標題: Titlebook: Essential Knowledge for Transistor-Level LSI Circuit Design; Toru Nakura Book 2016 The Editor(s) (if applicable) and The Author(s), under [打印本頁] 作者: Indigent 時間: 2025-3-21 17:04
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design影響因子(影響力)
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書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design被引頻次
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design被引頻次學(xué)科排名
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design年度引用
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design年度引用學(xué)科排名
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design讀者反饋
書目名稱Essential Knowledge for Transistor-Level LSI Circuit Design讀者反饋學(xué)科排名
作者: 鞭打 時間: 2025-3-21 21:13 作者: 親密 時間: 2025-3-22 01:18
978-981-10-9158-2The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor作者: SPALL 時間: 2025-3-22 04:55
Direct-Write Deposition of Thermogelsnt, set up your.cshrc file, and launch the schematic editor. The moment you place down a transistor symbol, you should wonder: “What is this fourth terminal? The transistors I have seen before in textbooks only had three .”This chapter explains the miscellaneous knowledge necessary for schematic ent作者: ALB 時間: 2025-3-22 09:49 作者: Evolve 時間: 2025-3-22 13:42
https://doi.org/10.1007/978-1-4471-0959-4large amount of creativity is not necessary, but rather a persistent and tenacious effort is required, and within the design cycle, this step is “painful” and takes the most time. In turn, it is no exaggeration to say that this step determines whether the created chip will function successfully or n作者: Evolve 時間: 2025-3-22 20:30
Robert L. Blum,Gio C. M. Wiederholde circuit designed for 5?GHz only runs at 3?GHz. What should you do.? Connecting wires have parasitic resistance and capacitance, and an RC extraction tool reads the layout data and generates the corresponding netlist with the interconnect resistance and capacitance. This chapter explains how RC ext作者: WITH 時間: 2025-3-23 00:13 作者: 慎重 時間: 2025-3-23 02:16 作者: GRACE 時間: 2025-3-23 08:53
Aydin Azizi,Poorya Ghafoorpoor Yazdidered NBTI?” What in the world are those? As our CMOS process technology scales, the transistor performance are enhanced however we faces many problems on the other hand. The changes in characteristics due to process variation has become especially grave, and design is becoming much more difficult a作者: negotiable 時間: 2025-3-23 12:03
K. A. Hwang,D. C. Liu,C. C. Linopes? Huh? We can’t make measurements because there is no trigger signal output? Oh no. To avoid such mistakes, circuit designers must also be aware about measurement devices. We use a variety of measurement devices to validate the performance of our silicon chips. This chapter explains the principl作者: 懶惰民族 時間: 2025-3-23 16:37
Emad Abouel Nasr,Ali K. Kamrani have never seen before. What are we supposed to connect to what.?Ground and power supply connection is often ignored on device connectivity schematic, but very important in actual measurement. This chapter discusses the importance of the return path and parallel use of decoupling capacitors to real作者: A精確的 時間: 2025-3-23 21:17 作者: initiate 時間: 2025-3-24 01:48
https://doi.org/10.1007/978-981-10-0424-7LSI circuit design; usage of CAD; usage of EDA; schematic editor; SPICE; layout editor; RC extraction; IO b作者: 樂章 時間: 2025-3-24 06:13 作者: 商品 時間: 2025-3-24 08:02
Measurement Devices,e, how to generate and observe the signals, of each measurement device such as power supply, signal generator, pulse pattern generator, sampling oscilloscope, real-time oscilloscope, spectrum analyzer, BERT, network analyzer, and logic analyzer, with some notes and their background theorem.作者: 高興去去 時間: 2025-3-24 12:58 作者: Indigence 時間: 2025-3-24 17:40 作者: 嚴峻考驗 時間: 2025-3-24 20:46 作者: STALE 時間: 2025-3-25 02:17 作者: Organonitrile 時間: 2025-3-25 04:34 作者: 別名 時間: 2025-3-25 08:28
Segmentation of Edges and Lines,els. Electrical properties of the channel elements including PADs, bonding wires, transmission lines with termination, as well as ESD protection circuits are introduced. Basic IO buffer circuits and pin assignment strategy for robust chip-to-chip communication are also discussed.作者: Infect 時間: 2025-3-25 11:51 作者: MAG 時間: 2025-3-25 18:53
https://doi.org/10.1007/978-1-4419-5662-0design, taking many, many miscellaneous things into consideration. After you submit your final GDS data, you prepare the package and board for the measurement. After the measurement, you summarize everything, write a report, and consider toward your next design utilizing your imagination and creativity.作者: Enteropathic 時間: 2025-3-25 21:10
Schematic Entry,nections based on the applications are introduced. Then the meaning and the relationship between SPICE model and parameters are explained. In addition, some tips for hierarchical circuit design are introduced.作者: groggy 時間: 2025-3-26 03:09 作者: 類人猿 時間: 2025-3-26 05:15
IO Buffers,els. Electrical properties of the channel elements including PADs, bonding wires, transmission lines with termination, as well as ESD protection circuits are introduced. Basic IO buffer circuits and pin assignment strategy for robust chip-to-chip communication are also discussed.作者: HOWL 時間: 2025-3-26 10:32 作者: disparage 時間: 2025-3-26 13:35
The Overall Design Procedure,design, taking many, many miscellaneous things into consideration. After you submit your final GDS data, you prepare the package and board for the measurement. After the measurement, you summarize everything, write a report, and consider toward your next design utilizing your imagination and creativity.作者: Connotation 時間: 2025-3-26 17:20
s chapters and actual circuit design phases and thus is high.Thisbook is a collection of the miscellaneous knowledge essential fortransistor-level LSI circuit design, summarized as the issues that need to beconsidered in each design step. To design an LSI that actually functions and tobe able to pro作者: CON 時間: 2025-3-26 21:41
Computer-Assisted Musculoskeletal Surgery much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then discusses the types of noise and their countermeasures. The noise discussed in this chapter includes PVT variation, power supply noise, substrate noise, cross-talk noise, and EMC.作者: cogent 時間: 2025-3-27 02:56
Aydin Azizi,Poorya Ghafoorpoor YazdiOther negative effects such as increase of the leakage current, electro migration, stress migration, hot carrier injection, NBTI and random telegraph noise are also discussed with their brief device physics.作者: Aspirin 時間: 2025-3-27 08:27 作者: 健壯 時間: 2025-3-27 11:38 作者: 淡紫色花 時間: 2025-3-27 16:15 作者: MURKY 時間: 2025-3-27 18:03
SPICE Simulation,t basic simulations in LSI design. This chapter introduces the principles of the SPICE simulation starting from modified nodal analysis which converts Kirchhoff’s Current Law into the circuit matrix form. It is expanded to circuits with nonlinear elements, AC analysis, then transient analysis. This 作者: LURE 時間: 2025-3-27 22:15 作者: eczema 時間: 2025-3-28 03:07
Interconnect RC Extraction,e circuit designed for 5?GHz only runs at 3?GHz. What should you do.? Connecting wires have parasitic resistance and capacitance, and an RC extraction tool reads the layout data and generates the corresponding netlist with the interconnect resistance and capacitance. This chapter explains how RC ext作者: pellagra 時間: 2025-3-28 06:16
IO Buffers,ines on the circuit diagram, but it probably isn’t so easy in reality. When chips are connected to each other and signals are exchanged, the signal is output from the pad connected to the interior of the chip, which goes through the bonding wire, the lead frame of the package, and the transmission l作者: BLA 時間: 2025-3-28 12:33
Noise,t off as “noise is your problem.” Here, “noise” does not mean “constantly random fluctuations such as thermal noise,” but rather the word is used in a much broader sense, to mean “things that were unexpected during design.” This chapter first categorizes the malfunction of the actual LSI chip then d作者: Lasting 時間: 2025-3-28 17:16 作者: objection 時間: 2025-3-28 22:38 作者: 分發(fā) 時間: 2025-3-28 23:05 作者: 共棲 時間: 2025-3-29 03:38 作者: LIEN 時間: 2025-3-29 08:45 作者: 機械 時間: 2025-3-29 12:32