標(biāo)題: Titlebook: Low Power Interconnect Design; Sandeep Saini Book 2015 Springer Science+Business Media New York 2015 Embedded Systems.Integrated Circuit D [打印本頁] 作者: Scuttle 時(shí)間: 2025-3-21 16:22
書目名稱Low Power Interconnect Design影響因子(影響力)
書目名稱Low Power Interconnect Design影響因子(影響力)學(xué)科排名
書目名稱Low Power Interconnect Design網(wǎng)絡(luò)公開度
書目名稱Low Power Interconnect Design網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Low Power Interconnect Design被引頻次
書目名稱Low Power Interconnect Design被引頻次學(xué)科排名
書目名稱Low Power Interconnect Design年度引用
書目名稱Low Power Interconnect Design年度引用學(xué)科排名
書目名稱Low Power Interconnect Design讀者反饋
書目名稱Low Power Interconnect Design讀者反饋學(xué)科排名
作者: 執(zhí) 時(shí)間: 2025-3-21 23:27 作者: 巧辦法 時(shí)間: 2025-3-22 03:22 作者: Affection 時(shí)間: 2025-3-22 06:00
Schmidt Trigger Approachhnique in very large scale integration (VLSI) interconnects. This chapter deals with another device called Schmidt trigger as a repeater element in interconnects. We would discuss the basic Schmidt trigger and its properties, CMOS implementation of Schmidt trigger and its application in interconnects.作者: 踉蹌 時(shí)間: 2025-3-22 11:44 作者: pacifist 時(shí)間: 2025-3-22 14:58 作者: compassion 時(shí)間: 2025-3-22 19:29 作者: Parameter 時(shí)間: 2025-3-22 22:46 作者: 火車車輪 時(shí)間: 2025-3-23 03:42 作者: 異教徒 時(shí)間: 2025-3-23 08:46 作者: 迎合 時(shí)間: 2025-3-23 11:36 作者: 看法等 時(shí)間: 2025-3-23 16:06
Sandeep Sainin and simple non-spatial land cover proportions to assess predictability of both surface water quality and ecological integrity within watersheds of the state of Pennsylvania (USA)..978-1-4419-4249-4978-0-387-37685-1Series ISSN 2363-9660 Series E-ISSN 2363-9679 作者: Hiatus 時(shí)間: 2025-3-23 19:59 作者: seroma 時(shí)間: 2025-3-23 23:56 作者: Noctambulant 時(shí)間: 2025-3-24 05:17
Sandeep Sainin and simple non-spatial land cover proportions to assess predictability of both surface water quality and ecological integrity within watersheds of the state of Pennsylvania (USA)..978-1-4419-4249-4978-0-387-37685-1Series ISSN 2363-9660 Series E-ISSN 2363-9679 作者: 小卒 時(shí)間: 2025-3-24 07:25 作者: analogous 時(shí)間: 2025-3-24 14:10 作者: 單片眼鏡 時(shí)間: 2025-3-24 17:48
e, a geographic expansion favors the commingling of composite or opposite principles. The second section of the book analyzes ways in which elective or imposed coexistence of diverse agents on a geographic field kindle a process that evolves from juxtaposition to reciprocal permeation and eventually作者: 消散 時(shí)間: 2025-3-24 19:55
l sequence moving from elemental to elaborate: .-.; habitat; environment; territory; cultural landscape; cognitive landscape. The chapter discusses various positions that have been recently confronting over the notion of landscape, whose alternative landscape paradigms gather around two opposite fro作者: 牽索 時(shí)間: 2025-3-25 00:26 作者: NEEDY 時(shí)間: 2025-3-25 04:15 作者: 乏味 時(shí)間: 2025-3-25 10:06 作者: 搖曳 時(shí)間: 2025-3-25 13:20 作者: vasculitis 時(shí)間: 2025-3-25 17:55 作者: 表示向前 時(shí)間: 2025-3-25 22:53
is the preservation and remediation of ecosystem integrity. This requires monitoring and assessment over large geographic areas, repeatedly over time, and cannot be practically fulfilled by field measurements alone. Remotely sensed imagery plays a crucial role by its ability to monitor large spatial作者: 口訣法 時(shí)間: 2025-3-26 02:24 作者: Infiltrate 時(shí)間: 2025-3-26 07:47
Introduction to Interconnects such as parasitic extraction, interconnect models, and interconnect design methodologies. In this chapter, a brief review of the background of on-chip electrical interconnect is provided. In Sect.?1.1, a typical design flow for application-specific integrated circuits (ASICs) is described. Challeng作者: AUGUR 時(shí)間: 2025-3-26 12:08
CMOS Buffernverter is to invert the input signal to the opposite logic level. Thus a cascaded combination of two such circuits will bring back the input signal to the original level. This property of CMOS buffer is extremely helpful in signal restoration in communicating over long wires. Before we discuss CMOS作者: insular 時(shí)間: 2025-3-26 15:06
Buffer Insertion as a Solution to Interconnect Issueso the deep sub-micron regime, the on-chip interconnect has become the primary bottleneck in signal flow within high complexity, high speed integrated circuits (ICs).The smaller feature size in DSM technology nodes reduces the delay of the active devices, however, the effect on delay due to the passi作者: 樹上結(jié)蜜糖 時(shí)間: 2025-3-26 18:48 作者: 水獺 時(shí)間: 2025-3-26 22:58 作者: Muffle 時(shí)間: 2025-3-27 04:58
Bus Coding Techniquesp design. In particular, the coupling effects between wires on the bus can cause serious problems such as crosstalk delay, noise and power consumption. One of the fastest growing areas in computing industry is the provision of high throughput low power digital signal processing (DSP) and Communication systems.作者: dagger 時(shí)間: 2025-3-27 07:18 作者: Gudgeon 時(shí)間: 2025-3-27 12:37 作者: 征稅 時(shí)間: 2025-3-27 14:15 作者: averse 時(shí)間: 2025-3-27 19:41
https://doi.org/10.1007/978-1-4614-1323-3Embedded Systems; Integrated Circuit Design; Interconnect Buffer Insertion; Network on Chip; On-chip int
