標(biāo)題: Titlebook: Electromigration Modeling at Circuit Layout Level; Cher Ming Tan,Feifei He Book 2013 The Author(s) 2013 3D Modeling.Atomic Flux Divergence [打印本頁] 作者: corrode 時(shí)間: 2025-3-21 20:07
書目名稱Electromigration Modeling at Circuit Layout Level影響因子(影響力)
書目名稱Electromigration Modeling at Circuit Layout Level影響因子(影響力)學(xué)科排名
書目名稱Electromigration Modeling at Circuit Layout Level網(wǎng)絡(luò)公開度
書目名稱Electromigration Modeling at Circuit Layout Level網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Electromigration Modeling at Circuit Layout Level被引頻次
書目名稱Electromigration Modeling at Circuit Layout Level被引頻次學(xué)科排名
書目名稱Electromigration Modeling at Circuit Layout Level年度引用
書目名稱Electromigration Modeling at Circuit Layout Level年度引用學(xué)科排名
書目名稱Electromigration Modeling at Circuit Layout Level讀者反饋
書目名稱Electromigration Modeling at Circuit Layout Level讀者反饋學(xué)科排名
作者: DEVIL 時(shí)間: 2025-3-21 20:45
3D Circuit Model Construction and Simulation,a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.作者: Self-Help-Group 時(shí)間: 2025-3-22 03:23
Comparison of EM Performances in Circuit and Test Structures, EM models in literature use the line-via test structures which are only part of the real circuit structure. To further demonstrate the necessity for complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this ch作者: Emmenagogue 時(shí)間: 2025-3-22 07:22
Interconnect EM Reliability Modeling at Circuit Layout Level,cuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulatio作者: Conscientious 時(shí)間: 2025-3-22 09:01 作者: 否決 時(shí)間: 2025-3-22 14:57
Comparison of EM Performances in Circuit and Test Structures,complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this chapter. Both the EM test condition and the circuit operation condition are considered.作者: 否決 時(shí)間: 2025-3-22 18:39
Interconnect EM Reliability Modeling at Circuit Layout Level,. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulations are performed, and the modifications that can help enhancing the EM reliability of the circuit are carried out based on the observations in the simulation.作者: 反應(yīng) 時(shí)間: 2025-3-23 01:04
Die Einstellungen und ihr Gegenstandstributions of the interconnects in an IC were greatly affected by the interconnect structures and the surrounding materials, the 2D EM circuit simulators based only on current density were no longer adequate. Thus, there is a need for 3D EM modeling at circuit layout level.作者: 或者發(fā)神韻 時(shí)間: 2025-3-23 05:27 作者: flutter 時(shí)間: 2025-3-23 05:47 作者: 紀(jì)念 時(shí)間: 2025-3-23 13:07 作者: acetylcholine 時(shí)間: 2025-3-23 16:49
M. A. Mohamed Salih,Bas Gaay de Fortman. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulations are performed, and the modifications that can help enhancing the EM reliability of the circuit are carried out based on the observations in the simulation.作者: 禁止,切斷 時(shí)間: 2025-3-23 20:00
Concluding Remarks,stributions of the interconnects in an IC were greatly affected by the interconnect structures and the surrounding materials, the 2D EM circuit simulators based only on current density were no longer adequate. Thus, there is a need for 3D EM modeling at circuit layout level.作者: 全國性 時(shí)間: 2025-3-24 01:08
Book 2013 modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.作者: OMIT 時(shí)間: 2025-3-24 04:21
2191-530X ate such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.978-981-4451-20-8978-981-4451-21-5Series ISSN 2191-530X Series E-ISSN 2191-5318 作者: 載貨清單 時(shí)間: 2025-3-24 09:50 作者: 額外的事 時(shí)間: 2025-3-24 12:11
Electromigration Modeling at Circuit Layout Level978-981-4451-21-5Series ISSN 2191-530X Series E-ISSN 2191-5318 作者: ironic 時(shí)間: 2025-3-24 17:37 作者: 苦笑 時(shí)間: 2025-3-24 20:52 作者: Substitution 時(shí)間: 2025-3-24 23:30 作者: 支架 時(shí)間: 2025-3-25 03:48 作者: synovitis 時(shí)間: 2025-3-25 10:59 作者: GLOSS 時(shí)間: 2025-3-25 12:15
3D Circuit Model Construction and Simulation,a method to construct a complete 3D circuit model is necessary and this chapter will illustrate the construction and the corresponding transient electro-thermo-structural simulations for the EM reliability assessment of an IC.作者: Fibroid 時(shí)間: 2025-3-25 17:49
Rita D. Sherma (Director),Arvind Sharma(EM) reliability of ICs is becoming increasingly important. As re-design and re-manufacture are very time- and resource-consuming for present-day, ultra large-scale integration (ULSI), “Design-for-Reliability,” is essential.作者: neutrophils 時(shí)間: 2025-3-25 20:25 作者: Trigger-Point 時(shí)間: 2025-3-26 04:01
: The Film World as Representation EM models in literature use the line-via test structures which are only part of the real circuit structure. To further demonstrate the necessity for complete circuit modeling, the comparison of the EM performances in a circuit structure and a standard line-via test structure is performed in this ch作者: GIBE 時(shí)間: 2025-3-26 05:42
M. A. Mohamed Salih,Bas Gaay de Fortmancuits consist of a large number of transistors and other circuit components connected by complex inter-block connections made of multiple metal layers. In this chapter, a complete 3D circuit model including both intra- and inter-block interconnects is constructed. Electro-thermo-structural simulatio作者: 肉身 時(shí)間: 2025-3-26 10:51 作者: penance 時(shí)間: 2025-3-26 12:43 作者: 無政府主義者 時(shí)間: 2025-3-26 20:02
Quantitative Brain SPECT in three Dimensionsrm. Studies using patient head CT (for the attenuation map), point-source measurement (for the resolution kernel), and the Hoffman brain phantom demonstrated accurate reconstruction by the enlarged uniform attenuation map (< 1% ROI error), as compared to the reconstruction using the true head attenuation map.作者: 方舟 時(shí)間: 2025-3-26 22:21
Florent Engelmannt are presented and explained will help in monitoring and recording changes, evaluating the effectiveness of treatments and training, evaluating work stations, and preventing and documenting the evolution of occupational disorders of the neuromuscular system.978-88-470-5828-6978-88-470-2463-2作者: CHASE 時(shí)間: 2025-3-27 01:54 作者: Permanent 時(shí)間: 2025-3-27 09:19 作者: 駭人 時(shí)間: 2025-3-27 09:54 作者: 付出 時(shí)間: 2025-3-27 16:51 作者: notice 時(shí)間: 2025-3-27 21:16
Vorbemerkungen dem Bereich Verkehrsdienstleistungen fast sieben Prozent des Bruttoinlandprodukts. Dies reflektiert aber nur einen relativ geringen Teil des Nutzens, den die deutsche Volkswirtschaft aus dem Verkehr zieht. Nicht berücksichtigt sind n?mlich dessen indirekten Leistungen. Zu letzteren geh?ren die Auft
