標(biāo)題: Titlebook: Economics of Electronic Design, Manufacture and Test; Magdy Abadir,Tony Ambler Book 1994 Springer Science+Business Media New York 1994 ana [打印本頁(yè)] 作者: 烏鴉 時(shí)間: 2025-3-21 17:41
書目名稱Economics of Electronic Design, Manufacture and Test影響因子(影響力)
書目名稱Economics of Electronic Design, Manufacture and Test影響因子(影響力)學(xué)科排名
書目名稱Economics of Electronic Design, Manufacture and Test網(wǎng)絡(luò)公開(kāi)度
書目名稱Economics of Electronic Design, Manufacture and Test網(wǎng)絡(luò)公開(kāi)度學(xué)科排名
書目名稱Economics of Electronic Design, Manufacture and Test被引頻次
書目名稱Economics of Electronic Design, Manufacture and Test被引頻次學(xué)科排名
書目名稱Economics of Electronic Design, Manufacture and Test年度引用
書目名稱Economics of Electronic Design, Manufacture and Test年度引用學(xué)科排名
書目名稱Economics of Electronic Design, Manufacture and Test讀者反饋
書目名稱Economics of Electronic Design, Manufacture and Test讀者反饋學(xué)科排名
作者: fastness 時(shí)間: 2025-3-22 00:12 作者: 扔掉掐死你 時(shí)間: 2025-3-22 00:24
High Level Test Economics Advisor (Hi-TEA),ever, deciding on where and when to test and whether to apply Design For Test DFT) and Built-In Self-Test (BIST) at the IC, multichip module (MCM) or board level requires considerable study and evaluation to determine the economics of the various solutions and the payback. In this article we describ作者: 規(guī)范要多 時(shí)間: 2025-3-22 04:55
Multichip Systems Trade-Off Analysis Tool,gn and manufacturing risks by allowing system designers to view the entire performance design space early in the design cycle prior to the initiation of traditional physical design activities..This article describes a software tool that performs interdisciplinary trade-off analysis and partitioning 作者: 矛盾心理 時(shí)間: 2025-3-22 12:23
Trade-off Analysis on Cost and Manufacturing Technology of an Electronic Product: Case Study,y comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete c作者: 知道 時(shí)間: 2025-3-22 14:16
Cost Based Surface Mount PCB Design Evaluation,timating activities need to be speeded up. Consequently, the traditional gap between the designer who designs new products and the estimator who evaluates the financial consequences of the design is fading. Cost optimization is being integrated in the design process, and the designer needs to take m作者: 知道 時(shí)間: 2025-3-22 20:17
Sensitivity Analysis in Economics Based Test Strategy Planning,at a few parameters—e.g., the gate count—need very detailed estimates, whereas the accuracy of many other parameters is insignificant in 99% of all cases. The techniques presented allow an in-depth evaluation of what is perceived as the main drawback in the use of economic modeling methods, namely, 作者: 荒唐 時(shí)間: 2025-3-23 00:35 作者: MIRE 時(shí)間: 2025-3-23 05:00
Boundary Scan in Board Manufacturing,d is a composite of several actual products. Methods for effectively developing a boundary scan test are examined along with some of the advantages of approaching the development in unique ways. Additionally, the criteria for using these methods are developed. Results for test development time and t作者: 門閂 時(shí)間: 2025-3-23 06:26 作者: Simulate 時(shí)間: 2025-3-23 12:04 作者: creatine-kinase 時(shí)間: 2025-3-23 15:04 作者: B-cell 時(shí)間: 2025-3-23 20:32 作者: 異端邪說(shuō)2 時(shí)間: 2025-3-23 23:58
Boundary Scan in Board Manufacturing,he resulting test coverage show that with two weeks of test development using boundary scan it is possible to increase the rate of solder opens detection from 80% to 99% for a large ball-grid-array module.作者: Atmosphere 時(shí)間: 2025-3-24 06:13 作者: heterodox 時(shí)間: 2025-3-24 06:55 作者: 不滿分子 時(shí)間: 2025-3-24 11:22
,Vertikale Baugrubenabschlüsse,, for systems produced in low volumes, the adoption of full scan DFT can be more cost-effective than partial scan DFT when life-cycle costs are considered if it results in significant reductions in the time taken to get the product to market.作者: Palate 時(shí)間: 2025-3-24 18:05 作者: OTTER 時(shí)間: 2025-3-24 20:44
,Festigkeitseigenschaften der B?den,g. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.作者: APEX 時(shí)間: 2025-3-24 23:55 作者: 有說(shuō)服力 時(shí)間: 2025-3-25 04:33 作者: Agronomy 時(shí)間: 2025-3-25 07:56 作者: 易彎曲 時(shí)間: 2025-3-25 13:29 作者: 怒目而視 時(shí)間: 2025-3-25 16:04
,Belastung und Belastbarkeit von B?den,ses. The techniques presented allow an in-depth evaluation of what is perceived as the main drawback in the use of economic modeling methods, namely, the element of risk associated with inaccuracies in the input data.作者: 黃瓜 時(shí)間: 2025-3-25 20:50
Saldropo: Vom Moor zum Feuchtgebietecessary test sequences will be ensured. This procedure drastically decreases the storage requirements (about 80%) and therefore distinctly reduces the necessary test hardware overhead. Experimental results on the ISCAS-S-benchmarks emphasize the efficiency of our approach.作者: ordain 時(shí)間: 2025-3-26 01:30 作者: 疏忽 時(shí)間: 2025-3-26 08:17 作者: 歌曲 時(shí)間: 2025-3-26 11:40 作者: anchor 時(shí)間: 2025-3-26 15:29 作者: fluoroscopy 時(shí)間: 2025-3-26 17:18 作者: 骨 時(shí)間: 2025-3-26 21:54 作者: 多骨 時(shí)間: 2025-3-27 01:37 作者: Pathogen 時(shí)間: 2025-3-27 08:07
978-1-4419-5142-7Springer Science+Business Media New York 1994作者: 盡忠 時(shí)間: 2025-3-27 11:34 作者: 能得到 時(shí)間: 2025-3-27 16:10 作者: Canvas 時(shí)間: 2025-3-27 19:05
,Aufnahme und Deutung des Bodens im Gel?nde,This article will discuss the impact on testing of life-cycle costs and present an approach for minimizing the overall life-cycle costs of a product by selecting the most economic test strategy at each stage. The selection of test strategy is based on a detailed economic analysis of the different test techniques available.作者: 刺穿 時(shí)間: 2025-3-27 22:03 作者: SAGE 時(shí)間: 2025-3-28 05:03 作者: congenial 時(shí)間: 2025-3-28 08:05 作者: Palate 時(shí)間: 2025-3-28 11:34 作者: Soliloquy 時(shí)間: 2025-3-28 18:23 作者: Instrumental 時(shí)間: 2025-3-28 22:33 作者: 葡萄糖 時(shí)間: 2025-3-29 00:23 作者: 大方不好 時(shí)間: 2025-3-29 06:30 作者: 厚顏 時(shí)間: 2025-3-29 07:57
,Vertikale Baugrubenabschlüsse,ever, deciding on where and when to test and whether to apply Design For Test DFT) and Built-In Self-Test (BIST) at the IC, multichip module (MCM) or board level requires considerable study and evaluation to determine the economics of the various solutions and the payback. In this article we describ作者: Altitude 時(shí)間: 2025-3-29 11:45
Totale und effektive Spannungen,gn and manufacturing risks by allowing system designers to view the entire performance design space early in the design cycle prior to the initiation of traditional physical design activities..This article describes a software tool that performs interdisciplinary trade-off analysis and partitioning 作者: LIEN 時(shí)間: 2025-3-29 16:23
,Festigkeitseigenschaften der B?den,y comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete c作者: HOWL 時(shí)間: 2025-3-29 21:18
https://doi.org/10.1007/978-3-662-06129-9timating activities need to be speeded up. Consequently, the traditional gap between the designer who designs new products and the estimator who evaluates the financial consequences of the design is fading. Cost optimization is being integrated in the design process, and the designer needs to take m作者: SLAG 時(shí)間: 2025-3-30 01:15 作者: 指令 時(shí)間: 2025-3-30 05:47 作者: 做作 時(shí)間: 2025-3-30 09:25 作者: FIG 時(shí)間: 2025-3-30 13:41
,Abgrenzung: Bodenschutzrecht — Baurecht,plexity > 100.00 gates). A suitable strategy for error detection as a function of system complexity is identified, and the resulting design flow is described. The statistical control of the design process as a feedback loop to achieve error prevention is demonstrated. Using data from complex project作者: Rinne-Test 時(shí)間: 2025-3-30 19:16 作者: Ophthalmologist 時(shí)間: 2025-3-31 00:01
Untersuchungen am fertigen Bauwerk,asic test questions have not yet been completely resolved. Since the gap between a good and a bad analog circuit is not always well-defined, extensive tests may result in the rejection of many fault-free ICs. The objective of this article is to propose fuzzy optimization models that can help in the 作者: critic 時(shí)間: 2025-3-31 02:47
Saldropo: Vom Moor zum Feuchtgebiet minimize the test hardware effort instead of all the test sequences, only a very small subset will be selected such that a simple generation of all necessary test sequences will be ensured. This procedure drastically decreases the storage requirements (about 80%) and therefore distinctly reduces th作者: 茁壯成長(zhǎng) 時(shí)間: 2025-3-31 08:28
Frank-Michael Lange,Hellmuth Mohr,Karl Stahrexpensive mistakes is to perform an economic analysis of the alternative courses of action. In most cases this is done, but not always in the right manner or with the necessary amount of detail to make the comparisons meaningful. This article discusses the need for effective cost analysis of test st作者: 輕而薄 時(shí)間: 2025-3-31 11:49 作者: mucous-membrane 時(shí)間: 2025-3-31 15:59 作者: 是剝皮 時(shí)間: 2025-3-31 21:11
Untersuchungen am fertigen Bauwerk, by the user. A practical technique for predicting expected test length is developed. This technique is based on clustering faults into equal detectability subsets. A simple and effective algorithm for fault clustering is also presented. The sampling model is applied to each cluster independently an
