標(biāo)題: Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de [打印本頁(yè)] 作者: Corrugate 時(shí)間: 2025-3-21 18:43
書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)
書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)學(xué)科排名
書目名稱Handbook Of Electronics Packaging Design and Engineering網(wǎng)絡(luò)公開(kāi)度
書目名稱Handbook Of Electronics Packaging Design and Engineering網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次
書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次學(xué)科排名
書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用
書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用學(xué)科排名
書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋
書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋學(xué)科排名
作者: Biguanides 時(shí)間: 2025-3-21 23:56
Handbook Of Electronics Packaging Design and Engineering978-94-011-6979-0作者: B-cell 時(shí)間: 2025-3-22 02:19 作者: 為現(xiàn)場(chǎng) 時(shí)間: 2025-3-22 04:58 作者: gregarious 時(shí)間: 2025-3-22 12:12
J?rgen M?ller,Svend-Erik Skaaninges to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.作者: 狗窩 時(shí)間: 2025-3-22 13:09
The Rule of Reason in Antitrust Lawle to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency controlling, etc. (Figures 8-2 and 8-3).作者: STRIA 時(shí)間: 2025-3-22 17:23
https://doi.org/10.1007/978-3-030-65229-6d dust are directly attributable to a large number of failures in electronics systems. In Chapters 8 and 12, equipment enclosures are discussed. The material presented in this chapter covers both organic and inorganic environmental coatings commonly used to protect materials and assemblies from harsh environmental exposure.作者: Osteoporosis 時(shí)間: 2025-3-22 21:43 作者: debble 時(shí)間: 2025-3-23 03:11
https://doi.org/10.1007/978-94-015-8016-8 and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.作者: 關(guān)心 時(shí)間: 2025-3-23 06:23
https://doi.org/10.1007/978-1-349-03351-5s provided. The engineer and designer should use the terminology generally accepted within the industry in all forms of communication. All engineering documents should use only the standard accepted terminology.作者: GUISE 時(shí)間: 2025-3-23 11:12
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.作者: frenzy 時(shí)間: 2025-3-23 15:06
Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency controlling, etc. (Figures 8-2 and 8-3).作者: Incise 時(shí)間: 2025-3-23 21:31 作者: 令人悲傷 時(shí)間: 2025-3-24 01:27
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.作者: JOT 時(shí)間: 2025-3-24 06:18
Materials and Processes, and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.作者: 子女 時(shí)間: 2025-3-24 08:24 作者: drusen 時(shí)間: 2025-3-24 14:05
https://doi.org/10.1007/978-3-642-17952-5The electronics packaging design and engineering fields perform tasks of ever-increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.作者: euphoria 時(shí)間: 2025-3-24 17:53
https://doi.org/10.1007/978-3-031-30142-1The human engineering design guidelines presented in this chapter are directed toward hardware problems involving man-machine interfaces. When the engineer or designer cannot find an adequate solution herein, a human factors specialist should be consulted.作者: 不法行為 時(shí)間: 2025-3-24 20:04
https://doi.org/10.1007/978-3-030-56001-0Reliability is one of the prime requirements in the design of electronics equipment. Reliability is the ability of a product to perform as designed for the specified life of the equipment.作者: impaction 時(shí)間: 2025-3-25 01:28
https://doi.org/10.1057/978-1-349-95053-9The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.作者: stratum-corneum 時(shí)間: 2025-3-25 07:04
https://doi.org/10.1007/978-3-031-55322-6Shock and vibration start to become problems long before electronics equipment is installed. The designer must consider handling and transportation at the early stages of design in order to achieve factory-to-field dependability.作者: 抗生素 時(shí)間: 2025-3-25 08:22 作者: magenta 時(shí)間: 2025-3-25 14:17 作者: Gudgeon 時(shí)間: 2025-3-25 18:18
Human Factors Engineering,The human engineering design guidelines presented in this chapter are directed toward hardware problems involving man-machine interfaces. When the engineer or designer cannot find an adequate solution herein, a human factors specialist should be consulted.作者: 聯(lián)合 時(shí)間: 2025-3-25 20:36
Mechanical Fasteners,Reliability is one of the prime requirements in the design of electronics equipment. Reliability is the ability of a product to perform as designed for the specified life of the equipment.作者: 大看臺(tái) 時(shí)間: 2025-3-26 00:16
Heat Transfer and Thermal Control,The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.作者: Regurgitation 時(shí)間: 2025-3-26 05:46
Shock and Vibration Design,Shock and vibration start to become problems long before electronics equipment is installed. The designer must consider handling and transportation at the early stages of design in order to achieve factory-to-field dependability.作者: faculty 時(shí)間: 2025-3-26 12:28 作者: 看法等 時(shí)間: 2025-3-26 15:13
http://image.papertrans.cn/h/image/420729.jpg作者: 轉(zhuǎn)換 時(shí)間: 2025-3-26 20:32
978-94-011-6981-3Van Nostrand Reinhold Company Inc. 1982作者: Figate 時(shí)間: 2025-3-26 21:26
https://doi.org/10.1007/978-94-011-6979-0control; development; electronics; energy; engineer; environment; maintainability; manufacturing; materials; 作者: Favorable 時(shí)間: 2025-3-27 04:55
Design Considerations for Space Electronics,majority of the products, all that was needed to package was an aluminum chassis, some protection against shock and vibration, an occasional tube shield, and a box, painted black with many holes drilled for ventilation, which would protect the circuits from the wind, rain, and other environmental hazards.作者: 桶去微染 時(shí)間: 2025-3-27 09:21
Printed Circuits,tary has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to achieve the combined minimum requirements of all of the military and commercial standards in use today (Table 16-1).作者: EVICT 時(shí)間: 2025-3-27 10:26 作者: 跑過(guò) 時(shí)間: 2025-3-27 14:14 作者: 人類 時(shí)間: 2025-3-27 18:49 作者: RADE 時(shí)間: 2025-3-27 22:41
Book 1982quip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the follo作者: 格言 時(shí)間: 2025-3-28 02:43 作者: canonical 時(shí)間: 2025-3-28 06:41 作者: 牌帶來(lái) 時(shí)間: 2025-3-28 10:32 作者: electrolyte 時(shí)間: 2025-3-28 17:09 作者: 擔(dān)憂 時(shí)間: 2025-3-28 18:48 作者: cortisol 時(shí)間: 2025-3-29 02:13 作者: Iniquitous 時(shí)間: 2025-3-29 04:19
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be us作者: grandiose 時(shí)間: 2025-3-29 08:53
Fabrication Processes,ials used with the processes, and the equipment available for each operation. All materials and processes used have certain restrictions; the designer must be aware of these to avoid the possibility of designing hardware that cannot be manufactured by current standard processes or equipments. A thor作者: 禁止,切斷 時(shí)間: 2025-3-29 15:10
Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency c作者: Offensive 時(shí)間: 2025-3-29 19:13
Design Considerations for Space Electronics,cuits primarily for the earthbound electronics industry; if their packages were destined for use in aircraft, the greatest worry was vibration. For a majority of the products, all that was needed to package was an aluminum chassis, some protection against shock and vibration, an occasional tube shie作者: Ballad 時(shí)間: 2025-3-29 20:05
Environmental Protection,d dust are directly attributable to a large number of failures in electronics systems. In Chapters 8 and 12, equipment enclosures are discussed. The material presented in this chapter covers both organic and inorganic environmental coatings commonly used to protect materials and assemblies from hars作者: 幻想 時(shí)間: 2025-3-30 02:39
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.作者: 滲入 時(shí)間: 2025-3-30 05:26 作者: lattice 時(shí)間: 2025-3-30 09:30 作者: itinerary 時(shí)間: 2025-3-30 15:36
Materials and Processes, and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.作者: grenade 時(shí)間: 2025-3-30 17:34
Printed Circuits,niques and varying levels of performance. To standardize the design areas that affect the quality and the reliability of the printed circuit, the military has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to a作者: 菊花 時(shí)間: 2025-3-30 21:39 作者: 致命 時(shí)間: 2025-3-31 02:36 作者: Pert敏捷 時(shí)間: 2025-3-31 06:33 作者: 兇猛 時(shí)間: 2025-3-31 09:59 作者: TIA742 時(shí)間: 2025-3-31 13:55 作者: GLARE 時(shí)間: 2025-3-31 19:18 作者: 漂白 時(shí)間: 2025-4-1 00:57 作者: ENNUI 時(shí)間: 2025-4-1 03:55
https://doi.org/10.1007/978-1-349-07851-6ds, the designer should strive for reliability, weight reduction, volume reduction, and maintainability. The design should provide enough freedom to adapt to any application that may be specified, such as space vehicle, ground support equipment, vehicle installations such as truck or jeeps, and heav作者: FOR 時(shí)間: 2025-4-1 07:59
The Rules of the Game in the Global Economyve become as complex as the electronics components they serve, and requirements have become correspondingly exacting. Conductors are selected for their currentcarrying capacity, mechanical strength, and the properties of their insulation. However, unique situations may require the use of wire with s作者: 侵害 時(shí)間: 2025-4-1 10:34
https://doi.org/10.1007/978-94-015-8016-8 and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
