標(biāo)題: Titlebook: Lens Epithelium and Posterior Capsular Opacification; Shizuya Saika,Liliana Werner,Frank J. Lovicu Book 2014 Springer Japan 2014 biomateri [打印本頁] 作者: CULT 時(shí)間: 2025-3-21 18:12
書目名稱Lens Epithelium and Posterior Capsular Opacification影響因子(影響力)
書目名稱Lens Epithelium and Posterior Capsular Opacification影響因子(影響力)學(xué)科排名
書目名稱Lens Epithelium and Posterior Capsular Opacification網(wǎng)絡(luò)公開度
書目名稱Lens Epithelium and Posterior Capsular Opacification網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Lens Epithelium and Posterior Capsular Opacification被引頻次
書目名稱Lens Epithelium and Posterior Capsular Opacification被引頻次學(xué)科排名
書目名稱Lens Epithelium and Posterior Capsular Opacification年度引用
書目名稱Lens Epithelium and Posterior Capsular Opacification年度引用學(xué)科排名
書目名稱Lens Epithelium and Posterior Capsular Opacification讀者反饋
書目名稱Lens Epithelium and Posterior Capsular Opacification讀者反饋學(xué)科排名
作者: 分開如此和諧 時(shí)間: 2025-3-21 22:47 作者: trigger 時(shí)間: 2025-3-22 02:21
Natural Course of Elschnig Pearl Formation and Disappearanceears after Nd:YAG capsulotomy groups of Elschnig pearls at the capsulotomy margin were observed, so-called pearl strings..Knowledge about Elschnig pearl turnover with and without treatment could be of importance for attempts to modulate lens epithelial cell regeneration or lens regrowth as well as for lens refilling procedures.作者: 手工藝品 時(shí)間: 2025-3-22 06:40 作者: arboretum 時(shí)間: 2025-3-22 08:49 作者: 獸群 時(shí)間: 2025-3-22 14:39
Book 2014rior capsular opacification (PCO). PCO remains the most common long-term complication of modern cataract surgery, occurring months or years after cataract surgery, unlike most other complications that tend to arise during or soon after the procedure. Opacification of the posterior capsule appears to作者: 斥責(zé) 時(shí)間: 2025-3-22 18:43 作者: 一夫一妻制 時(shí)間: 2025-3-22 21:48 作者: Felicitous 時(shí)間: 2025-3-23 05:19 作者: 易碎 時(shí)間: 2025-3-23 06:15 作者: Tracheotomy 時(shí)間: 2025-3-23 10:25 作者: tenosynovitis 時(shí)間: 2025-3-23 15:37 作者: anarchist 時(shí)間: 2025-3-23 21:17 作者: Arrhythmia 時(shí)間: 2025-3-23 23:18
Judith A. West-Mays,Anna Korolde at each level of packaging to form the most reliable prod.Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass elec作者: 托運(yùn) 時(shí)間: 2025-3-24 05:23
F. J. Lovicu,L. Iyengar,L. J. Dawes,J. W. McAvoy digital- and mixed system circuits.Plan of attack based on .Taking a three-pronged approach – test engineering from traditional-test, design and manufacturing view-points – .Integrated Circuit Test Engineering. encapsulates the subject as it stands today. After introductory background from basic te作者: Arthritis 時(shí)間: 2025-3-24 08:54
Robb U. de Iongh,Melinda K. Duncan digital- and mixed system circuits.Plan of attack based on .Taking a three-pronged approach – test engineering from traditional-test, design and manufacturing view-points – .Integrated Circuit Test Engineering. encapsulates the subject as it stands today. After introductory background from basic te作者: 定點(diǎn) 時(shí)間: 2025-3-24 12:30
Ales Cvekl,Ilana B. Friedman,Elena V. Seminaoduced intelligent micro-systems will be present in virtually every person and every object he/she is in touch with. System sce-narists create a plethora of e-Dreams whereby the world starts to adapt to the wishes of the consumer wherever he/she may be..The adaptiveness of such systems means that th作者: 6Applepolish 時(shí)間: 2025-3-24 15:02
Konstantinos Sousounis,Kenta Nakamura,Panagiotis A. Tsonis several locations in Europe. Over the years, PATMOS has gained recognition as one of the major European events devoted to power and timing aspects of integrated circuit and system design. Despite its signi?cant growth and development, PATMOS can still be considered as a very informal forum, featuri作者: macabre 時(shí)間: 2025-3-24 19:03
I. M. Wormstone,J. A. Eldred,L. J. Dawes SystemC AMS extensions. The AMS extensions target system-level design at architecture level, enabling true analog/digital co-design where AMS and digital HW/SW subsystems can be simulated together in an efficient manner. The first talk, presented by Martin Barnasconi from NXP Semiconductors, addres作者: FACT 時(shí)間: 2025-3-25 01:18 作者: inhibit 時(shí)間: 2025-3-25 04:54 作者: ALIAS 時(shí)間: 2025-3-25 08:06 作者: 昏迷狀態(tài) 時(shí)間: 2025-3-25 15:34
Shannon Stallings M.D.,Liliana Werner M.D., Ph.D.ing better execution times, while preserving design flexibility. It is based on a new load balancing technique which distributes the initial nested loop’s workload to a variable user-defined number of Processing Elements (PEs) for execution. The flexibility offered by the proposed architecture is ba作者: ZEST 時(shí)間: 2025-3-25 16:35
unctional properties like timing, power consumption, and temperature need to be validated against given requirements on all abstraction levels. For timing and power consumption at RT- and gate-level several techniques are available, but there is still a lack of methods and tools for power estimation作者: MIRE 時(shí)間: 2025-3-25 22:38 作者: ethnology 時(shí)間: 2025-3-26 01:31
. As technology continues to scale, the variability in process parameters may cause significant deviations in device behaviour. The complexity of designing spiral inductors has lead to the development of multi-objective optimization based design methodologies yielding the generation of Pareto-optima作者: WATER 時(shí)間: 2025-3-26 07:27 作者: 蛛絲 時(shí)間: 2025-3-26 08:44 作者: 最小 時(shí)間: 2025-3-26 15:31 作者: 滔滔不絕地講 時(shí)間: 2025-3-26 18:08
The Lens Capsule: Synthesis, Remodeling, and MMPsf type IV collagen and laminin along with additional extracellular matrix (ECM) components such as entactin/nidogen, heparin sulfate proteoglycans (HSPG), and secreted protein acidic and rich in cysteine (SPARC), which act to stabilize the lens capsule structure. As the lens grows during development作者: Gratulate 時(shí)間: 2025-3-27 00:53 作者: THROB 時(shí)間: 2025-3-27 04:11
Growth Factor Signaling in Lens Fiber Differentiation, PDGF, as well as Wnts, Notch, and BMPs have been implicated in the regulation of lens fiber cell differentiation, although the preponderance of evidence suggests that FGFs provide the major signal for this process. It is becoming increasingly apparent that complex interactions between the signalin作者: scotoma 時(shí)間: 2025-3-27 06:46 作者: 去才蔑視 時(shí)間: 2025-3-27 10:45
Lens Regenerationom the iris while frog tadpoles from the cornea. Transdifferentiation is the term used to describe the cellular and molecular events that underlie lens regeneration, which involves a terminally differentiated tissue (iris) to change and give rise to a different differentiated tissue (lens). This cha作者: 我邪惡 時(shí)間: 2025-3-27 16:43 作者: 人充滿活力 時(shí)間: 2025-3-27 19:21 作者: 不怕任性 時(shí)間: 2025-3-27 23:57 作者: 巧辦法 時(shí)間: 2025-3-28 05:04 作者: generic 時(shí)間: 2025-3-28 09:11
Natural Course of Elschnig Pearl Formation and Disappearance different types of regeneratory posterior capsule opacification is given. In a second part, the natural course of Elschnig pearls within days and weeks without treatment is explained. Elschnig pearls disappear and appear within days. The degree of progression and regression varies greatly between t作者: Synovial-Fluid 時(shí)間: 2025-3-28 12:35 作者: 充滿人 時(shí)間: 2025-3-28 15:13
Size of Continuous Curvilinear Capsulorhexis for Prevention of PCOh as the size of CCC, in-the-bag IOL implantation, and sealed capsule irrigation also can influence the formation of PCO..Size of the CCC is discussed in this chapter. Between large and small capsulorhexis, significantly greater wrinkling of the posterior capsule and worse posterior capsular opacifi作者: 厚臉皮 時(shí)間: 2025-3-28 20:27 作者: 雜役 時(shí)間: 2025-3-28 23:52 作者: Prostatism 時(shí)間: 2025-3-29 07:04
I. M. Wormstone,J. A. Eldred,L. J. Dawesof run-time reconfigurable, heterogeneous systems was explained. The various AMS application domains where SystemC-AMS modeling can be applied were presented in the third talk, by Karsten Einwich from Fraunhofer IIS/EAS. The use of SystemC-AMS for the design and verification of Complex Analog/Mixed-作者: 難管 時(shí)間: 2025-3-29 09:55
Kumi Shirai M.D., Ph.D.,Ai Kitano-Izutani M.D., Ph.D.,Takeshi Miyamoto M.D., Ph.D.,Sai-ichi Tanaka Minto the abstract execution pattern by the optimal configuration without taking into account voltage scaling overhead, and then we can find the optimal configuration considering voltage scaling overhead by deleting some voltage scaling points from the execution pattern. Finally, the remaining points作者: 失誤 時(shí)間: 2025-3-29 11:41 作者: 不妥協(xié) 時(shí)間: 2025-3-29 19:38 作者: aggrieve 時(shí)間: 2025-3-29 20:40
Shannon Stallings M.D.,Liliana Werner M.D., Ph.D.(dynamic scheduling) and the flexibility this implementation offers. To the best of our knowledge this is the first hardware dynamic scheduler, proposed for fine grain parallelism of nested loops with dependencies. Performance estimation results and limitations are presented both analytically and th作者: 有限 時(shí)間: 2025-3-30 03:31 作者: Range-Of-Motion 時(shí)間: 2025-3-30 06:02
Ken Hayashi M.D.pdating their ECC is avoided effectively reducing L2 cache traffic and access frequency..Using our solution, we reduce L2 cache access frequency by 8% while maintaining performance. We reduce L2 cache dynamic and overall cache energy by up to 32% and 8%, respectively. Furthermore, TCC reduces L2 cac作者: 衰老 時(shí)間: 2025-3-30 09:24
ions, is used for electing the best design solutions.The evaluation of the extended set of sub-optima solutions requires methods capable to find the set of local optima, since solutions that are close to each other in the performance index space may be very distant in the design parameter space.作者: 新陳代謝 時(shí)間: 2025-3-30 15:41 作者: Antagonism 時(shí)間: 2025-3-30 17:27
s using build up/sequential processes...Integrated Circuit Packaging, Assembly and Interconnections. is an introduction, a review and an update of packaging technologies..978-1-4419-3923-4978-0-387-33913-9作者: Metamorphosis 時(shí)間: 2025-3-30 23:26
s using build up/sequential processes...Integrated Circuit Packaging, Assembly and Interconnections. is an introduction, a review and an update of packaging technologies..978-1-4419-3923-4978-0-387-33913-9
