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標題: Titlebook: Essential Knowledge for Transistor-Level LSI Circuit Design; Toru Nakura Book 2016 The Editor(s) (if applicable) and The Author(s), under [打印本頁]

作者: Indigent    時間: 2025-3-21 17:04
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書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design被引頻次




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書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design讀者反饋




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作者: 鞭打    時間: 2025-3-21 21:13

作者: 親密    時間: 2025-3-22 01:18
978-981-10-9158-2The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor
作者: SPALL    時間: 2025-3-22 04:55
Direct-Write Deposition of Thermogelsnt, set up your.cshrc file, and launch the schematic editor. The moment you place down a transistor symbol, you should wonder: “What is this fourth terminal? The transistors I have seen before in textbooks only had three .”This chapter explains the miscellaneous knowledge necessary for schematic ent
作者: ALB    時間: 2025-3-22 09:49

作者: Evolve    時間: 2025-3-22 13:42
https://doi.org/10.1007/978-1-4471-0959-4large amount of creativity is not necessary, but rather a persistent and tenacious effort is required, and within the design cycle, this step is “painful” and takes the most time. In turn, it is no exaggeration to say that this step determines whether the created chip will function successfully or n
作者: Evolve    時間: 2025-3-22 20:30
Robert L. Blum,Gio C. M. Wiederholde circuit designed for 5?GHz only runs at 3?GHz. What should you do.? Connecting wires have parasitic resistance and capacitance, and an RC extraction tool reads the layout data and generates the corresponding netlist with the interconnect resistance and capacitance. This chapter explains how RC ext
作者: WITH    時間: 2025-3-23 00:13

作者: 慎重    時間: 2025-3-23 02:16

作者: GRACE    時間: 2025-3-23 08:53
Aydin Azizi,Poorya Ghafoorpoor Yazdidered NBTI?” What in the world are those? As our CMOS process technology scales, the transistor performance are enhanced however we faces many problems on the other hand. The changes in characteristics due to process variation has become especially grave, and design is becoming much more difficult a
作者: negotiable    時間: 2025-3-23 12:03
K. A. Hwang,D. C. Liu,C. C. Linopes? Huh? We can’t make measurements because there is no trigger signal output? Oh no. To avoid such mistakes, circuit designers must also be aware about measurement devices. We use a variety of measurement devices to validate the performance of our silicon chips. This chapter explains the principl
作者: 懶惰民族    時間: 2025-3-23 16:37
Emad Abouel Nasr,Ali K. Kamrani have never seen before. What are we supposed to connect to what.?Ground and power supply connection is often ignored on device connectivity schematic, but very important in actual measurement. This chapter discusses the importance of the return path and parallel use of decoupling capacitors to real
作者: A精確的    時間: 2025-3-23 21:17

作者: initiate    時間: 2025-3-24 01:48
https://doi.org/10.1007/978-981-10-0424-7LSI circuit design; usage of CAD; usage of EDA; schematic editor; SPICE; layout editor; RC extraction; IO b
作者: 樂章    時間: 2025-3-24 06:13

作者: 商品    時間: 2025-3-24 08:02
Measurement Devices,e, how to generate and observe the signals, of each measurement device such as power supply, signal generator, pulse pattern generator, sampling oscilloscope, real-time oscilloscope, spectrum analyzer, BERT, network analyzer, and logic analyzer, with some notes and their background theorem.
作者: 高興去去    時間: 2025-3-24 12:58

作者: Indigence    時間: 2025-3-24 17:40

作者: 嚴峻考驗    時間: 2025-3-24 20:46

作者: STALE    時間: 2025-3-25 02:17

作者: Organonitrile    時間: 2025-3-25 04:34

作者: 別名    時間: 2025-3-25 08:28
Segmentation of Edges and Lines,els. Electrical properties of the channel elements including PADs, bonding wires, transmission lines with termination, as well as ESD protection circuits are introduced. Basic IO buffer circuits and pin assignment strategy for robust chip-to-chip communication are also discussed.
作者: Infect    時間: 2025-3-25 11:51

作者: MAG    時間: 2025-3-25 18:53
https://doi.org/10.1007/978-1-4419-5662-0design, taking many, many miscellaneous things into consideration. After you submit your final GDS data, you prepare the package and board for the measurement. After the measurement, you summarize everything, write a report, and consider toward your next design utilizing your imagination and creativity.
作者: Enteropathic    時間: 2025-3-25 21:10
Schematic Entry,nections based on the applications are introduced. Then the meaning and the relationship between SPICE model and parameters are explained. In addition, some tips for hierarchical circuit design are introduced.
作者: groggy    時間: 2025-3-26 03:09

作者: 類人猿    時間: 2025-3-26 05:15
IO Buffers,els. Electrical properties of the channel elements including PADs, bonding wires, transmission lines with termination, as well as ESD protection circuits are introduced. Basic IO buffer circuits and pin assignment strategy for robust chip-to-chip communication are also discussed.
作者: HOWL    時間: 2025-3-26 10:32

作者: disparage    時間: 2025-3-26 13:35
The Overall Design Procedure,design, taking many, many miscellaneous things into consideration. After you submit your final GDS data, you prepare the package and board for the measurement. After the measurement, you summarize everything, write a report, and consider toward your next design utilizing your imagination and creativity.
作者: Connotation    時間: 2025-3-26 17:20
s chapters and actual circuit design phases and thus is high.Thisbook is a collection of the miscellaneous knowledge essential fortransistor-level LSI circuit design, summarized as the issues that need to beconsidered in each design step. To design an LSI that actually functions and tobe able to pro
作者: CON    時間: 2025-3-26 21:41
Computer-Assisted Musculoskeletal Surgery much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then discusses the types of noise and their countermeasures. The noise discussed in this chapter includes PVT variation, power supply noise, substrate noise, cross-talk noise, and EMC.
作者: cogent    時間: 2025-3-27 02:56
Aydin Azizi,Poorya Ghafoorpoor YazdiOther negative effects such as increase of the leakage current, electro migration, stress migration, hot carrier injection, NBTI and random telegraph noise are also discussed with their brief device physics.
作者: Aspirin    時間: 2025-3-27 08:27

作者: 健壯    時間: 2025-3-27 11:38

作者: 淡紫色花    時間: 2025-3-27 16:15

作者: MURKY    時間: 2025-3-27 18:03
SPICE Simulation,t basic simulations in LSI design. This chapter introduces the principles of the SPICE simulation starting from modified nodal analysis which converts Kirchhoff’s Current Law into the circuit matrix form. It is expanded to circuits with nonlinear elements, AC analysis, then transient analysis. This
作者: LURE    時間: 2025-3-27 22:15

作者: eczema    時間: 2025-3-28 03:07
Interconnect RC Extraction,e circuit designed for 5?GHz only runs at 3?GHz. What should you do.? Connecting wires have parasitic resistance and capacitance, and an RC extraction tool reads the layout data and generates the corresponding netlist with the interconnect resistance and capacitance. This chapter explains how RC ext
作者: pellagra    時間: 2025-3-28 06:16
IO Buffers,ines on the circuit diagram, but it probably isn’t so easy in reality. When chips are connected to each other and signals are exchanged, the signal is output from the pad connected to the interior of the chip, which goes through the bonding wire, the lead frame of the package, and the transmission l
作者: BLA    時間: 2025-3-28 12:33
Noise,t off as “noise is your problem.” Here, “noise” does not mean “constantly random fluctuations such as thermal noise,” but rather the word is used in a much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then d
作者: Lasting    時間: 2025-3-28 17:16

作者: objection    時間: 2025-3-28 22:38

作者: 分發(fā)    時間: 2025-3-28 23:05

作者: 共棲    時間: 2025-3-29 03:38

作者: LIEN    時間: 2025-3-29 08:45

作者: 機械    時間: 2025-3-29 12:32





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