標(biāo)題: Titlebook: Microelectronics Manufacturing Diagnostics Handbook; Abraham H. Landzberg Book 1993 Springer Science+Business Media New York 1993 diagnosi [打印本頁] 作者: 自由才謹慎 時間: 2025-3-21 16:33
書目名稱Microelectronics Manufacturing Diagnostics Handbook影響因子(影響力)
作者: 容易生皺紋 時間: 2025-3-21 23:07 作者: florid 時間: 2025-3-22 04:16
Manufacturing Yield,ircuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the initiation of a new technology, and the focus of this chapter.作者: Meditative 時間: 2025-3-22 04:40 作者: Watemelon 時間: 2025-3-22 08:47 作者: barium-study 時間: 2025-3-22 15:22
Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks,ms, and so on” (Barr and Feigenbaum 1981). In this chapter, we focus on two areas of artificial intelligence that have shown great promise in microelectronic manufacturing diagnosis: expert systems and neural networks.作者: AUGUR 時間: 2025-3-22 20:29
Bum-in,SI semiconductor engineer. Covered in this chapter is a discussion of the important parameters affecting the burn-in, how to model the effects of burn-in and how to implement an effective burn-in process.作者: BARB 時間: 2025-3-22 22:13 作者: 核心 時間: 2025-3-23 04:42
Manufacturing Defect Classification System,em will enable better communications between professionals in the field. Hundreds of different defect types exist, and many of the defects mentioned here are also discussed in other chapters of the hand-book.作者: pester 時間: 2025-3-23 09:36
In-Line Electrical Test,the line. Here, the cumulative effect of processes can be determined prior to final or functional test at the end of the process line. In-line test determines how the product is doing, while building takes place.作者: arbovirus 時間: 2025-3-23 10:21
Traceability,pter will discuss systems to assure traceability of microelectronic components from raw materials, through manufacturing and component subassembly and into an end product. The use of these systems for yield and quality learning, as well as prevention, will also be discussed.作者: Headstrong 時間: 2025-3-23 17:33
echniques, test, diagnostics, and fail- ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per- and reducing defects, and for preventing de- formance in modem automobiles, they have fects in the first place. The approa作者: 用樹皮 時間: 2025-3-23 18:11
Product Dimensional Metrology and Pattern Defect Inspection,roblems, (3) implement corrective strategies traceable to problem sources, and (4) monitor and control process and tool critical parameters within upper and lower control limits from a mean target. Moreover, metrology and inspection functions are also important for determining process stability and establishing control baselines.作者: 珠寶 時間: 2025-3-24 00:48
Contamination Monitoring,nted out by many authors, including Burnett (1985) and Faure and Thebault (1987). A particularly detailed article on contamination levels in various semiconductor manufacturing operations was published by Osburn et al. (1988). For more detail on contamination control, see also the books by Tolliver (1988) and Donovan (1990).作者: 的事物 時間: 2025-3-24 05:37 作者: 出血 時間: 2025-3-24 09:21
Modeling for Manufacturing Diagnostics,interpretation, one might reach a conclusion, appropriately modify the theory and iterate, or conduct more experiments to confirm results. On the other hand, without an appropriate theory, one is reduced to “educated” guesswork in these aspects of diagnostics.作者: 初學(xué)者 時間: 2025-3-24 13:54
Failure Analysis of Semiconductor Devices,eliability) can also be improved by performing analysis on returned failed parts. Results from both analyses are continuously fed back to manufacturing and engineering for improved product quality and reliability.作者: 凈禮 時間: 2025-3-24 15:44 作者: 訓(xùn)誡 時間: 2025-3-24 19:33
Book 1993rt. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func- Analysis your application. tion improvements in yield an作者: 大都市 時間: 2025-3-25 02:29
s of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func- Analysis your application. tion improvements in yield an978-1-4613-5840-4978-1-4615-2029-0作者: palliate 時間: 2025-3-25 05:27 作者: Folklore 時間: 2025-3-25 09:02
P. J. Bonk,M. R. Gupta,R. A. Hamilton,A. V. S. Satya作者: 夜晚 時間: 2025-3-25 15:38
Henri A. Khoury,Timothy R. Groves,Christian H. Plougonven作者: Alcove 時間: 2025-3-25 16:52 作者: Muscularis 時間: 2025-3-25 21:40
James H. Griesmer,James A. Kierstead,Michael J. Rothman作者: 蕁麻 時間: 2025-3-26 01:11 作者: 潔凈 時間: 2025-3-26 07:30 作者: 債務(wù) 時間: 2025-3-26 11:23
Microelectronics Manufacturing Diagnostics Handbook978-1-4615-2029-0作者: Conduit 時間: 2025-3-26 13:45
G. DiGiacomoludes not only historical results but also future projection.Compared with average climate changes, climate extremes which are considered as low-probability events have greater impacts on natural and social systems due to their suddenness, unpredictability and strong destructiveness. Located in the 作者: 無思維能力 時間: 2025-3-26 17:33
Michael H. Wood,Arthur Muzik,Hance H. Huston,Hazara Rathoretems due to their suddenness, unpredictability and strong destructiveness. Located in the typical arid–semiarid climate transition zone, the Mongolian Plateau, dominated by herbage animal husbandry, is greatly affected by climate extremes, and its ecosystem is extremely fragile. In the context of gl作者: overture 時間: 2025-3-26 23:20
Introduction,various methods and tools that are available for studying manufacturing loss problems. The complete understanding of a problem is the keystone in the structure of problem-solving. With it, problems can be solved quickly, effectively and confidently; without it, a problem fix is vulnerable to the nex作者: esoteric 時間: 2025-3-27 03:26
Manufacturing Yield,tem specifications dictate the circuit design and architecture needed to achieve the required performance. The design is partitioned into integrated circuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the i作者: kidney 時間: 2025-3-27 06:38 作者: Semblance 時間: 2025-3-27 11:42
Manufacturing Defect Classification System,sses. A further purpose of the chapter is to organize defects for ease in understanding, that is, by defect classification. Classification of diagnostic criteria have been successfully used in the medical diagnostic field (APA 1987), and it is hoped that a microelec-tronic defect classification syst作者: 刀鋒 時間: 2025-3-27 17:08
Product Dimensional Metrology and Pattern Defect Inspection, and manufacturing of high density bipolar logic and memory array integrated circuit chips. Effective process control represents an essential factor in achieving higher yields, productivity and cost effectiveness in any manufacturing environment. One key way of achieving the process control objectiv作者: glamor 時間: 2025-3-27 19:51
Process and Tool Monitoring,cturing. This chapter discusses what should be done in the early phases of process development to have an optimum, manufacturable process. It then describes the process control techniques currently practiced and new methods being incorporated in tools for in situ measurement and control. It is essen作者: stressors 時間: 2025-3-27 22:09 作者: Compatriot 時間: 2025-3-28 04:24 作者: Malleable 時間: 2025-3-28 07:15
Test Sites and Vehicles for Yield and Process Monitoring,yield is an especially critical factor since it relates directly to manufacturing cost. In the early days of integrated circuit manufacturing, this type of information was obtained from the product itself through the use of visual inspection, microprobing and final testing. This approach was possibl作者: 冰河期 時間: 2025-3-28 12:01 作者: 肥料 時間: 2025-3-28 16:43
Final Test,f assembly. This section will discuss some of the techniques used to achieve this process. This chapter will concentrate on the semiconductor level of test as opposed to card or system level test. The techniques in many cases apply to the higher levels of assembly testing as well.作者: MOT 時間: 2025-3-28 18:45 作者: 自作多情 時間: 2025-3-29 01:19
Failure Analysis of Semiconductor Devices,nsistors (FET). Present integrated circuit complexity has increased, and device geometries have decreased to submicron dimensions. With this increase in manufacturing complexity, needs dictate state-of-the-art analytical capabilities to support product production and to continue to assure reliabilit作者: catagen 時間: 2025-3-29 04:34
Materials and Chemical Analysis of Electronic Devices,vices involves hundreds of operations, each individual manufacturing step must be controlled within very small tolerances to produce a large percentage of devices with good performance, i.e., there must be an economically meaningful product yield. The procedures defined in the other chapters of this作者: coagulation 時間: 2025-3-29 08:51
Modeling for Manufacturing Diagnostics,ndesirable) results to input parameters or conditions. This process is most efficient if a model of the system is used, together with well designed experiments. As it is used in many different contexts with different meanings, we define the term model to mean: an executable implementation of theoret作者: 過濾 時間: 2025-3-29 13:02 作者: MERIT 時間: 2025-3-29 19:11 作者: 疾馳 時間: 2025-3-29 20:24 作者: Dignant 時間: 2025-3-30 03:14 作者: cuticle 時間: 2025-3-30 05:54
https://doi.org/10.1007/978-1-4615-2029-0diagnosis; manufacturing; material; reliability; semiconductor devices作者: capillaries 時間: 2025-3-30 11:41
Statistical Quality Control,Statistical Quality Control (SQC) is a method for ensuring product quality. . Customers may be internal or external. External customers buy the company’s products. Internal customers add value to work in process (WIP). Each manufacturing operation is a customer of the preceding one and a supplier to the following one.作者: 門閂 時間: 2025-3-30 16:15 作者: prosthesis 時間: 2025-3-30 17:21
Final Test,f assembly. This section will discuss some of the techniques used to achieve this process. This chapter will concentrate on the semiconductor level of test as opposed to card or system level test. The techniques in many cases apply to the higher levels of assembly testing as well.作者: Mangle 時間: 2025-3-31 00:04
International besetzter Sammelband.Includes supplementary maTV-Serien haben in den letzten Jahren explosionsartig an kultureller Bedeutung gewonnen. Sie haben den Film als führendes Unterhaltungsmedium und damit auch als? Mittel zur sozialen Distinktion l?ngst abgel?st. Literatur-, Medien- und Kommu作者: ATOPY 時間: 2025-3-31 04:36
Complications of Opioid Therapy,te pain relief from non-opioid analgesics, it often is appropriate to begin treatment with opioid analgesics and to continue to titrate the opioid analgesic medication in combination with non-opioids and adjuvants combined with non-pharmacological management treatments in attempt to control pain and suffering, improve function and quality of life.作者: reception 時間: 2025-3-31 05:56
Model Plastic-Rubber Composites from Emulsion Polymers,ber. Similarly, the rubbertoughened plastics, such as high-impact polystyrene, are prepared by a polymerization process in presence of dissolved rubber, leading to a precipitation of ill-defined rubber “particles”.作者: 使隔離 時間: 2025-3-31 09:58
The Withdrawal and the End of the Cold War,rbon emissions to a low-carbon economy in the long run. The traditional relationship between per capita CO. emissions and per capita GDP. Both indicators appear to have increased from 1990 to 2008, after which CO. emissions began to decline in line with the global economic crisis, while GDP per capi作者: Rct393 時間: 2025-3-31 16:52
Juan F. Franckrapeutisch verwendeten somatischen Wirkungen, wie die analgesierende Wirkung, die atmungsverlangsamende und husten-stillende Wirkung und die ruhigstellende Wirkung auf den Magen-darmtrakt nicht oder doch nur wenig in Erscheinung, obwohl sie beim normalen Menschen schon in viel geringerer Dosierung s作者: 恩惠 時間: 2025-3-31 18:32 作者: 漂亮 時間: 2025-3-31 23:52
Sachin Kumar Chawla,Deepti Malhotrao approximately 500 of the most commonly observed objects in the Northern Hemisphere and – an enhancement for the Second Edition – approximately 50 of those in the Southern Hemisphere. These are visible from th978-3-319-03169-9978-3-319-03170-5Series ISSN 1431-9756 Series E-ISSN 2197-6562 作者: 鳥籠 時間: 2025-4-1 03:36
Die Unvermeidbarkeit der Metaphysikthis chapter, these Payment products can generally be divided into the following main categories: (i) credit transfers; (ii) direct debits; (iii) card payments; and (iv) payments connected to electronic money transactions.作者: maculated 時間: 2025-4-1 09:44
The Noninvasive Evaluation of Hemodynamics in Congenital Heart Disease978-94-009-0647-1Series ISSN 0166-9842 作者: Ischemic-Stroke 時間: 2025-4-1 12:39
en formed at the Faculty of Organizational Sciences, Belgrade, under the sponsorship of industry and planning boards. The main task of the Group shall be to implement the available software for global modelling on local computers and proceed, on the basis of previous critical studies on model sensit
