標(biāo)題: Titlebook: Electronics Packaging Forum; Volume Two James E. Morris Book 1991 Van Nostrand Reinhold 1991 circuit.development.electrical overstress (EOS [打印本頁] 作者: Kennedy 時(shí)間: 2025-3-21 19:35
書目名稱Electronics Packaging Forum影響因子(影響力)
作者: miracle 時(shí)間: 2025-3-21 21:09 作者: 確定無疑 時(shí)間: 2025-3-22 01:59 作者: Injunction 時(shí)間: 2025-3-22 07:46 作者: SOB 時(shí)間: 2025-3-22 12:36
Recent Developments in Thermal Technology for Electronics Packaging,at transfer techniques. This has been especially true in the evolution of electronics packaging for digital computers. Since the development of the first electronic digital computers in the 1940s, the removal of heat has played a major role in ensuring their reliable operation. Early digital compute作者: dysphagia 時(shí)間: 2025-3-22 13:47
Diamond Thin Films: Applications in Electronics Packaging,terial known to humanity, diamond scores high on almost all the categories of engineering properties such as thermal conductivity, electrical resistivity, and dielectric constant as summarized in Table 7.1. The combination of these outstanding properties makes diamond very attractive as the engineer作者: dysphagia 時(shí)間: 2025-3-22 19:26 作者: Graduated 時(shí)間: 2025-3-22 21:25 作者: 擴(kuò)大 時(shí)間: 2025-3-23 03:35
Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structuresically financial) forces which continue to fuel this process have also brought about several technological advances. The reduction in transit time which results from reduced component size has led to improved gains and switching times [e.g. 1]. Smaller components require less external circuitry and,作者: miniature 時(shí)間: 2025-3-23 09:09 作者: amphibian 時(shí)間: 2025-3-23 11:01
Electrical Bonding of Connectors on Jet Engine Electronics,s. The DC resistance between these connectors and their mounting surfaces must be less than 2.5 milliohms. Electronic control systems have experienced difficulty in meeting this bonding specification after environmental stress screening. The particular interface in question is between stainless stee作者: 暗指 時(shí)間: 2025-3-23 17:30 作者: 沙文主義 時(shí)間: 2025-3-23 19:22
Microelectronics Packaging/Interconnect: An Industry in Transition,tial impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applic作者: paleolithic 時(shí)間: 2025-3-24 00:07
An Introduction to Tape Automated Bonding Technology, is placed upon a new understanding of the key elements (e.g., tapes, bumps, inner lead bonding, testing and burn-in on tape-with-chip, encapsulation, outer lead bonding, thermal management, reliability, etc.) of this rapidly moving technology.作者: SSRIS 時(shí)間: 2025-3-24 04:46 作者: expansive 時(shí)間: 2025-3-24 07:51
Low Dielectric Constant Materials for Packaging High Speed Electronics,electric field; the dielectric strength defines a limiting electric field gradient above which the interaction of the dielectric with the field causes an irreversible change in the dielectric. Values of these properties for commercially important dielectric materials are shown in Table 8.1.作者: 過去分詞 時(shí)間: 2025-3-24 12:20
Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113,, and ability to azeotrope (or boil as a compound at a single temperature) with other ingredients -- especially lower molecular weight alcohols and other select ingredients --s thus enhancing its solvency power for contaminant residues.作者: 發(fā)起 時(shí)間: 2025-3-24 15:35
Microelectronics Packaging/Interconnect: An Industry in Transition,ations could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.作者: 欲望小妹 時(shí)間: 2025-3-24 21:52 作者: maverick 時(shí)間: 2025-3-25 01:52
Manfred Nagl,Bernhard Westfechtel versus normal force was determined for the various configurations. The results show that electroplated nickel stainless steel connectors will meet the connector to engine control bonding resistance specification of 2.5 milliohms.作者: 太空 時(shí)間: 2025-3-25 06:25 作者: 勉強(qiáng) 時(shí)間: 2025-3-25 08:35 作者: 加劇 時(shí)間: 2025-3-25 14:45
Book 1991k at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Sy作者: 微生物 時(shí)間: 2025-3-25 16:16
Integrated Optical Devices Based on Silica Waveguide Technology,which provided a stable source of coherent light, and low-loss optical fiber has been developed to make it possible to transmit light signals over long distances. Today, the transmission and processing of signals carried by light has become a topic of great interest.作者: 古董 時(shí)間: 2025-3-25 23:11
Parameterization of Fine Pitch Processing, as the assembly process itself. It is the purpose of this paper to identify and quantify these areas and present assembly yield data obtained in a carefully controlled manufacturing environment. The variations observed in the materials is then summarized and a Monte Carlo technique used to simulate a pick-and-place process yield model.作者: 哥哥噴涌而出 時(shí)間: 2025-3-26 00:36
J. E. Vinney,G. N. Blount,S. Noroozi is placed upon a new understanding of the key elements (e.g., tapes, bumps, inner lead bonding, testing and burn-in on tape-with-chip, encapsulation, outer lead bonding, thermal management, reliability, etc.) of this rapidly moving technology.作者: Intervention 時(shí)間: 2025-3-26 06:35
J. F. Dijksman,F. T. M. Nieuwstadt. Since circuit cards in a given electronic package can vary widely with respect to the module type, configuration, size, and boundary conditions, it is easy to see that a typical PCC populated with modules is a structure of impressive complexity.作者: Metamorphosis 時(shí)間: 2025-3-26 09:01
https://doi.org/10.1007/978-3-476-99472-1electric field; the dielectric strength defines a limiting electric field gradient above which the interaction of the dielectric with the field causes an irreversible change in the dielectric. Values of these properties for commercially important dielectric materials are shown in Table 8.1.作者: debase 時(shí)間: 2025-3-26 13:24 作者: HUMID 時(shí)間: 2025-3-26 19:07 作者: 鬧劇 時(shí)間: 2025-3-26 22:26
of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the pr作者: MINT 時(shí)間: 2025-3-27 04:13
https://doi.org/10.1007/978-3-531-93333-7which provided a stable source of coherent light, and low-loss optical fiber has been developed to make it possible to transmit light signals over long distances. Today, the transmission and processing of signals carried by light has become a topic of great interest.作者: GRAVE 時(shí)間: 2025-3-27 08:02 作者: Sputum 時(shí)間: 2025-3-27 10:10 作者: Harbor 時(shí)間: 2025-3-27 17:12
Stress Analysis for Component-Populated Circuit Cards,cal stresses arising in circuit cards may be greatly influenced by their attachment and support on planars, larger boards, frames, or through connectors; these are usually referred to as “boundary conditions.”作者: FIG 時(shí)間: 2025-3-27 20:24
J. E. Vinney,G. N. Blount,S. Noroozis Packaging Laboratory). It consists of three major parts, the silicon chip, the copper beam leads, and the epoxy/glass FR-4 printed circuit board. In this chapter, an introduction to TAB for fine pitch, high I/O, high performance, high yield, high volume, and high reliability is presented. Emphasis作者: 凌辱 時(shí)間: 2025-3-28 01:30
Introduction and role of the partnersde the support of chip carriers which, generating heat during operation, contribute the functional loading to be withstood by the leads and solder joint interconnections. In addition, however, vibrational loads are almost always present during operation. The processes of manufacturing and handling m作者: 挑剔為人 時(shí)間: 2025-3-28 03:28 作者: definition 時(shí)間: 2025-3-28 07:32 作者: 確定無疑 時(shí)間: 2025-3-28 12:03
Grenzwert und Stetigkeit von Funktionenat transfer techniques. This has been especially true in the evolution of electronics packaging for digital computers. Since the development of the first electronic digital computers in the 1940s, the removal of heat has played a major role in ensuring their reliable operation. Early digital compute作者: 演講 時(shí)間: 2025-3-28 17:21 作者: 就職 時(shí)間: 2025-3-28 22:45 作者: labile 時(shí)間: 2025-3-29 01:33
https://doi.org/10.1007/978-3-531-93333-7gies has opened up a new era in which electricity and electronics have become more useful in our lives. In the early 1960’s, the laser was developed, which provided a stable source of coherent light, and low-loss optical fiber has been developed to make it possible to transmit light signals over lon作者: 刪除 時(shí)間: 2025-3-29 03:18 作者: 新星 時(shí)間: 2025-3-29 10:31
Integration und politische Unterstützunge: CCl.FCClF.). This is because CFC-113 has many truly excellent properties. Chief among these are its outstanding stability and compatibility with almost all materials used in the electronics industry, low toxicity (i.e., high threshold limit value or TLV, for example, TLV. = 1000), nonflammability作者: galley 時(shí)間: 2025-3-29 15:09 作者: 熱情的我 時(shí)間: 2025-3-29 17:38 作者: 六邊形 時(shí)間: 2025-3-29 20:10
Integration von Zuwanderern in Italiential impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applic作者: faultfinder 時(shí)間: 2025-3-30 00:20
http://image.papertrans.cn/e/image/306477.jpg作者: Slit-Lamp 時(shí)間: 2025-3-30 07:44
Raumordnung und Verkehrsplanung,ators came into common usage in the mid 70s. We are now at the beginning of the next significant technology - high frequency distributed architectures. This technology is highly dependent upon packaging solutions, and will have a large impact on overall system-level packaging of Data Processing and Telecommunications products developed in the 90s.作者: intrude 時(shí)間: 2025-3-30 09:07 作者: scrutiny 時(shí)間: 2025-3-30 15:04 作者: leniency 時(shí)間: 2025-3-30 16:44
Diamond Thin Films: Applications in Electronics Packaging,terial known to humanity, diamond scores high on almost all the categories of engineering properties such as thermal conductivity, electrical resistivity, and dielectric constant as summarized in Table 7.1. The combination of these outstanding properties makes diamond very attractive as the engineering material of tomorrow.
