作者: Crumple 時(shí)間: 2025-3-21 22:13 作者: 敘述 時(shí)間: 2025-3-22 04:22
Dynamic Mechanical Reliability Test and Analysis,iability to accidental or repeated drop events. Impact drop test and solder joint reliability investigations for Pb-based and Pb-free soldered assemblies were investigated. Explicit dynamic FEA modeling and simulation of the board-level drop test were used to predict the transient vibration deformat作者: 口訣法 時(shí)間: 2025-3-22 04:56
mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure?subject to?thermal cycling,?mechanical bending fatigue, vibration fatigue?and board-level drop impact tests..978-1-4899-9116-4978-1-4614-0463-7作者: indices 時(shí)間: 2025-3-22 09:54
Book 2012constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure?subject to?thermal cycling,?mechanical bending fatigue, vibration fatigue?and board-level drop impact tests..作者: 格子架 時(shí)間: 2025-3-22 16:15 作者: Override 時(shí)間: 2025-3-22 18:31 作者: invert 時(shí)間: 2025-3-22 23:23
John Hock Lye Panging feeling of togetherness while engaging in short bursts of physical activity. We designed a hybrid game based on these implications and examined the perceived impact of our design had on seniors’ social engagement and physical activity. Based on our findings, we contribute implications for game d作者: Exaggerate 時(shí)間: 2025-3-23 05:15 作者: 燕麥 時(shí)間: 2025-3-23 06:17
John Hock Lye Pangclude the emergence of include strategic gaming approaches for navigating the virtual environment and the absence of motion sickness in the institutionalized group. This research underscores the potential of digital tourism as a viable and beneficial alternative, offering insights into its multiface作者: 招致 時(shí)間: 2025-3-23 11:19 作者: crutch 時(shí)間: 2025-3-23 15:39
John Hock Lye Pangcognisable, especially the ones include children’ faces. A strong, positive correlation between the attitude and recognisable ranking was identified, which was statistically significant (.?=?0.000). The similar results have been found between the attention and recognisable ranking (.?=?0.002). . The作者: Ledger 時(shí)間: 2025-3-23 21:10
John Hock Lye Pang intelligent service system for the urban empty nest family and make the research of innovation strategy from the point of view of supply and demand matching, then gives some suggestions on the right and responsibility orientation of different subjects.作者: Rebate 時(shí)間: 2025-3-24 00:44 作者: 大門在匯總 時(shí)間: 2025-3-24 04:11
J. H. L. Pangof recording, knowledge, safety and convenience of ecotourism is brought to the active aging group through the assistance of technology. (2) From the investigation of technology demand, the study developed consistency, flexibility, efficiency, artistic and simplified design, visibility, feedback, at作者: 賄賂 時(shí)間: 2025-3-24 08:45 作者: outskirts 時(shí)間: 2025-3-24 14:33
Introduction,try. The importance of solder joint reliability testing and assessments is described within a framework of a DFR methodology. This DFR methodology provides a systematic approach to understanding the mechanics of deformation of solder materials, characterizing the mechanical properties, constitutive 作者: llibretto 時(shí)間: 2025-3-24 15:10 作者: GRE 時(shí)間: 2025-3-24 22:40
Mechanical Properties and Constitutive Models, strength. These mechanical properties are highly dependent on test temperature and test strain rate. For high strain-rate test conditions, a Split-Hopkinson pressure bar (SHPB) test method was employed for measuring strain-rate influence on the yield stress of lead-free solder material. Comparisons作者: Urea508 時(shí)間: 2025-3-24 23:38 作者: ethereal 時(shí)間: 2025-3-25 07:12
Finite Element Analysis and Design-for-Reliability,g techniques have been developed for three-dimensional models, sub-modeling, and global–local modeling techniques. The global–local 3D modeling techniques like sub-modeling and Global–Local-Beam (GLB) methods, were applied to model solder joint reliability behavior for various test cases of thermal 作者: 諷刺 時(shí)間: 2025-3-25 08:47 作者: 補(bǔ)角 時(shí)間: 2025-3-25 13:16 作者: 橫條 時(shí)間: 2025-3-25 17:14 作者: 生氣地 時(shí)間: 2025-3-25 22:51 作者: Gingivitis 時(shí)間: 2025-3-26 02:20
John Hock Lye Pangstacles hindering seniors from effectively utilizing such products by employing qualitative and quantitative methodologies. The Analytic Hierarchy Process (AHP) is employed to construct an objective decision model and evaluation framework, which assesses the impact of different interaction barriers 作者: 束縛 時(shí)間: 2025-3-26 08:16 作者: 群居男女 時(shí)間: 2025-3-26 10:28
John Hock Lye Pange. Early and effective intervention or treatment is essential to prevent the progression of MCI to Alzheimer’s disease in older adults. Art therapy, as one of the non-pharmacological approaches to creative activities through the medium of art, improves mood, cognition, and performance. Simultaneousl作者: 創(chuàng)新 時(shí)間: 2025-3-26 12:56 作者: 鎮(zhèn)壓 時(shí)間: 2025-3-26 19:50
John Hock Lye Pangsociated with aging is increasing rapidly – medical, biological, psychological, economic, and social etc. Population ageing and growing number of elderly population demands for healthcare and technology enabled-services. Factors associated with ageing population are essential for to ensure progress 作者: 享樂(lè)主義者 時(shí)間: 2025-3-27 00:41 作者: Decline 時(shí)間: 2025-3-27 02:19 作者: faddish 時(shí)間: 2025-3-27 07:23
John Hock Lye Pang care robots could be a potent solution to meet shortcomings in the health care sector. Even though the potential of robotic home care assistance is promising, the question if older persons would accept a robotic assistance at home is still underexplored. Adopting a three-step procedure, older adult作者: 蝕刻術(shù) 時(shí)間: 2025-3-27 09:38
J. H. L. Pangand experiences that raise their qualities of living. Therefore a solution to enhance ecotourism experiences of the advanced age group would be a major consideration in the future. A tendency of elevating knowledge and experiences of the active aging group with assistance of technology is anticipate作者: 恃強(qiáng)凌弱的人 時(shí)間: 2025-3-27 16:12
constructions to the interactive information output from the perspective of interaction mechanism according to interactive demands on the basis of the life styles, behavioral characteristics and behavior patterns of the elderly population. The structure form is manifested as cognitiom-understanding-作者: Constrain 時(shí)間: 2025-3-27 18:36
s theory in elastic, plastic, creep, fatigue and fracture as.Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the?global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, n作者: 瑪瑙 時(shí)間: 2025-3-28 00:55
Introduction,models for creep and viscoplastic analysis, fatigue life prediction models, which are then employed in a finite element modeling and simulation analysis to assess the solder joint reliability performance.作者: inventory 時(shí)間: 2025-3-28 02:38 作者: V切開(kāi) 時(shí)間: 2025-3-28 08:58
Thermal Cycling Aging Effects on Board-Level Drop Test Result,sult in IMC growth and thermal fatigue damage. The IMC growth, as well as the void/crack formation subject to thermal cycling aging will affect the long-term solder joint reliability performance. It can also affect the impact shock reliability as thicker IMC layer causes brittle fracture failure.作者: nonsensical 時(shí)間: 2025-3-28 13:50
Theory on Mechanics of Solder Materials,theory on mechanics of solder materials will focus on elastic-plastic-creep and viscoplastic models for describing the thermo-mechanical deformation response of lead-free solder materials operating over a wide range of temperatures (?40°C to +125°C) and strain rates (0.0001–1,000 s.).作者: 引導(dǎo) 時(shí)間: 2025-3-28 16:20
Finite Element Analysis and Design-for-Reliability,ques like sub-modeling and Global–Local-Beam (GLB) methods, were applied to model solder joint reliability behavior for various test cases of thermal cycling, vibration, and impact drop tests. Implementation of the nonlinear mechanics of materials models have been integrated to the ANSYS finite element analysis program.作者: 薄荷醇 時(shí)間: 2025-3-28 22:31
Mechanical Properties and Constitutive Models,dels were curve-fitted for the range of temperatures (?40°C to +125°C) and strain-rates (0.0001–1,000 s.) tested. Creep tests results are presented in steady state creep models. A rate dependent viscoplastic deformation model by Anand, was fitted to the test data from the creep test and tensile test of Sn–Ag–Cu, Sn–Cu, and Sn–Pb solder alloys.作者: 小溪 時(shí)間: 2025-3-29 02:56 作者: –DOX 時(shí)間: 2025-3-29 04:39
978-1-4899-9116-4Springer Science+Business Media, LLC 2012作者: 固執(zhí)點(diǎn)好 時(shí)間: 2025-3-29 07:23
https://doi.org/10.1007/978-1-4614-0463-7Creep models; Fatigue Models; Lead-Free Solder; Mechanics of Materials; Solder Joint
