作者: 防御 時間: 2025-3-22 00:04
1935-3235 tions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative desi作者: dowagers-hump 時間: 2025-3-22 01:31 作者: cornucopia 時間: 2025-3-22 08:35 作者: Interlocking 時間: 2025-3-22 10:56
1935-3235 o designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.978-3-031-00619-7978-3-031-01747-6Series ISSN 1935-3235 Series E-ISSN 1935-3243 作者: 歌唱隊 時間: 2025-3-22 15:39
Kenneth B. Gordon,Eric M. Rudermanromising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.作者: 歌唱隊 時間: 2025-3-22 17:30
Conclusion,romising in developing high-bandwidth, low power graphics memory interface. 3D integration also enlarges the capacity of on-chip memory, which can be employed as the last-level cache, a portion of main memory, or the combination of both.作者: medieval 時間: 2025-3-23 01:15 作者: cuticle 時間: 2025-3-23 03:57
Coarse-granularity 3D Processor Design,as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such 作者: 是剝皮 時間: 2025-3-23 05:40 作者: 存在主義 時間: 2025-3-23 10:20 作者: assent 時間: 2025-3-23 17:22 作者: Apraxia 時間: 2025-3-23 19:39
Cost Analysis for 3D ICs,s integration benefits offered by 3D integration. However, when it comes to the discussion on the adoption of such emerging technology as a mainstream design approach, it all comes down to the question of the 3D integration cost. . For example, designers may ask themselves questions like,作者: escalate 時間: 2025-3-24 00:46
Conclusion,tion. 3D integration technologies promise high performance, low power, low cost, and high density microprocessor architecture solutions. It is an attractive solution in developing high-performance, energy-efficient, thermal-aware, and cost-effective chip-multiprocessors and GPU systems. In particula作者: 最后一個 時間: 2025-3-24 03:50 作者: 小卷發(fā) 時間: 2025-3-24 08:07 作者: colostrum 時間: 2025-3-24 14:45
Soumya M. Reddy MD,Clifton O. Bingham III MDce. 3D integration is an attractive technology in developing high-performance, power-efficient GPU systems. Recently, 3D integration has been explored by both academia and industry as a promising solution to improve GPU performance and address increasingly critical GPU power issues. In this section,作者: 仔細(xì)檢查 時間: 2025-3-24 17:11
https://doi.org/10.1007/b138733obal on-chip wiring, by using switching fabrics or routers to connect processor cores or processing elements (PEs). Typically, the PEs communicate with each other using a packet-switched protocol, as illustrated by Fig. 6.1.作者: Conscientious 時間: 2025-3-24 21:46
Psoriasis and Psoriatic Arthritisr 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution 作者: blister 時間: 2025-3-25 01:43 作者: creatine-kinase 時間: 2025-3-25 05:02 作者: Recessive 時間: 2025-3-25 11:00
Mahreen Ameen,Jonathan N.W.N. Barker MDA 3D integrated circuit (3D IC) has two or more active device layers (i.e., CMOS transistor layers) integrated vertically as a single chip, using various integration methods. This chapter will give a brief introduction to different 3D integration technologies, including monolithic 3D ICs and through-silicon-via (TSV)-based 3D ICs.作者: 山頂可休息 時間: 2025-3-25 14:06 作者: saphenous-vein 時間: 2025-3-25 18:57
Soumya M. Reddy MD,Clifton O. Bingham III MDAs 3D integration technology emerges, the 3D stacking provides great opportunities of improvements in the microarchitecture. In this chapter, we introduce some recent 3D research in the architecture level. These techniques leverage the advantages of 3D and help to improve performance, reduce power consumption, etc.作者: 不幸的人 時間: 2025-3-25 23:42
3D Integration Technology,A 3D integrated circuit (3D IC) has two or more active device layers (i.e., CMOS transistor layers) integrated vertically as a single chip, using various integration methods. This chapter will give a brief introduction to different 3D integration technologies, including monolithic 3D ICs and through-silicon-via (TSV)-based 3D ICs.作者: admission 時間: 2025-3-26 02:29
Benefits of 3D Integration,The following subsections will discuss various architecture design approaches that leverage different benefits that 3D integration technology can offer, namely, wire length reduction, high memory bandwidth, heterogeneous integration, and cost reduction. It will also briefly review 3D network-on-chip architecture designs.作者: Factual 時間: 2025-3-26 04:58
Fine-granularity 3D Processor Design,As 3D integration technology emerges, the 3D stacking provides great opportunities of improvements in the microarchitecture. In this chapter, we introduce some recent 3D research in the architecture level. These techniques leverage the advantages of 3D and help to improve performance, reduce power consumption, etc.作者: Pedagogy 時間: 2025-3-26 10:09
Die-stacking Architecture978-3-031-01747-6Series ISSN 1935-3235 Series E-ISSN 1935-3243 作者: LAVA 時間: 2025-3-26 15:42
https://doi.org/10.1007/b138733as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such as access interfaces, replacement policies, etc.作者: averse 時間: 2025-3-26 19:24 作者: Prosaic 時間: 2025-3-26 21:03
Psoriasis and Psoriatic Arthritisr 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges.作者: Clumsy 時間: 2025-3-27 01:09 作者: confederacy 時間: 2025-3-27 07:13
978-3-031-00619-7Springer Nature Switzerland AG 2015作者: Herbivorous 時間: 2025-3-27 10:19
Coarse-granularity 3D Processor Design,as caches or even on-chip main memories. Different from the research in the previous section, which focuses on optimizations in the fine-granularity (e.g., wire length reduction), the approaches of this section consider the memories as a whole structure and explore the high-level improvements, such as access interfaces, replacement policies, etc.作者: aplomb 時間: 2025-3-27 15:39
3D Network-on-Chip,obal on-chip wiring, by using switching fabrics or routers to connect processor cores or processing elements (PEs). Typically, the PEs communicate with each other using a packet-switched protocol, as illustrated by Fig. 6.1.作者: HILAR 時間: 2025-3-27 19:12 作者: OVER 時間: 2025-3-27 23:29 作者: cardiovascular 時間: 2025-3-28 05:41 作者: 共同生活 時間: 2025-3-28 08:29
Food Waste Composting in Seattle: The Political Perspectiveay as you throw) system. Trash disposal fee-based incentives, paired with a zero waste resolution and a participation mandate for single- and multi-family residences, have increased Seattle’s composting levels and helped the city achieve one of the highest per capita compostables collection rates in the nation.作者: Foregery 時間: 2025-3-28 13:15 作者: 生存環(huán)境 時間: 2025-3-28 16:29
Simon Lancasterzu entgehen: ?Wenn jemand mich fragt, was eigentlich der Raum ist, von dem ich spreche, bin ich bereit ihm zu sagen, da? ich ihm die Antwort geben werde, wenn er mir vorher erkl?rt, was die Ausdehnung ist.“ Ein Gegner jeder angeborenen Vorstellung, begnügte sich Locke mit der Behauptung, da? der Urs作者: Overstate 時間: 2025-3-28 20:18 作者: 災(zāi)禍 時間: 2025-3-29 02:04
Mechanical and Surgical Options for Patients with End-Stage Heart Failure,f life and survival in heart failure patients, overall morbidity and mortality is still high [1]; refractory end-stage heart failure patients ultimately require either short or long-term mechanical circulatory support (MCS) or heart transplantation. While transplantation is the current gold standard作者: 使熄滅 時間: 2025-3-29 06:34 作者: 巡回 時間: 2025-3-29 07:33
Forests, Carbon Pool, and Timber Production,and the soils an additional 426 Pg C. Given that forests annually exchange about sevenfold more carbon dioxide (CO.) with the atmosphere by photosynthesis and respiration than is emitted by burning of fossil fuels (currently 9.1 Pg C), the role of forests in the global C cycle is significant. Land-u
