Intelligent,ergy-efficient and intelligent nano-chip systems. It identifies five major thrust areas that are covered by 28 chapters written by world-leading experts: Robust and Efficient Silicon, Real-World Electronics, Neuromorphic Architectures, AI On-Chip and 3D Integration, and Man-Machine Cooperation.作者: Chagrin 時(shí)間: 2025-3-27 02:46 作者: oracle 時(shí)間: 2025-3-27 07:53
Real-World Electronics,r real-world-like functions. Relevant signals and information are perceived on logarithmic scales, where noticeable differences make up a constant percentage of the actual signal level. While this was realized in digital audio, it has been neglected in video because of linear charge-coupled-devices 作者: Detonate 時(shí)間: 2025-3-27 10:01 作者: 哀求 時(shí)間: 2025-3-27 16:39
Nanolithography, reasons and for lithography limits, the roadmap for chip-product nodes has been re-written, so that node names have become quite different from minimum dimensions on-chip. 2018 became the introduction-year for Logic Industry Node “7?nm” with minimum features of 14?nm, and the IRDS Lithography roadm作者: 對(duì)待 時(shí)間: 2025-3-27 20:21
The Future of Ultra-Low Power SOTB CMOS Technology and Applications,n-thin-buried oxide (SOTB) technology is a CMOS device technology that uses fully depleted silicon-on-insulator (FDSOI) transistors with a thin buried oxide layer enabling enhanced back-bias controllability and that can be monolithically integrated with the conventional bulk CMOS circuits. It can si作者: Surgeon 時(shí)間: 2025-3-28 00:56 作者: 禁止,切斷 時(shí)間: 2025-3-28 02:25
,Monolithic 3D Integration—An Update, covered the impact of the then recent breakthrough in bonding alignment on the ease of adapting monolithic 3D technology. Since then, the equipment vendors have made significant improvements in the precision of these bonders, making it a very attractive technology for Monolithic 3D integration. At 作者: 摻和 時(shí)間: 2025-3-28 08:03
Heterogeneous 3D Nano-systems: The N3XT Approach?,al languages, real-time sensor readings, contextual environments, or even brain signals. The computational demands of these abundant-data applications, such as deep learning-based AI, far exceed the capabilities of today’s computing systems and cannot be met by isolated improvements in transistor or作者: 責(zé)怪 時(shí)間: 2025-3-28 13:57
High-Speed 3D Memories Enabling the AI Future,e technology of choice for memory in such AI systems. Yet, DRAM’s high energy?per bit and the diminishing scaling of DRAM represent a real challenge for the AI system’s future. This chapter covers solutions utilizing technologies similar to those currently used in 3D NAND for high speed memory.作者: 思想上升 時(shí)間: 2025-3-28 16:56
3D for Efficient FPGA,plus independent routing programmable level. This leads to?a futuristic FPGA in which structure and process similar to that of 3D NAND provide FPGA with lower cost and higher density than 2D Standard Cell design.作者: GIST 時(shí)間: 2025-3-28 21:51 作者: NATTY 時(shí)間: 2025-3-28 23:52 作者: crease 時(shí)間: 2025-3-29 06:58
Coarse-Grained Reconfigurable Architectures,ccelerator architectures. Coarse-Grained Reconfigurable Architectures (CGRAs) have been shown to achieve higher performance and energy efficiency compared to conventional instruction-based architectures by avoiding instruction overheads with reconfigurable data and control paths. CGRAs also avoid th作者: CLIFF 時(shí)間: 2025-3-29 07:40
,A 1000× Improvement of the Processor-Memory Gap,y—the so-called “Memory Wall.” This barrier is even more limiting for AI applications in which massive amounts of data need to go through relatively simple processing. The 2018 3DVLSI DARPA program is focused on addressing this challenge. Alternative technologies are covered in which layers of logic作者: 發(fā)誓放棄 時(shí)間: 2025-3-29 11:34
High-Performance Computing Trends,the 5-year period 2014–2019 saw a 5-times increase in the throughput of the TOP 10 supercomputers with constant electric power, which means a 5-times improvement in energy efficiency. With this jump in efficiency, two of these TOP 10 have also taken the lead among the TOP GREEN supercomputers. 3D in作者: avarice 時(shí)間: 2025-3-29 19:27 作者: 健談的人 時(shí)間: 2025-3-29 20:27
Machine Learning at the Edge,gh-end FPGAs and GPUs. As this rise of machine learning applications continues, some of these algorithms must move “closer to the sensor,” thereby eliminating the latency of cloud access and providing a scalable solution that avoids the large energy cost per bit transmitted through the network. This作者: Oration 時(shí)間: 2025-3-30 01:53
The Memory Challenge in Ultra-Low Power Deep Learning,owever, to achieve this goal, we need to address memory organization challenges, as current machine learning (ML) models (e.g., deep neural networks) have storage requirements for both weights and activations that are often not compatible with on-chip memories and/or low cost, low power external mem作者: JAUNT 時(shí)間: 2025-3-30 06:19 作者: 輕觸 時(shí)間: 2025-3-30 12:12
Development of Sizing Systems for Chinese Minorspometric survey in China mainland. About 20,000 minors (9666 males and 9699 females) were recruited from six geographical areas in China. Body weight plus totally 134 static dimensions were collected. Stature, the bust waist girth difference (BWGD) and bust girth were finally identified through fact作者: overture 時(shí)間: 2025-3-30 16:25
Improving Heart Disease Diagnosis: An Ensemble Machine Learning Approacheatment of diseases are essential for human life. From this point of view, an ensemble machine learning approach has been proposed for the diagnosis of heart disease within the scope of this study. In the first step of the proposed approach, feature extraction is performed using the Convolutional Ne作者: 繼而發(fā)生 時(shí)間: 2025-3-30 18:10 作者: Isometric 時(shí)間: 2025-3-30 21:30
Marriage and Motherhoodame time a Problem—a relationship fraught with difficulties that it was primarily the task of the woman to negotiate and overcome. Long before the divorce rate skyrocketed in the 1970s, marriages were perceived as being in constant danger of dissolving, and it is a rare issue of a magazine that does作者: ARC 時(shí)間: 2025-3-31 04:38 作者: conference 時(shí)間: 2025-3-31 07:30 作者: 仇恨 時(shí)間: 2025-3-31 09:47
Plate-Based Assay for Measuring Direct Semaphorin–Neuropilin Interactionscharacterization of the Sema3/Nrp interaction. This assay utilizes Nrp-affinity plates and an alkaline phosphatase (AP)-Sema3 fusion to rapidly measure direct Sema3/Nrp binding. This assay can be used to measure receptor-ligand binding, the contribution of different domains, and exogenous factors, and to characterize competitive ligand binding.作者: 我吃花盤(pán)旋 時(shí)間: 2025-3-31 14:40
Irene Permut MD,Wissam Chatila MDot-Menge eines Programms definiert und gezeigt, da? pivotierende Programme zerlegbar sind. Die Strategie wurde in einem lokalen Netz miteinander verbundener SUN3–60 Workstations implementiert. Nach einer Beschreibung der Implementation werden einige experimentelle Simulationsergebnisse diskutiert.作者: 剝削 時(shí)間: 2025-3-31 19:44 作者: 雀斑 時(shí)間: 2025-3-31 22:30
Fiorihe contiene granuli di polline] (Fig. 15.1). I fiori possono essere isolati o variamente riuniti in gruppi (infiorescenze); queste ultime possono essere pedicillate (a racemo o grappolo opposto o alterno, a pannocchia, ad ombrello, a corimbo) o sessili (a spiga opposta o alterna, a spadice, a capoli作者: SOBER 時(shí)間: 2025-4-1 04:05 作者: faultfinder 時(shí)間: 2025-4-1 08:48 作者: diskitis 時(shí)間: 2025-4-1 11:10 作者: ANTI 時(shí)間: 2025-4-1 14:31
Jochen Benz,Markus H?flingerDurchg?ngige Fallstudie in übersichtlicher Modellfirma macht Zusammenh?nge greifbar
