標(biāo)題: Titlebook: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces; Qingke Zhang Book 2016 Springer-Verl [打印本頁] 作者: 動詞 時間: 2025-3-21 18:23
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces影響因子(影響力)
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces影響因子(影響力)學(xué)科排名
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces網(wǎng)絡(luò)公開度
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces被引頻次
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces被引頻次學(xué)科排名
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces年度引用
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces年度引用學(xué)科排名
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces讀者反饋
書目名稱Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces讀者反饋學(xué)科排名
作者: 持久 時間: 2025-3-21 22:11 作者: indenture 時間: 2025-3-22 03:57 作者: BLUSH 時間: 2025-3-22 05:48 作者: 禁止 時間: 2025-3-22 10:59
Qingke Zhangwer and flexibility of ROP attacks was recently demonstrated using . ROP tactics (.), whereby an adversary repeatedly leverages a memory disclosure vulnerability to identify useful instruction sequences and compile them into a functional ROP payload at runtime. Since the advent of just-in-time code 作者: DEAF 時間: 2025-3-22 15:32 作者: Semblance 時間: 2025-3-22 18:30 作者: Pruritus 時間: 2025-3-22 23:13 作者: Immunotherapy 時間: 2025-3-23 04:35 作者: Pudendal-Nerve 時間: 2025-3-23 06:01 作者: 可忽略 時間: 2025-3-23 11:41
Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints,r joints usually consist of a strain hardening stage, a steady deformation stage, and an accelerating fracture stage. For the Sn–4Ag/Cu solder joints, the strain increases rapidly during the initial few cycles, until strain hardening reaches a saturated state. After that the strain increases linearl作者: 字的誤用 時間: 2025-3-23 17:27 作者: tinnitus 時間: 2025-3-23 20:06
Conclusions,ation, a series of experimental schemes were designed according to the structure of the Pb-free solder joints and the loadings applied on them; the damage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability eva作者: Anemia 時間: 2025-3-23 22:50
978-3-662-51725-3Springer-Verlag Berlin Heidelberg 2016作者: Offset 時間: 2025-3-24 05:53
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces978-3-662-48823-2Series ISSN 2190-5053 Series E-ISSN 2190-5061 作者: Senescent 時間: 2025-3-24 07:04 作者: 雪崩 時間: 2025-3-24 11:36 作者: CLOT 時間: 2025-3-24 18:33
Springer Theseshttp://image.papertrans.cn/i/image/474812.jpg作者: 擦掉 時間: 2025-3-24 19:16 作者: 減震 時間: 2025-3-25 02:11 作者: chemical-peel 時間: 2025-3-25 06:37
Research Progress in Pb-Free Soldering,der have been proposed, their interfacial reaction behavior with common substrates and properties of the solder joints were studied, while the damage mechanisms have not been comprehensively revealed. For this reason, in this study a series of experiments were designed to reveal the damage behavior of the solder joints under different loadings.作者: Morose 時間: 2025-3-25 09:27
Conclusions,mage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability evaluation of the Pb-free solder joints.?Based on the experimental results and discussions, the following conclusions are drawn.作者: Measured 時間: 2025-3-25 13:19
2190-5053 oading.In-situ characterizationtechniques are used to reveal.This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions. The fracture behavior of Pb-free joint interfaces in作者: malapropism 時間: 2025-3-25 19:40
Tensile-Compress Fatigue Behavior of Solder Joints,y important roles in the fatigue lives by influencing the crack initiation and propagation path, while the interfacial microstructure determines the cycles of crack propagation by dominating the final fracture.作者: Polydipsia 時間: 2025-3-25 22:20 作者: 過于光澤 時間: 2025-3-26 03:37 作者: PAN 時間: 2025-3-26 07:10 作者: ECG769 時間: 2025-3-26 10:09
Qingke Zhang attacks, minor observations, and associated security vulnerabilities of this protocol. Since the number of commercially available communication components is small, these findings can easily be ported to other protocols such as (HOTT, S-FHSS, FrSky, and others). Finally, we make some recommendation作者: Entreaty 時間: 2025-3-26 13:57 作者: FLOAT 時間: 2025-3-26 18:02 作者: 為寵愛 時間: 2025-3-26 21:30 作者: dagger 時間: 2025-3-27 02:26 作者: Tempor 時間: 2025-3-27 07:15 作者: sorbitol 時間: 2025-3-27 12:17 作者: 來這真柔軟 時間: 2025-3-27 14:03 作者: Intellectual 時間: 2025-3-27 21:32
