標(biāo)題: Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 2017Latest edition Springer International Publishing Switzerland 2017 Microelec [打印本頁] 作者: Jefferson 時(shí)間: 2025-3-21 17:07
書目名稱Materials for Advanced Packaging影響因子(影響力)
書目名稱Materials for Advanced Packaging影響因子(影響力)學(xué)科排名
書目名稱Materials for Advanced Packaging網(wǎng)絡(luò)公開度
書目名稱Materials for Advanced Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Materials for Advanced Packaging被引頻次
書目名稱Materials for Advanced Packaging被引頻次學(xué)科排名
書目名稱Materials for Advanced Packaging年度引用
書目名稱Materials for Advanced Packaging年度引用學(xué)科排名
書目名稱Materials for Advanced Packaging讀者反饋
書目名稱Materials for Advanced Packaging讀者反饋學(xué)科排名
作者: laceration 時(shí)間: 2025-3-21 23:28
Dingyou Zhang,James J.-Q. Luremote resources in distributed environments. The local planner conducts resource negotiations with individual applications on behalf of the user, with the goal of maximizing the user‘s perceived utility of the set of running applications with respect to resource allocations for those applications.作者: 合唱團(tuán) 時(shí)間: 2025-3-22 03:26
Chin C. Lee,Chu-Hsuan Sha,Yuan-Yun Wu,Shou-Jen Hsusm. We study the effects of different task distribution strategies, prefetch, and software cache, and explore the tradeoff among different performance factors, stressing the interactions between different optimizations. This work offers some insights in the optimizations on heterogenous multi-core p作者: GORGE 時(shí)間: 2025-3-22 06:35
Paul A. Kohl Ph.D.ed the Grid task-bundle allocation problem into an iteration process involving retail price, market price and assignment amount of tasks. Extensive simulation experiments with real workload traces were conducted to verify our algorithm. The experimental results indicated that ISGBMAT could provide a作者: 宣傳 時(shí)間: 2025-3-22 10:01
Harry K. Charles Jr. Ph.D.nt the corresponding hardware mechanisms on Xilinx FPGA XCVU440. Experiments show that our hardware mechanisms can reduce at least . of the off-chip traffic. The mechanisms proposed by this paper can reach a peak performance of 64.034 GOPS with a frequency of 167?MHz.作者: 態(tài)學(xué) 時(shí)間: 2025-3-22 14:21 作者: curriculum 時(shí)間: 2025-3-22 20:46 作者: Autobiography 時(shí)間: 2025-3-22 23:25 作者: 不吉祥的女人 時(shí)間: 2025-3-23 04:12
Zhuqing Zhang Ph.D.,Pengli Zhu Ph.D.,C. P. Wong Ph.D.roposed to determine the number of tasks executed on MEC. Besides, each MD adopts his/her transmission power controlling strategy to compete the computation resource of MEC or minimize the energy consumption. A game model for illustrating the problem of task offloading is formulated to find a proper作者: defeatist 時(shí)間: 2025-3-23 06:23
Hideaki Sasajima,Itaru Watanabe,Makoto Takamoto,Kazuhiko Dakede,Shingo Itoh,Yoshinori Nishitani,Juni developed to make joining and accessing the Grid a ’plug-and-play’ process. VEGA has been implemented on Web Service platforms and all its components are OGSI-compliant services. To evaluate the overhead and performance of VEGA, we conducted experiments of two categories of benchmark set in a real 作者: 拱形面包 時(shí)間: 2025-3-23 13:31
Daniel Lu,C. P. Wongstore properties. In addition, we propose two new optimizations, parallel filtering and basic operations merging, to accelerate the metadata graph traversal. Our evaluation results show that GRAM can be effectively applied to user scenarios in HPC systems, and the performance of metadata management 作者: amnesia 時(shí)間: 2025-3-23 14:02
Shinji Takeda,Takashi Masuko,Nozomu Takano,Teiichi Inadata aggregation protocols for WSNs and highlight their major limitations. We claim that in future such limitations can be corrected. Our ongoing work is to propose an alternative solution to overcome such limitations, but this will be presented in a future paper.作者: 偏見 時(shí)間: 2025-3-23 21:29
Ravi Prasher Ph.D.,Chia-Pin Chiu Ph.D.urrent workload to adjust the page migration policy for future requests. With this mechanism, write requests are mainly redirected to DRAM, and the writes to PCM are reduced. In addition, FWQ-LRU can maintain the same hit ratio as LRU. We conduct comparative trace-driven experiments and the results 作者: Ganglion-Cyst 時(shí)間: 2025-3-24 00:06
Pulugurtha Markondeya Raj,Dok Won Lee Ph.D.,Liangliang Li Ph.D.,Shan Xiang Wang Ph.D.,Parthasarathi lock. We conducted accuracy and speed tests on the high-performance FT2000+ processor. Experimental results show that SuperFABdot(within) algorithm is more accurate than FABdot and SuperBlockdot. Compared with FABdot, SuperFABdot(outside) algorithm can achieve up?to 1.2. performance speedup while en作者: Intervention 時(shí)間: 2025-3-24 06:08 作者: 擋泥板 時(shí)間: 2025-3-24 07:44
Michael T?pperes a good trade-off between cost and reliability in order to minimize execution costs. Run our algorithm on randomly generated parallel applications of different scales and compare the experimental results with four advanced algorithms. The experiments show that the performance of the algorithm we p作者: 睨視 時(shí)間: 2025-3-24 13:06 作者: 惹人反感 時(shí)間: 2025-3-24 17:14
Mark Porter,Robert Erich,Mark Ricottas paper, we set out to answer these questions. We design and develop a Multi-Tenant Parallel CNN Inference Framework, ., to carefully evaluate the performance of various parallel execution modes with different data transfer modes between CPU/GPU and GPU platforms. We find that on more powerful GPUs 作者: 掃興 時(shí)間: 2025-3-24 21:00
I-Chun Cheng Ph.D.m in the surface membrane. The results of the experiment show that the proposed algorithm greatly reduces the analytical complexity of SML, and the calculation time is decreased by more than 5 times compared with the commonly used optimization algorithms such as GA, AM, and PSO.作者: 針葉樹 時(shí)間: 2025-3-25 02:13 作者: 抗生素 時(shí)間: 2025-3-25 05:02 作者: Explosive 時(shí)間: 2025-3-25 11:22 作者: motor-unit 時(shí)間: 2025-3-25 12:42 作者: idiopathic 時(shí)間: 2025-3-25 17:03
Advanced Bonding Technology Based on Nano- and Micro-metal Pastes, pastes have proven to be a feasible means of achieving high performance..A review of recent advances in the development of metal pastes for bonding technology is provided in this chapter. The basic bonding technology, fundamental concepts of metal pastes, and the fabrication processes of pastes are作者: Apogee 時(shí)間: 2025-3-25 21:37 作者: CLEAR 時(shí)間: 2025-3-26 04:03
Flexible and Printed Electronics,o-roll compatible and printable processes are adopted. Gravure printing, offset printing, and flexography printing are commonly used contact printing technologies. Microcontact printing, nanoimprint, and transfer printing are emerging printing methods, which are of particular interest for the flexib作者: Ischemia 時(shí)間: 2025-3-26 08:00 作者: 蔑視 時(shí)間: 2025-3-26 10:36
Yu-Chou Shih,Gunwoo Kim Ph.D.,Jiun-Pyng You,Frank G. Shi Ph.D.mong the high-quality submissions, only 32 regular papers were accepted by the conferences. All of the selected conference papers are included in the conference978-3-540-88139-1978-3-540-88140-7Series ISSN 0302-9743 Series E-ISSN 1611-3349 作者: BUDGE 時(shí)間: 2025-3-26 14:47
coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering..978-3-319-83209-8978-3-319-45098-8作者: 攤位 時(shí)間: 2025-3-26 17:09
re being conducted in the context of the Rialto operating system — an object-based real-time kernel and programming environment currently being developed within Microsoft Research..A primary goal of this research is to develop appropriate real-time programming abstractions to allow multiple independ作者: HUMP 時(shí)間: 2025-3-26 22:14 作者: aggressor 時(shí)間: 2025-3-27 03:51
Chin C. Lee,Chu-Hsuan Sha,Yuan-Yun Wu,Shou-Jen Hsuge number of synergistic processor elements, large register files, the ability to hide main-storage latency with concurrent computation and DMA transfers. The exploitation of those features requires the programmer to carefully tailor programs and simutaneously deal with various performance factors, 作者: impale 時(shí)間: 2025-3-27 05:49 作者: Fibroid 時(shí)間: 2025-3-27 12:43 作者: 惡心 時(shí)間: 2025-3-27 15:53 作者: asthma 時(shí)間: 2025-3-27 17:58
Doug C. H. Yu Ph.D.,Wen-Chih Chiou Ph.D.,Chih Hang Tungol algorithms have been proposed, wherein DX is the first latency-based one. Specifically, DX tackles the accurate latency measurement problem, reduces the flow completion time and outperforms the . DCTCP algorithm significantly in term of median queueing delay. Although the advantages of DX have be作者: 宣傳 時(shí)間: 2025-3-27 23:35
Bernd K. Appelt allocation in clouds involves two phases: virtual machine selection (VMS) and virtual machine placement (VMP), and they can be jointly considered. However, existing solutions separate VMS and VMP, therefore, they can only get local optimal resource utilization. In this paper, we explore how to opti作者: rheumatism 時(shí)間: 2025-3-28 03:05
Zhuqing Zhang Ph.D.,Pengli Zhu Ph.D.,C. P. Wong Ph.D.ices (MDs) with computation-intensive and delay-sensitive tasks. Facing with high requirements of many MDs, it’s essential for MEC with limited computation capacity to serve more MDs with QoS. For each mobile device, it is also desirable to have a low energy consumption with an expected deadline. To作者: Working-Memory 時(shí)間: 2025-3-28 06:30
Hideaki Sasajima,Itaru Watanabe,Makoto Takamoto,Kazuhiko Dakede,Shingo Itoh,Yoshinori Nishitani,Junierce communities. A global service management system in such context is required to achieve efficient resource sharing and collaborative service provisioning. This paper presents VEGA system software, a novel grid platform that combines experiences from operating system design and current IP network作者: 無法解釋 時(shí)間: 2025-3-28 10:35
Daniel Lu,C. P. Wongent variables, and the parameters of all executions, etc. Recent studies have shown the feasibility of using property graph to model rich metadata and utilizing graph traversal to query rich metadata stored in the property graph. We propose to utilize GPU to process the rich metadata graphs. There a作者: 無意 時(shí)間: 2025-3-28 17:25
Shinji Takeda,Takashi Masuko,Nozomu Takano,Teiichi Inadat, travel, industry, telemedicine, disaster and emergency management. Data aggregation is key technique for power-efficient information acquisition in WSNs. However, data privacy during data aggregation is an important issue when the WSN is deployed in sensitive data applications, such as telemedici作者: Confirm 時(shí)間: 2025-3-28 22:34 作者: 影響深遠(yuǎn) 時(shí)間: 2025-3-29 01:12 作者: 膽大 時(shí)間: 2025-3-29 05:08
Katsuaki Suganuma Ph.D.,Jinting Jiu Ph.D.ty of service. This paradigm addresses the problems in cloud computing architecture by enabling lower latency, higher bandwidth, and better privacy and security. Previous studies of task allocation in MEC systems generally only consider the single influence factor, such as the distance between the m作者: incubus 時(shí)間: 2025-3-29 10:10
Michael T?pperility of applications, it also brings a series of resource waste and overhead issues. Therefore, the efficiency-first fault-tolerant algorithm (EFFT) with minimum execution cost in the cloud application is proposed. This algorithm minimizes the execution cost of the application under the constraints作者: Engaged 時(shí)間: 2025-3-29 15:28 作者: GRIN 時(shí)間: 2025-3-29 16:37 作者: patella 時(shí)間: 2025-3-29 23:25
Mark Porter,Robert Erich,Mark Ricotta streams. Although CNNs demonstrate the state-of-the-art detection accuracy, processing multiple video streams using such models in real-time imposes a serious challenge to the on-car computing systems. The lack of optimized system support, for example, could lead to a significant frame loss due to 作者: 悲觀 時(shí)間: 2025-3-30 01:35
I-Chun Cheng Ph.D.nt direction of arrival (DOA) estimation algorithm. However, the extremely heavy computational complexity in the process of SML analysis restricts its application in practical systems. Aiming at this problem of SML, this paper proposes a parallel accelerating algorithm of membrane computing (MC), pa作者: ARCH 時(shí)間: 2025-3-30 06:13
3D Integration Technologies: An Overview, to overcome some physical, technological, and economic limits encountered in planar integrated circuits, extending Moore’s Law and enabling “More than Moore” applications. This chapter provides an overview of 3D integration technology, including review on its enabling technologies and the associate作者: 定點(diǎn) 時(shí)間: 2025-3-30 10:47 作者: Orthodontics 時(shí)間: 2025-3-30 12:53
Advanced Chip-to-Substrate Connections,sity of the transistors and larger chip size has also led to new challenges for chip-to-substrate connections. The pace of change in packaging and chip-to-substrate connections has accelerated because off-chip issues are increasingly a limiting factor in product cost and performance. Chip-to-substra作者: Increment 時(shí)間: 2025-3-30 20:19 作者: 最高點(diǎn) 時(shí)間: 2025-3-31 00:13
Lead-Free Soldering,ing practice was presented, and the properties of lead-free solder materials and soldering joints, including intermetallic compounds and microstructure evolution, were exemplified and discussed. Furthermore, the major categories of reliability of solder joints, including temperature cycling, fragili作者: 鉤針織物 時(shí)間: 2025-3-31 03:31 作者: STERN 時(shí)間: 2025-3-31 07:30
Advanced Substrates: A Materials and Processing Perspective,tes for flip chip BGA (FCBGA), tape substrates for tape BGA (TBGA), coreless substrates, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant dielectrics, and substrate with embedded components (active dies and/or passives). Future作者: 敏捷 時(shí)間: 2025-3-31 09:21 作者: 小步走路 時(shí)間: 2025-3-31 15:40 作者: Canvas 時(shí)間: 2025-3-31 20:18
Electrically Conductive Adhesives (ECAs), conductive adhesive technology has been made over the years. This chapter provides a comprehensive overview on the basic aspects, key applications in electronic packaging, and latest advances of both anisotropically conductive adhesives (ACAs) and isotropically conductive adhesives (ICAs).作者: 整體 時(shí)間: 2025-3-31 23:53 作者: ALIBI 時(shí)間: 2025-4-1 03:07 作者: Antagonism 時(shí)間: 2025-4-1 07:39
Embedded Passives,s enabled by the transformation of today’s surface-mounted discrete passives such as resistors, capacitors, and inductors as thin films embedded in the package substrate or buildup layers. Such a trend would lead to miniaturized and more efficient power systems..This chapter reviews the fundamentals
