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標題: Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1990 Van Nostrand Reinhold 1990 electronics.manufacturi [打印本頁]

作者: 明顯    時間: 2025-3-21 16:56
書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)




書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)學科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering網絡公開度




書目名稱Handbook Of Electronics Packaging Design and Engineering網絡公開度學科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次




書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次學科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用




書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用學科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋




書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋學科排名





作者: Ophthalmologist    時間: 2025-3-21 22:01

作者: 走調    時間: 2025-3-22 04:17
Justus Akinsanya,Greg Cox,Lucy Fletchertary has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to achieve the combined minimum requirements of all of the military and commercial standards in use today (Table 16-1).
作者: intimate    時間: 2025-3-22 05:10
Daniel Callahan,H. Tristram Engelhardt costs. This chapter provides some of the basic manufacturing procedures available and the restrictions that must be considered in designing modern electronics equipment that will be manufacturable and salable at competitive prices.
作者: 蠟燭    時間: 2025-3-22 10:17
The Roper, Logan and Tierney Model in Actionth the composition of the solution, current density, agitation, and solution temperature. Hardness, conductivity, solderability, and corrosion-resistance are generally the most important plating properties, since coating-life is usually dependent upon these factors.
作者: 侵略    時間: 2025-3-22 13:57
The Rosetta Stone of the Human Mindrd module should be capable of installation into any existing standard installation, such as a standard 19-inch EIA (Electronics Industries Association) rack and panel, ATR (air transport racking) cases (Figure 12-2), or commercial instrument cases.
作者: 性別    時間: 2025-3-22 19:05

作者: DENT    時間: 2025-3-23 00:59

作者: hair-bulb    時間: 2025-3-23 04:53

作者: Neuralgia    時間: 2025-3-23 05:45

作者: ostrish    時間: 2025-3-23 12:39
Wire and Cabling,apacity, impedance, voltage, RFI, operator protection, and special placement of components. These problems are best approached by both the electronics engineer and the mechanical engineer working as a team.
作者: 投射    時間: 2025-3-23 17:08
Book 1990quip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the follo
作者: NICHE    時間: 2025-3-23 21:42

作者: Ablation    時間: 2025-3-23 23:18
Printed Circuits,tary has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to achieve the combined minimum requirements of all of the military and commercial standards in use today (Table 16-1).
作者: hemophilia    時間: 2025-3-24 05:02
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作者: conceal    時間: 2025-3-24 07:19

作者: 廢墟    時間: 2025-3-24 12:50
https://doi.org/10.1007/978-3-319-73444-6The electronics packaging design and engineering fields perform tasks of ever- increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.
作者: archenemy    時間: 2025-3-24 17:27

作者: exacerbate    時間: 2025-3-24 21:36

作者: 失望昨天    時間: 2025-3-25 00:56
The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
作者: VERT    時間: 2025-3-25 07:06
https://doi.org/10.1007/978-1-349-17714-1Shock and vibration start to become problems long before electronics equipment is installed. The designer must consider handling and transportation at the early stages of design in order to achieve factory-to-field dependability.
作者: 誘騙    時間: 2025-3-25 07:42
https://doi.org/10.1057/9780230100848Design of any equipment must employ features to protect personnel from electrical and mechanical hazards, and those dangers that may arise from fire, elevated operating temperatures, and toxic fumes.
作者: GROG    時間: 2025-3-25 12:44

作者: 使閉塞    時間: 2025-3-25 16:27
Electronics Packaging Design and Engineering,The electronics packaging design and engineering fields perform tasks of ever- increasing importance in the electronics industry. They can be either the strength or the weakness of electronics systems engineering. Much depends on how its purpose and functions are interpreted within the engineering organization.
作者: 堅毅    時間: 2025-3-25 23:44

作者: SENT    時間: 2025-3-26 02:19

作者: dainty    時間: 2025-3-26 07:42
Heat Transfer and Thermal Control,The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
作者: 洞穴    時間: 2025-3-26 12:17

作者: Autobiography    時間: 2025-3-26 12:44

作者: 樂意    時間: 2025-3-26 19:49
Electrical Interconnection Systems,Electrical interconnection systems are the means of routing electrical power and signals to the various assemblies, subassemblies, and units of an electronic system.
作者: Neutral-Spine    時間: 2025-3-26 23:43

作者: 過分    時間: 2025-3-27 02:43

作者: insightful    時間: 2025-3-27 07:51

作者: anarchist    時間: 2025-3-27 12:28
The Rosetta Stone of the Human Mind device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
作者: artifice    時間: 2025-3-27 16:16

作者: 性學院    時間: 2025-3-27 20:40

作者: Accommodation    時間: 2025-3-27 22:50

作者: Blanch    時間: 2025-3-28 03:27
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.
作者: 耐寒    時間: 2025-3-28 10:18

作者: 記憶法    時間: 2025-3-28 13:07
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
作者: Pandemic    時間: 2025-3-28 17:04
Materials and Processes, and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
作者: 滔滔不絕的人    時間: 2025-3-28 20:32
Forced-Air Cooling Systems,ackage densities. “Natural” cooling (heat sinks, free-air radiation, and natural convection) is no longer adequate for maintenance of operating temperatures within safe, or optimum, ranges. One practical solution is through controlled, forced circulation of cooling air by means of fan or blower.
作者: thwart    時間: 2025-3-29 01:26
Preferred Materials for Electronic Packaging,manufacturing of electronic products are presented in the following tables for ready reference to the packaging engineer and designer. These tables will also prove to be of value to the manufacturing engineers involved in the preparation of production tooling.
作者: mastopexy    時間: 2025-3-29 04:23

作者: 合唱團    時間: 2025-3-29 09:13

作者: Presbyopia    時間: 2025-3-29 13:14

作者: 撫慰    時間: 2025-3-29 18:13
https://doi.org/10.1007/978-1-4615-4877-5cuits primarily for the earthbound electronics industry; if their packages were destined for use in aircraft, the greatest worry was vibration. For a majority of the products, all that was needed to package was an aluminum chassis, some protection against shock and vibration, an occasional tube shie
作者: 無能力之人    時間: 2025-3-29 23:21
The Roper, Logan and Tierney Model in Actioneposition, or hot dipping. Electroplating, by far the most common process, is applied by making the base metal cathodic in an aqueous solution of the salt of the plating metal, and then passing direct current through the solution to deposit the coating metal by electrolysis. These processes change t
作者: 兩棲動物    時間: 2025-3-30 02:28
The Rosetta Stone of the Human Mind device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
作者: Gnrh670    時間: 2025-3-30 04:32
The Rosetta Stone of the Human Mindds, the designer should strive for reliability, weight reduction, volume reduction, and maintainability. The design should provide enough freedom to adapt to any application that may be specified, such as space vehicle, ground support equipment, vehicle installations such as truck or jeeps, and heav
作者: dry-eye    時間: 2025-3-30 10:07
https://doi.org/10.1007/978-94-011-9540-9ve become as complex as the electronics components they serve, and requirements have become correspondingly exacting. Conductors are selected for their current- carrying capacity, mechanical strength, and the properties of their insulation. However, unique situations may require the use of wire with
作者: tinnitus    時間: 2025-3-30 15:50
The Route Towards Global Sustainability and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
作者: Credence    時間: 2025-3-30 16:51

作者: Aspiration    時間: 2025-3-31 00:39

作者: Iatrogenic    時間: 2025-3-31 01:17
https://doi.org/10.1057/978-1-137-50765-5manufacturing of electronic products are presented in the following tables for ready reference to the packaging engineer and designer. These tables will also prove to be of value to the manufacturing engineers involved in the preparation of production tooling.
作者: 朦朧    時間: 2025-3-31 07:17
Project Planning,es to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be us
作者: 神圣在玷污    時間: 2025-3-31 11:02

作者: Venules    時間: 2025-3-31 15:05
Subassemblies and Assemblies,le to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency c
作者: 語言學    時間: 2025-3-31 18:06
Design Considerations for Space Electronics,cuits primarily for the earthbound electronics industry; if their packages were destined for use in aircraft, the greatest worry was vibration. For a majority of the products, all that was needed to package was an aluminum chassis, some protection against shock and vibration, an occasional tube shie
作者: AND    時間: 2025-4-1 00:24

作者: 入伍儀式    時間: 2025-4-1 02:28
Radio Frequency and Electromagnetic Shielding, device were possible, it would be impractical. However, there are many techniques that can be used to prevent unwanted radiation from degrading performance or causing a malfunction. This chapter provides concise information on techniques for controlling and suppressing electromagnetic radiation.
作者: Eosinophils    時間: 2025-4-1 06:11
Design and Development of Miniature Electronics Systems,ds, the designer should strive for reliability, weight reduction, volume reduction, and maintainability. The design should provide enough freedom to adapt to any application that may be specified, such as space vehicle, ground support equipment, vehicle installations such as truck or jeeps, and heav




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