標(biāo)題: Titlebook: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs; Brandon Noia,Krishnendu Chakrabarty Book 2014 Springer Inte [打印本頁(yè)] 作者: Magnanimous 時(shí)間: 2025-3-21 19:39
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作者: 情感脆弱 時(shí)間: 2025-3-21 22:07 作者: 吝嗇性 時(shí)間: 2025-3-22 01:11 作者: 影響帶來(lái) 時(shí)間: 2025-3-22 08:03
978-3-319-34534-5Springer International Publishing Switzerland 2014作者: 托人看管 時(shí)間: 2025-3-22 12:02
Infiltration in Unsaturated Soils to mobile devices. As transistors continue their miniaturization march through smaller technology nodes, the limits of device scaling tend to be reached. Interconnects, particularly global interconnects, are becoming a bottleneck in integrated circuit (IC) design. Since interconnects do not scale a作者: 彎彎曲曲 時(shí)間: 2025-3-22 12:57
https://doi.org/10.1007/978-94-009-6175-3in order to minimize cost. This determination is necessary to ensure suitably high compound stack yields, or the yield for stacking subsequent tiers on a stack. This chapter will examine two related issues—the stacking process, in particular the benefits and cost of wafer sorting, and architectures 作者: 彎彎曲曲 時(shí)間: 2025-3-22 20:42
https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associate作者: encomiast 時(shí)間: 2025-3-22 21:13 作者: 武器 時(shí)間: 2025-3-23 03:14
Detection of indoor fungi bioaerosolsst in many scenarios, including memory-on-memory, memory-on-logic, and logic-on-logic stacks. BIST and probing techniques were explored for pre-bond TSV and scan test. Methods for yield assurance, including BISR architectures and wafer matching, were explained in detail. Optimizations for reducing t作者: 配置 時(shí)間: 2025-3-23 06:56 作者: 歡呼 時(shí)間: 2025-3-23 12:41
Fluid Mechanics and Its ApplicationsAs discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.作者: 追蹤 時(shí)間: 2025-3-23 14:47
Built-In Self-Test for TSVs,Pre-bond testing of individual dies prior to stacking is crucial for yield assurance in 3D-SICs [42, 43]. A complete known-good-die (KGD) test requires testing of die logic, power and clock networks, and the TSVs that will interconnect dies after bonding in the stack.作者: bizarre 時(shí)間: 2025-3-23 18:50
Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths,As discussed in previous chapters, 3D ICs require both pre-bond and post-bond testing to ensure stack yield. The goal of pre-bond testing is to ensure that only known good die (KGD) are bonded together to form a stack. Post-bond test ensures the functionality of the complete stack and screens for defects introduced in alignment and bonding.作者: oxidant 時(shí)間: 2025-3-23 22:31
https://doi.org/10.1007/978-3-030-93578-8ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.作者: 音樂(lè)戲劇 時(shí)間: 2025-3-24 03:24
Pre-bond Scan Test Through TSV Probing,ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associated memory.作者: 確定無(wú)疑 時(shí)間: 2025-3-24 07:00
key test and design-for-test technologies, emerging standardThis book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing 作者: Mosaic 時(shí)間: 2025-3-24 11:25 作者: 極大痛苦 時(shí)間: 2025-3-24 15:35 作者: Essential 時(shí)間: 2025-3-24 21:38 作者: 火花 時(shí)間: 2025-3-25 01:59 作者: Mammal 時(shí)間: 2025-3-25 06:25
Axial and Radial Turbines for Gases, and IEEE 1149.1 [20, 102] test standards, that is currently being developed by the IEEE P1838 workgroup [103]. Section 7.3 provides an overview of the JEDEC JESD-229 [104] standard developed for memory-on-logic stacks and how the test wrapper described in Sect.?7.2 can be extended for testing a stack that utilizes the JEDEC framework.作者: 用肘 時(shí)間: 2025-3-25 11:11
Detection of indoor fungi bioaerosolsest cost were also covered, including flows to reduce the delay overhead of DfT architectures and to optimize TAM architectures and test schedules to reduce test time. Together, the topics covered by this book offer an extensive and in-depth look at the cutting-edge of 3D test for students, teachers, researchers, and industry practitioners.作者: crockery 時(shí)間: 2025-3-25 13:15 作者: 甜瓜 時(shí)間: 2025-3-25 18:22
ircuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable. .978-3-319-34534-5978-3-319-02378-6作者: 狗窩 時(shí)間: 2025-3-25 20:48 作者: fleeting 時(shí)間: 2025-3-26 02:57 作者: 匍匐 時(shí)間: 2025-3-26 07:07
Conclusions,est cost were also covered, including flows to reduce the delay overhead of DfT architectures and to optimize TAM architectures and test schedules to reduce test time. Together, the topics covered by this book offer an extensive and in-depth look at the cutting-edge of 3D test for students, teachers, researchers, and industry practitioners.作者: 的染料 時(shí)間: 2025-3-26 09:28 作者: REP 時(shí)間: 2025-3-26 15:30
Wafer Stacking and 3D Memory Test,in order to minimize cost. This determination is necessary to ensure suitably high compound stack yields, or the yield for stacking subsequent tiers on a stack. This chapter will examine two related issues—the stacking process, in particular the benefits and cost of wafer sorting, and architectures 作者: gerrymander 時(shí)間: 2025-3-26 20:23
Pre-bond Scan Test Through TSV Probing,ters 3 and 4 presented methods through BIST and probing to enable pre-bond TSV test. While TSV test is important for KGD test, it covers only a small fraction of the tests that must be performed to achieve complete KGD test. In particular, the majority of die area is dedicated to logic and associate作者: nullify 時(shí)間: 2025-3-26 23:29 作者: STALL 時(shí)間: 2025-3-27 01:24 作者: 文字 時(shí)間: 2025-3-27 07:49
Test-Architecture Optimization and Test Scheduling,作者: 描繪 時(shí)間: 2025-3-27 12:57
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs作者: configuration 時(shí)間: 2025-3-27 16:10
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs978-3-319-02378-6作者: cognizant 時(shí)間: 2025-3-27 19:38
Compiler Backend Generation for Application Specific Instruction Set Processorsiler Open64 to the high-performance embedded processor PowerPC. A reliable version of auto-retargetable industrial-strength compiler is generated which achieves comparable performance to gcc 4.5 for both the EEMBC and SPEC CPU 2000 benchmarks.作者: 行業(yè) 時(shí)間: 2025-3-28 01:26 作者: 委屈 時(shí)間: 2025-3-28 05:52 作者: Dysplasia 時(shí)間: 2025-3-28 08:20
Emil Jurthe,Otto Mietzschke new requirements for protection of that information. Some are longstanding and fundamental - how do we guarantee that information is ”authentic”? How do we guarantee that information is timely? How can we produce bits that have the same properties as ”m978-3-540-65069-0978-3-540-49677-9Series ISSN 0302-9743 Series E-ISSN 1611-3349 作者: 混沌 時(shí)間: 2025-3-28 10:53
Wavelets in Statistics: Some Recent Developmentsts of wavelets are reviewed, concentrating on the discrete wavelet transform, because of its relevance to practical and computational statisticians. Several recent areas of research are discussed, concentrating on extensions of the standard paradigm. A Bayesian approach is natural, because of the no作者: 付出 時(shí)間: 2025-3-28 15:27 作者: 教唆 時(shí)間: 2025-3-28 20:52
