標(biāo)題: Titlebook: MCM C/Mixed Technologies and Thick Film Sensors; W. Kinzy Jones,Karel Kurzweil,Sylvia Mergui Book 1995 Springer Science+Business Media Dor [打印本頁(yè)] 作者: infection 時(shí)間: 2025-3-21 16:43
書目名稱MCM C/Mixed Technologies and Thick Film Sensors影響因子(影響力)
書目名稱MCM C/Mixed Technologies and Thick Film Sensors影響因子(影響力)學(xué)科排名
書目名稱MCM C/Mixed Technologies and Thick Film Sensors網(wǎng)絡(luò)公開度
書目名稱MCM C/Mixed Technologies and Thick Film Sensors網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱MCM C/Mixed Technologies and Thick Film Sensors被引頻次
書目名稱MCM C/Mixed Technologies and Thick Film Sensors被引頻次學(xué)科排名
書目名稱MCM C/Mixed Technologies and Thick Film Sensors年度引用
書目名稱MCM C/Mixed Technologies and Thick Film Sensors年度引用學(xué)科排名
書目名稱MCM C/Mixed Technologies and Thick Film Sensors讀者反饋
書目名稱MCM C/Mixed Technologies and Thick Film Sensors讀者反饋學(xué)科排名
作者: 小說(shuō) 時(shí)間: 2025-3-21 23:08
NATO Science Partnership Subseries: 3http://image.papertrans.cn/m/image/620088.jpg作者: 抱狗不敢前 時(shí)間: 2025-3-22 03:38 作者: 小爭(zhēng)吵 時(shí)間: 2025-3-22 07:21 作者: 易改變 時(shí)間: 2025-3-22 12:15
MCM C/Mixed Technologies and Thick Film Sensors978-94-011-0079-3Series ISSN 1388-6576 作者: Pelvic-Floor 時(shí)間: 2025-3-22 13:12 作者: antidepressant 時(shí)間: 2025-3-22 19:49 作者: 枯萎將要 時(shí)間: 2025-3-22 23:53 作者: NAIVE 時(shí)間: 2025-3-23 04:45 作者: 集中營(yíng) 時(shí)間: 2025-3-23 07:24
Telecom Applications of MCM Technology,Telecom systems are seen as one of the major application areas for MCM technology. The most interesting application fields like portable terminals, and ATM networks are presented and discussed, as well as an overview on those aspects that are still to be improved to allow extensive use of MCM technology within the mentioned fields.作者: FAST 時(shí)間: 2025-3-23 11:50 作者: 參考書目 時(shí)間: 2025-3-23 17:23
Christian M. Valcted and unexplored. Home schooling is at an initial period, for the public, researchers, media and educational authorities in China it is mysterious and even abnormal or odd. This book seeks to bring a rich body of qualitative data to provide in-depth information in relation to the demographic char作者: Acetabulum 時(shí)間: 2025-3-23 21:49 作者: Canary 時(shí)間: 2025-3-23 22:52
P. Johnsson,C. Vaktn?s,N. Billstr?mcted and unexplored. Home schooling is at an initial period, for the public, researchers, media and educational authorities in China it is mysterious and even abnormal or odd. This book seeks to bring a rich body of qualitative data to provide in-depth information in relation to the demographic char作者: OTHER 時(shí)間: 2025-3-24 04:19 作者: 食物 時(shí)間: 2025-3-24 07:08 作者: Outspoken 時(shí)間: 2025-3-24 12:58 作者: Palatial 時(shí)間: 2025-3-24 15:38
Hans Hentzellcted and unexplored. Home schooling is at an initial period, for the public, researchers, media and educational authorities in China it is mysterious and even abnormal or odd. This book seeks to bring a rich body of qualitative data to provide in-depth information in relation to the demographic char作者: 依法逮捕 時(shí)間: 2025-3-24 21:04
Paul Dannerary of updated literature on home schooling in China.The literature in relation to home schooling grounded in empirical research and focusing on gender role and the impacts of social class has been neglected and unexplored. Home schooling is at an initial period, for the public, researchers, media a作者: 使堅(jiān)硬 時(shí)間: 2025-3-24 23:34
Z. Illyefalvi-Vitéz Ph.D.cted and unexplored. Home schooling is at an initial period, for the public, researchers, media and educational authorities in China it is mysterious and even abnormal or odd. This book seeks to bring a rich body of qualitative data to provide in-depth information in relation to the demographic char作者: 相同 時(shí)間: 2025-3-25 05:16
Charles Q. Scrantomroblems: (1) predicting the recurrence of breast cancer, (2) classifying iris flowers, (3) predicting survival for heart attack victims, and (4) predicting the dependent variable in a discrete event simulation. The simulation problem was based on a very simplified stock market model. In the process 作者: 哪有黃油 時(shí)間: 2025-3-25 10:15 作者: Euphonious 時(shí)間: 2025-3-25 11:46
W. K. Jones,M. A. Zampinoo Statistical Pattern Recognition, 1972; Duda et al., Pattern Classification, 2001; Boucheron et al., Theory of classification: A survey of some recent advances, 323–375, 2005), where each example is a pair constituted by the vector representation of an observation and its associated desired output.作者: scoliosis 時(shí)間: 2025-3-25 16:43 作者: 充氣球 時(shí)間: 2025-3-25 23:34
Nihal Sinnaduraiechnology, and professional schools) to produce engineering graduates capable of meeting the needs of Industry is not solely an Irish problem. HEIs need to re-think the way that engineering is taught to students, with the ultimate aim of producing engineering graduates that are capable of meeting th作者: Cloudburst 時(shí)間: 2025-3-26 00:21
3-D Interconnection Microsystems Applications,particularity of the approach initiated in 1989 at Thomson is that it was based on the concept of dual-purpose technologies. In fact, the French Ministry of Defence recommended the development of techniques that could be used for consumer products as well as ruggedized products in order to attain th作者: gonioscopy 時(shí)間: 2025-3-26 05:18
Analysis and optimization of circuit interconnect performance, also the on-chip driver and receiver characteristics. The behaviour of the interconnection line is primarely determined by the interconnect technology which is used. Low loss and generally relatively long printed circuit board interconnections behave differently than lossy MCM-type interconnections作者: 貨物 時(shí)間: 2025-3-26 09:42 作者: expdient 時(shí)間: 2025-3-26 14:31 作者: 教育學(xué) 時(shí)間: 2025-3-26 18:40 作者: geometrician 時(shí)間: 2025-3-27 00:58
High Performance Ceramic Modules and Packages,looking for lower cost alternatives than what has been available previously..With the advent of low temperature dielectric tape, finer grind thick film conductor inks and higher resolution emulsions a much higher density ceramic multichip module is now possible. This module is approaching what has b作者: eucalyptus 時(shí)間: 2025-3-27 02:27 作者: ABASH 時(shí)間: 2025-3-27 07:15 作者: 使激動(dòng) 時(shí)間: 2025-3-27 11:28
ALN Cofired MCM-C/D,ay with thin film processing, and the high speed (>2 GHz) electrical performance of deposited TiW-Au / polyimide interconnections and the cofired tungsten vias. The test cell supports a multilayer interconnect structure designed to allow for characterization of signal propagation properties (e.g. im作者: 豐富 時(shí)間: 2025-3-27 15:32 作者: 有其法作用 時(shí)間: 2025-3-27 18:03 作者: JOT 時(shí)間: 2025-3-28 01:13
Mass Memory Packaging for Space Applications, the satellite is not always in visibility of earth stations, and so cannot transmit its informations in real time. Optical and radar instruments are now generating high output data rates ten times higher than the maximum speed of the link between the spacecraft and the ground. The required capacity作者: 遠(yuǎn)足 時(shí)間: 2025-3-28 04:56 作者: intelligible 時(shí)間: 2025-3-28 09:30
Multi-Chip Module Applications in Satellite Communications,s (MCMs) and low cost packaging technologies — whose properties offer significant advantages in space and locations involving exposure to radiation. Communication via satellites located in space require performance at high frequencies in the microwave range (delivered by silicon or GaAs MMICs- monol作者: Hemodialysis 時(shí)間: 2025-3-28 11:06 作者: Fibroid 時(shí)間: 2025-3-28 15:28 作者: debunk 時(shí)間: 2025-3-28 18:48 作者: Consensus 時(shí)間: 2025-3-28 23:16 作者: Pseudoephedrine 時(shí)間: 2025-3-29 05:29 作者: Texture 時(shí)間: 2025-3-29 08:27
High Performance Interconnect on Cofired Ceramic,s of high performance packaging. This paper illustrates one of the specific project tasks aimed at building a complex MCM-D (Polyimide-Copper on multilayer ceramic substrate) module populated with TAB bonded CMOS VLSI chips.作者: 入伍儀式 時(shí)間: 2025-3-29 13:45 作者: SOBER 時(shí)間: 2025-3-29 19:17
Very Fine Line Photoimageable Thick Film Technology Developed at Hibridas, Lithuania,’ was set up during 1972 and specialized in the design and manufacture of microwave devices. Facilities included thick and thin film production equipment as well as metal packaging and hermetic sealing capability.作者: conformity 時(shí)間: 2025-3-29 20:44
Mass Memory Packaging for Space Applications,now generating high output data rates ten times higher than the maximum speed of the link between the spacecraft and the ground. The required capacity for year 1998 is around 100 Gbit, end of life, and the input data rate is 400 Mbit/s minimum.作者: 過(guò)渡時(shí)期 時(shí)間: 2025-3-30 03:13
Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications,f which have approximately 300 pins with a pitch of 120 μm. The chips are wire bonded on the module. The module will be mounted face down on the motherboard. The first prototypes proved to be functional.作者: 破布 時(shí)間: 2025-3-30 04:17 作者: GNAT 時(shí)間: 2025-3-30 10:48 作者: Pathogen 時(shí)間: 2025-3-30 15:58 作者: Ambulatory 時(shí)間: 2025-3-30 16:38 作者: HAIL 時(shí)間: 2025-3-30 23:05
Joris Peeters,Eric Beyned in their home schooling? - What is accomplished in doing so? This book is the first book in relation to home schooling in China. This book will be essential reading for researchers, postgraduate studen978-94-6209-000-2作者: DIS 時(shí)間: 2025-3-31 03:21
G. Harsányi Ph.D.d in their home schooling? - What is accomplished in doing so? This book is the first book in relation to home schooling in China. This book will be essential reading for researchers, postgraduate studen978-94-6209-000-2作者: BUOY 時(shí)間: 2025-3-31 06:02 作者: Morsel 時(shí)間: 2025-3-31 12:47
S. Fazelpour,B. B?like,R. Brodowski,R. Dümcke,H. Reichl作者: 割讓 時(shí)間: 2025-3-31 16:46
Book 1995efittedfrom such new materials as cofire AIN and diamond. .MCM-C technology is compatible with thick film sensors, and work isreviewed on environmental gas sensors, pressure and temperaturesensors, and the development of novel materials in this area. .作者: facetious 時(shí)間: 2025-3-31 19:10 作者: 祖?zhèn)髫?cái)產(chǎn) 時(shí)間: 2025-4-1 01:45
High Performance Ceramic Modules and Packages,nd the extreme ruggedness of the resulting package. the improved thermal characteristics, ease of assembly and low cost will make this packaging technique a practical solution for todays demands..This presentation will explore how these densities are achieved, their electrical, thermal and mechanica作者: 減少 時(shí)間: 2025-4-1 03:01
