標題: Titlebook: Electronics Production Defects and Analysis; Oommen Tharakan Kuttiyil Thomas,Padma Padmanabhan Book 2022 The Editor(s) (if applicable) an [打印本頁] 作者: OBESE 時間: 2025-3-21 16:40
書目名稱Electronics Production Defects and Analysis影響因子(影響力)
書目名稱Electronics Production Defects and Analysis影響因子(影響力)學科排名
書目名稱Electronics Production Defects and Analysis網(wǎng)絡公開度
書目名稱Electronics Production Defects and Analysis網(wǎng)絡公開度學科排名
書目名稱Electronics Production Defects and Analysis被引頻次
書目名稱Electronics Production Defects and Analysis被引頻次學科排名
書目名稱Electronics Production Defects and Analysis年度引用
書目名稱Electronics Production Defects and Analysis年度引用學科排名
書目名稱Electronics Production Defects and Analysis讀者反饋
書目名稱Electronics Production Defects and Analysis讀者反饋學科排名
作者: Axon895 時間: 2025-3-21 20:31
Electronics Production Defects and Analysis978-981-16-9824-8Series ISSN 2731-4200 Series E-ISSN 2731-4219 作者: Cardiac 時間: 2025-3-22 02:16
Socio-Markers and Information Transmissionvolved activity which comprises a multitude of tasks. Utmost attention shall be paid to each and every element and the respective production stage, in the process. This involves establishing after suitable validation soldering of miniscule electronic components, control on soldering of the paddle of作者: 比賽用背帶 時間: 2025-3-22 06:22 作者: 復習 時間: 2025-3-22 09:40
Bjoern Oest Hansen,Jan Taubert,Thomas Thielrapment leading to conductive anodic filament formation. Also, the PTH barrel integrity can be affected if the process control measures are not strictly followed. Moreover, the solderability of the PCBs can be impaired due to the formation of thick intermetallic compound on improper storage of the f作者: 監(jiān)禁 時間: 2025-3-22 16:16
Hinderk M. Emrich,Michael Wiegandthe defects arising due to offset in mounting of ICs, non-standard mounting of capacitors, damaged end termination of SMT devices, lead deformation on mounting of ICs, inadequate electrical clearance and improper lead formation. The case of mounting defect due to inadequate heel in ICs has been capt作者: 監(jiān)禁 時間: 2025-3-22 18:02
https://doi.org/10.1007/978-1-4614-8630-5nd shock environments. The commonly used conformal coating material and their applications are tabulated. Proper cleaning of the surfaces, masking the required areas including irregular surfaces with tapes and baking shall be strictly adhered to proscribe any defects. Three typical defects encounter作者: 性滿足 時間: 2025-3-22 21:49 作者: 似少年 時間: 2025-3-23 02:45 作者: 我說不重要 時間: 2025-3-23 08:54
Valeria De Bedout,Anna J. Nicholss can happen probably because of non-availability of equivalent devices and substituting with near equivalent ones which need not be?form and fit although may be functionally equivalent. This results in issues such as failure to maintain adequate clearance between conductive elements, single point f作者: CURB 時間: 2025-3-23 11:52 作者: CRUMB 時間: 2025-3-23 14:16
https://doi.org/10.1007/978-981-16-9824-8High Reliability Electronics; Multiple Touch Up; Overcoat Peeled; Component Overhang; Barrel-Annular Rin作者: ingenue 時間: 2025-3-23 20:02 作者: CORE 時間: 2025-3-23 22:15
Springer Tracts in Electrical and Electronics Engineeringhttp://image.papertrans.cn/e/image/306479.jpg作者: collagenase 時間: 2025-3-24 02:45 作者: 露天歷史劇 時間: 2025-3-24 08:20
Book 2022hose who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time a作者: NIB 時間: 2025-3-24 11:55
Introduction,volved activity which comprises a multitude of tasks. Utmost attention shall be paid to each and every element and the respective production stage, in the process. This involves establishing after suitable validation soldering of miniscule electronic components, control on soldering of the paddle of作者: linguistics 時間: 2025-3-24 16:14
Soldering Defects,pon the classification of solder wetting correlating to the dihedral angle of wetting. It describes the general flux formulations and the reflow profile. The guidelines formulated for production flow of electronic packages based on detailed experiments and validation have been tabulated. The defects作者: 填料 時間: 2025-3-24 19:01 作者: 細微差別 時間: 2025-3-25 00:22 作者: tolerance 時間: 2025-3-25 04:09 作者: Camouflage 時間: 2025-3-25 11:33 作者: APO 時間: 2025-3-25 14:32 作者: LIKEN 時間: 2025-3-25 18:26
Defects Due to the Usage of Non-FFF Components,s can happen probably because of non-availability of equivalent devices and substituting with near equivalent ones which need not be?form and fit although may be functionally equivalent. This results in issues such as failure to maintain adequate clearance between conductive elements, single point f作者: Spongy-Bone 時間: 2025-3-25 20:44
Defects in CAD Layout,layout design will transpire as such in the fabrication of PCBs, resulting in their rejection on subsequent inspection and testing. Hence, extreme care shall be taken in the design of CAD layout to ensure that all requirements are captured and implemented, the rules adhered to and all the layers of 作者: Banister 時間: 2025-3-26 03:08
Book 2022have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coatin作者: sultry 時間: 2025-3-26 05:55
Socio-Markers and Information Transmissiono addressed. The defects at each stage shall be captured then and there itself, so that it is not propagated to the next level of the fabrication process. This chapter gives a global view on the above aspects and the classification of the different elements and stages into the subsequent eight chapters.作者: llibretto 時間: 2025-3-26 10:14
Calcium Regulation of Cytosolic Enzymesefect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.作者: Mendacious 時間: 2025-3-26 15:09 作者: Organization 時間: 2025-3-26 19:25 作者: hegemony 時間: 2025-3-26 22:54
Soldering Defects,efect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.作者: harpsichord 時間: 2025-3-27 02:02
PCB Defects, defects on microsectioning of coupons of PCBs has been presented. This chapter illustrates the defects in PCBs through high-resolution photographic images. The methods for mitigation/elimination of these defects have also been explained. A total of 55 live cases under 18 groups are presented.作者: Mitigate 時間: 2025-3-27 07:40
Conformal Coating and Potting Defects,ed are illustrated. This includes entrapment of conformal coating material in undesired areas, splattering of material and missing coating. The method of inspection and acceptance criteria has been addressed. This chapter describes these defects through high-resolution photographic images.作者: Afflict 時間: 2025-3-27 10:26 作者: anchor 時間: 2025-3-27 15:35 作者: 騎師 時間: 2025-3-27 17:46
Defects Due to the Usage of Non-FFF Components,ailures, ?inadequate coalescence of solder joints, room for foreign object material deposit, etc. Thus, every effort shall be made to see that replacement is done only with form, fit and functionally equivalent components. A total of 7 such typical cases have been captured and illustrated through high resolution photographs.作者: Valves 時間: 2025-3-27 23:09 作者: 得意人 時間: 2025-3-28 02:20 作者: Arthritis 時間: 2025-3-28 07:01
https://doi.org/10.1007/978-3-662-62444-9g, undesired shorting, deviations from established routing methods, etc. Multiple level of verification preferably three-tier is recommended to be implemented so that no errors are left unaddressed and resolved. Automated methods for verification of CAD layouts need to be explored.作者: 縱欲 時間: 2025-3-28 10:54 作者: 沒花的是打擾 時間: 2025-3-28 16:33 作者: 強制令 時間: 2025-3-28 22:29
https://doi.org/10.1007/978-1-4614-8630-5ed are illustrated. This includes entrapment of conformal coating material in undesired areas, splattering of material and missing coating. The method of inspection and acceptance criteria has been addressed. This chapter describes these defects through high-resolution photographic images.作者: GAVEL 時間: 2025-3-29 01:51 作者: 進入 時間: 2025-3-29 04:24
Integrated Approach to Heart Failureand leaving the trace of stress on the reworked elements or its base. Practising workmanship standards is thus inevitable. A total of 30 cases have been illustrated through high-resolution photographic images.作者: 嚴重傷害 時間: 2025-3-29 07:13
