標(biāo)題: Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 20091st edition Springer-Verlag US 2009 Compound.LED.Nanomaterial.development.e [打印本頁(yè)] 作者: 力學(xué) 時(shí)間: 2025-3-21 16:23
書目名稱Materials for Advanced Packaging影響因子(影響力)
書目名稱Materials for Advanced Packaging影響因子(影響力)學(xué)科排名
書目名稱Materials for Advanced Packaging網(wǎng)絡(luò)公開(kāi)度
書目名稱Materials for Advanced Packaging網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書目名稱Materials for Advanced Packaging被引頻次
書目名稱Materials for Advanced Packaging被引頻次學(xué)科排名
書目名稱Materials for Advanced Packaging年度引用
書目名稱Materials for Advanced Packaging年度引用學(xué)科排名
書目名稱Materials for Advanced Packaging讀者反饋
書目名稱Materials for Advanced Packaging讀者反饋學(xué)科排名
作者: CHARM 時(shí)間: 2025-3-21 22:23
Daniel Lu,C.P. WongProvides a comprehensive summary of the most recent advances in materials development for advanced packaging.Covers emerging technologies such as digital health, bio-medical, and nano-materials / proc作者: 跑過(guò) 時(shí)間: 2025-3-22 00:34 作者: BILIO 時(shí)間: 2025-3-22 05:39 作者: CHART 時(shí)間: 2025-3-22 12:06 作者: Negotiate 時(shí)間: 2025-3-22 13:31
Springer-Verlag US 2009作者: 不遵守 時(shí)間: 2025-3-22 17:40 作者: construct 時(shí)間: 2025-3-22 23:34 作者: 權(quán)宜之計(jì) 時(shí)間: 2025-3-23 05:06
Advanced Chip-to-Substrate Connections,sity of the transistors and larger chip size has also led to new challenges for chip-to-substrate connections. The pace of change in packaging and chip-to-substrate connections has accelerated because off-chip issues are increasingly a limiting factor in product cost and performance. Chip-to-substra作者: Dna262 時(shí)間: 2025-3-23 09:31
Advanced Wire Bonding Technology: Materials, Methods, and Testing,ry today. Many trillion of wirebonds are made annually using automated machines. Wirebonding is reliable, flexible, and low cost when compared to other forms of first-level microelectronic interconnection. Failures are typically at the single digit parts per million level or below. As the number of 作者: 鉗子 時(shí)間: 2025-3-23 11:10 作者: expdient 時(shí)間: 2025-3-23 16:22
Thin Die Production,us applications leads to a lot of different solutions for making thin dies. This chapter describes recent developments on silicon wafer thinning and singulation. Various technologies for material removal and the associated damage caused by the material removal are reviewed in details. Different surf作者: MAIM 時(shí)間: 2025-3-23 20:12
Advanced Substrates: A Materials and Processing Perspective,ates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant, and substrate with embedded components (active dies or passives). Future trend of organic作者: 祖?zhèn)?nbsp; 時(shí)間: 2025-3-24 00:35 作者: 貪婪性 時(shí)間: 2025-3-24 03:00 作者: Mettle 時(shí)間: 2025-3-24 10:10
Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips,olving packaging requirements including moisture sensitivity level (MSL), moldability, and environmental and other reliability 1000 requirements. This chapter provides an overview of most recent development on various aspects of EMCs including advanced material development, molding process, and appr作者: 我就不公正 時(shí)間: 2025-3-24 14:24
Electrically Conductive Adhesives (ECAs),sotropic conductive adhesives/films (ACAs/ACFs) and their applications are reviewed first and then recent research achievements in material development and in both electrical and mechanical aspects of isotropic conductive adhesives (ICAs) including electrical conductivity improvement, contact resist作者: 最高點(diǎn) 時(shí)間: 2025-3-24 15:03 作者: 挑剔小責(zé) 時(shí)間: 2025-3-24 22:15 作者: 演講 時(shí)間: 2025-3-25 01:44
Embedded Passives, new and unique solutions in IC and system integration, such as system-on-chip (SOC), system-in-package (SiP), system-on-package (SOP), have been hot topics recently. Despite the high level of integration, the number of discrete passive components (resistors, capacitors, or inductors) remains very h作者: 種族被根除 時(shí)間: 2025-3-25 07:25
Nanomaterials and Nanopackaging,s, lead-free nanosolder, carbon nanotubes (CNT) and their applications for interconnect, thermal management, and integration into microsystems. Also, operation principle, fabrication techniques, and packaging of piezoelectric nanogenerators based on vertically aligned Zinc oxide (ZnO) nanowires (NWs作者: 未完成 時(shí)間: 2025-3-25 10:52
Wafer Level Chip Scale Packaging,HI) by 3-D packaging using Through Silicon Vias (TSV). Materials and process technologies are key for a reliable WLP. It is not only the choice for the right polymer or metal but the interfaces could be even more critical like under bump metallurgy or the adhesion of polymers. This chapter focuses o作者: nullify 時(shí)間: 2025-3-25 12:48 作者: flaggy 時(shí)間: 2025-3-25 17:02
LED and Optical Device Packaging and Materials,ield, and the device reliability and lifetime are determined by the quality of packaging and assembly materials as well as their processing. This presents serious challenges to the development of LED packaging materials, which is exactly the objective of this chapter to review those challenges and t作者: MAUVE 時(shí)間: 2025-3-25 21:37 作者: Desert 時(shí)間: 2025-3-26 00:11 作者: isotope 時(shí)間: 2025-3-26 05:58
Chin C. Lee,Pin J. Wang,Jong S. Kimtrol is a vital component for improving the performance (e.g., latency) of these services. Considering complex networking environment, the default congestion control algorithms on servers may not always be the most efficient, and new advanced algorithms will be proposed. However, adjusting congestio作者: Urea508 時(shí)間: 2025-3-26 09:14 作者: Cursory 時(shí)間: 2025-3-26 15:11
Harry K. Charles Ph.Digning efficient GPGPU chips poses many challenges. One major hurdle is the interface to the external DRAM, particularly the buffers in the memory controllers (MCs), which is stressed heavily by the many concurrent memory accesses from the GPGPU. Previous approaches considered scheduling the memory 作者: extract 時(shí)間: 2025-3-26 18:04 作者: Impugn 時(shí)間: 2025-3-26 21:02 作者: 發(fā)芽 時(shí)間: 2025-3-27 01:57
Bernd Appeltle and high-performance online services is to over-allocate resources for online services, which results in a waste of cluster resources. Therefore, cloud vendors tend to co-locate online services and offline batch jobs into the same cluster to improve resource utilization. However, the co-location 作者: STING 時(shí)間: 2025-3-27 06:31
Gary Brist,Gary Longeploy them on resource-limited devices such as mobile phones. To solve this problem, we propose a novel filter pruning method for neural network named Discrete Rank Pruning (DRP). Moreover, many methods apply sparse regularization on the filter weights of the convolution layers to reduce the degrada作者: MIR 時(shí)間: 2025-3-27 10:07 作者: 竊喜 時(shí)間: 2025-3-27 13:56 作者: duplicate 時(shí)間: 2025-3-27 20:40
Daoqiang Daniel Lu,C.P. Wonger, there are less investigations on the security implications of concurrently running GPU applications. In this paper, we explore security vulnerabilities of CUDA from multiple dimensions. In particular, we first present a study on GPU stack, and reveal that stack overflow of CUDA can affect the ex作者: 消息靈通 時(shí)間: 2025-3-28 01:25
Shinji Takeda,Takashi Masukoer, there are less investigations on the security implications of concurrently running GPU applications. In this paper, we explore security vulnerabilities of CUDA from multiple dimensions. In particular, we first present a study on GPU stack, and reveal that stack overflow of CUDA can affect the ex作者: Libido 時(shí)間: 2025-3-28 05:24 作者: 錫箔紙 時(shí)間: 2025-3-28 10:19
Dok Won Lee,Liangliang Li,Shan X. Wang,Jiongxin Lu,C. P. Wong,Swapan K. Bhattacharya,John Papapolymeer, there are less investigations on the security implications of concurrently running GPU applications. In this paper, we explore security vulnerabilities of CUDA from multiple dimensions. In particular, we first present a study on GPU stack, and reveal that stack overflow of CUDA can affect the ex作者: 食料 時(shí)間: 2025-3-28 13:52
X.D. Wang,Z.L. Wang,H.J. Jiang,L. Zhu,C.P. Wong,J.E. Morrissign. However popular management policies through memory-access recording and page migration may invoke non-trivial overhead in execution time and hardware space. Nowadays, managed language applications are increasingly dominant in every kind of platform. Managed runtimes provide services for automa作者: ODIUM 時(shí)間: 2025-3-28 17:39 作者: 哭得清醒了 時(shí)間: 2025-3-28 22:16 作者: foreign 時(shí)間: 2025-3-29 01:28 作者: objection 時(shí)間: 2025-3-29 04:59
Lei Mercado,James K. Carney Ph.D.,Michael J. Ebert Ph.D.,Scott A. Hareland Ph.D.,Rashid Bashir Ph.D.ks. Orientation field is able to be reconstructed by either non-parameterized or parameterized methods. In this paper, we propose a new parameterized approach for orientation field modeling. The proposed algorithm minimizes a composite model including three constraints corresponding to a least squar作者: 無(wú)禮回復(fù) 時(shí)間: 2025-3-29 07:36
ing to the image features of the images to recover the images, which helps to improve the SR-reconstruction effect. After testing different models, our framework can reduce the amount of training data by 41.9% and reduce the average training time from 2935?min to 2836?min. At the same time, our fram作者: 公理 時(shí)間: 2025-3-29 12:41
Rajen Chanchaniis performance critical and the optimization strategy of expression template is limited to enumeration based rewriting rules, we implement TOpLib with a compiler-assisted approach. We address the memory reuse challenges into the compiler, which allows TOpLib to make full use of on-chip buffers and r作者: AUGUR 時(shí)間: 2025-3-29 17:24 作者: 姑姑在炫耀 時(shí)間: 2025-3-29 21:25
Harry K. Charles Ph.Det coalescing. To study the feasibility of this idea, we have designed an expanded NoC router that supports packet coalescing and evaluated its performance extensively. Evaluation results show that this NoC-assisted design strategy can improve the row buffer hit rate in the memory controllers. A com作者: Anguish 時(shí)間: 2025-3-30 03:16 作者: SYN 時(shí)間: 2025-3-30 05:30
Werner Kroeningern schedule batch jobs to the server while introducing minimal interference. The evaluation demonstrates that our scheduling strategy can at best increase the throughput of batch jobs by 48.95% and 27.09% compared with round-robin scheduling and random scheduling while guaranteeing the QoS of online 作者: 我正派 時(shí)間: 2025-3-30 11:19
Bernd Appeltn schedule batch jobs to the server while introducing minimal interference. The evaluation demonstrates that our scheduling strategy can at best increase the throughput of batch jobs by 48.95% and 27.09% compared with round-robin scheduling and random scheduling while guaranteeing the QoS of online 作者: 暗指 時(shí)間: 2025-3-30 16:04 作者: Preamble 時(shí)間: 2025-3-30 19:46 作者: 慢跑 時(shí)間: 2025-3-31 00:05 作者: 我還要背著他 時(shí)間: 2025-3-31 02:06
Daoqiang Daniel Lu,C.P. Wong GPUs. But other attacks against format string and exception handler seems not feasible due to the design choices of CUDA runtime and programming language features. Finally, we propose potential solutions of preventing the presented vulnerabilities for CUDA.作者: thyroid-hormone 時(shí)間: 2025-3-31 08:53 作者: 擁擠前 時(shí)間: 2025-3-31 12:23 作者: offense 時(shí)間: 2025-3-31 13:45 作者: 碎石頭 時(shí)間: 2025-3-31 18:45
X.D. Wang,Z.L. Wang,H.J. Jiang,L. Zhu,C.P. Wong,J.E. Morris LLC misses especially store misses mostly hit nursery partitions. Placing nursery in fast-space, which is 20?% total memory footprint of tested benchmarks on average, causes only 10?% performance difference from all memory footprint in fast-space. During object promotion, hot objects will be direct作者: macrophage 時(shí)間: 2025-4-1 00:37 作者: Infirm 時(shí)間: 2025-4-1 03:09 作者: GLADE 時(shí)間: 2025-4-1 06:53 作者: 碎石頭 時(shí)間: 2025-4-1 11:22 作者: 即席演說(shuō) 時(shí)間: 2025-4-1 15:58
Advanced Bonding/Joining Techniques,onding process has extensive applications in silicon-glass bonding and glass-glass bonding. Diffusion bonding process forms chemical bonds by inter-diffusion of two different atoms over the bond line. Surface-activated bonding is valuable in bonding objects with large difference in coefficients of t
