標(biāo)題: Titlebook: Design to Test; A Definitive Guide f Jon L. Turino Book 1990 Jon Turino 1990 ASIC.Counter.Hardware.LSI.VLSI.digital signal processor.hardwa [打印本頁(yè)] 作者: Coagulant 時(shí)間: 2025-3-21 19:58
書(shū)目名稱(chēng)Design to Test影響因子(影響力)
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作者: 誘拐 時(shí)間: 2025-3-21 22:51
System Guidelines,le-board and multiple-subassembly products, at what is termed the system level. Testability does not just happen; it must be planned from the top down, right from the beginning of the system specification and architecture determination phases of product design.作者: acrimony 時(shí)間: 2025-3-22 02:25 作者: Ceremony 時(shí)間: 2025-3-22 08:03
LSI/VLSI Board Level Guidelines, devices per PCB is not decreasing. Rather, the number of functions per PCB is increasing in order to meet marketing and application demands. The result is that the average 100-IC PCB is far more complex. As the complexity of assemblies increases, the cost to test them increases exponentially (see F作者: farewell 時(shí)間: 2025-3-22 09:05
LSI/VLSI ASIC Level Techniques,omer-specific ICs (CSICs) for virtually any application, it has become apparent that even more care will have to be taken during the component design stage in order to insure adequate testability and producibility of digital ICs themselves and of the networks they are assembled into. This proliferat作者: 證明無(wú)罪 時(shí)間: 2025-3-22 16:24 作者: 證明無(wú)罪 時(shí)間: 2025-3-22 20:22
Software Guidelines,d subassembly tests. Many also require interaction between system level designers and hardware and software engineers. Thus close cooperation and teamwork is necessary for software to be successfully testable.作者: Altitude 時(shí)間: 2025-3-23 00:48 作者: laceration 時(shí)間: 2025-3-23 04:11 作者: 小畫(huà)像 時(shí)間: 2025-3-23 08:32 作者: prosthesis 時(shí)間: 2025-3-23 13:41
Nature as a model for technical sensorsBuilt-in test approaches offer significant opportunities for lowering the overall cost of testing both in the factory and in the field. Built-in test features in new designs reduce system integration costs, field service costs, and printed circuit board test and repair costs while providing customers with higher system availability (uptime).作者: novelty 時(shí)間: 2025-3-23 17:23
Changing Family, Changing EducationThere are really only four general approaches to providing improved testability, three of which have already been discussed (serial, ad hoc, and probe-ability implementations). The fourth is the testability bus (T-Bus) approach.作者: GULLY 時(shí)間: 2025-3-23 19:06 作者: ABASH 時(shí)間: 2025-3-24 00:15
Lecture Notes in Computer ScienceAnother new technology that is causing testing difficulties, especially for in-circuit testers, is surface mount technology (SMT). Also sometimes called surface mounted components (SMCs) or surface mounted devices (SMDs), components in the SMT family are placed on the board rather than through the board.作者: 哺乳動(dòng)物 時(shí)間: 2025-3-24 02:22 作者: ablate 時(shí)間: 2025-3-24 09:52 作者: 多節(jié) 時(shí)間: 2025-3-24 13:45 作者: blister 時(shí)間: 2025-3-24 15:41
Merchant Devices on Boards,This chapter covers the control and visibility points required for testable board design using many different microprocessors and several of the most frequently used peripheral chips. After becoming familiar with these guidelines, each designer should be able to extrapolate them and choose specific guidelines for any new device or subassembly.作者: 過(guò)度 時(shí)間: 2025-3-24 22:23 作者: 諷刺滑稽戲劇 時(shí)間: 2025-3-24 23:24
Testability Busses,There are really only four general approaches to providing improved testability, three of which have already been discussed (serial, ad hoc, and probe-ability implementations). The fourth is the testability bus (T-Bus) approach.作者: Entreaty 時(shí)間: 2025-3-25 04:40
Mechanical Guidelines,This chapter deals with designing products mechanically for factory and field test requirements. It also provides the mechanical engineer (product designer) with design-to-test guidelines that will assist in作者: Benign 時(shí)間: 2025-3-25 10:54 作者: Dungeon 時(shí)間: 2025-3-25 14:26
Testability Documentation,This chapter deals with the design and scope of the documentation supporting a PCB, unit, test set, or test software program. Although it may seem only a secondary consideration to many, well-designed documentation can greatly improve the testability of a particular UUT or program.作者: narcotic 時(shí)間: 2025-3-25 17:34
Test Techniques and Strategies,This chapter describes the various testing strategies currently available for board level assemblies. The basic capabilities and limitations of each piece of inspection level and functional level test equipment are summarized, along with an overview of the test flow during production of a given product.作者: 具體 時(shí)間: 2025-3-25 23:41 作者: conception 時(shí)間: 2025-3-26 00:17
Ho-Jun Lee,Seung-Hyun Kim,Moon-Soo Lee succeeding new design have made testability a necessary product performance attribute. For without testability, the most technically elegant product, from a “functions per square of space” standpoint, is absolutely useless.作者: Dungeon 時(shí)間: 2025-3-26 08:01 作者: 否認(rèn) 時(shí)間: 2025-3-26 10:19 作者: clarify 時(shí)間: 2025-3-26 13:36 作者: 光明正大 時(shí)間: 2025-3-26 19:12 作者: 顯示 時(shí)間: 2025-3-27 00:48 作者: 里程碑 時(shí)間: 2025-3-27 01:33
Lecture Notes in Computer Scienced subassembly tests. Many also require interaction between system level designers and hardware and software engineers. Thus close cooperation and teamwork is necessary for software to be successfully testable.作者: GROG 時(shí)間: 2025-3-27 07:03 作者: 乳白光 時(shí)間: 2025-3-27 12:22 作者: 清醒 時(shí)間: 2025-3-27 15:46 作者: PALL 時(shí)間: 2025-3-27 20:33
The Importance of Orbital Analysis devices per PCB is not decreasing. Rather, the number of functions per PCB is increasing in order to meet marketing and application demands. The result is that the average 100-IC PCB is far more complex. As the complexity of assemblies increases, the cost to test them increases exponentially (see Figure 5-1).作者: Bronchial-Tubes 時(shí)間: 2025-3-28 00:06 作者: Asymptomatic 時(shí)間: 2025-3-28 05:02 作者: 盟軍 時(shí)間: 2025-3-28 07:14
https://doi.org/10.1007/978-3-030-57663-9 sure that testability, among other things, is considered during design reviews. Your operation may already have a formal program in place. If it does, the model in this chapter may give you some suggestions for improving it. If it does not, the model that follows should give you at least a starting point in setting up your own program.作者: Constitution 時(shí)間: 2025-3-28 12:26 作者: 名義上 時(shí)間: 2025-3-28 17:05 作者: deciduous 時(shí)間: 2025-3-28 19:49 作者: sparse 時(shí)間: 2025-3-28 23:21
LSI/VLSI Board Level Guidelines, devices per PCB is not decreasing. Rather, the number of functions per PCB is increasing in order to meet marketing and application demands. The result is that the average 100-IC PCB is far more complex. As the complexity of assemblies increases, the cost to test them increases exponentially (see Figure 5-1).作者: 委派 時(shí)間: 2025-3-29 04:09 作者: installment 時(shí)間: 2025-3-29 08:08 作者: Filibuster 時(shí)間: 2025-3-29 14:25
Implementation Guidelines, sure that testability, among other things, is considered during design reviews. Your operation may already have a formal program in place. If it does, the model in this chapter may give you some suggestions for improving it. If it does not, the model that follows should give you at least a starting point in setting up your own program.作者: Halfhearted 時(shí)間: 2025-3-29 16:54 作者: minimal 時(shí)間: 2025-3-29 22:16
tech- nology devices. Chapter 1 has been revised, and several examples throughout the book have been revised and updated. But some- times the more things change, the more they stay the same. All of the guidelines and information presented in this book deal with the three basic testability principles-partition978-94-011-6046-9978-94-011-6044-5作者: Original 時(shí)間: 2025-3-30 01:08
Book 1990one several printings and become a standard in many companies, even in some countries. Both Frank and I are very proud of the success that our customers have had in utilizing the information, all of it still applicable to today‘s electronic designs. But six years is a long time in any technology fie作者: CONE 時(shí)間: 2025-3-30 07:00 作者: PRISE 時(shí)間: 2025-3-30 12:13 作者: cauda-equina 時(shí)間: 2025-3-30 15:50 作者: set598 時(shí)間: 2025-3-30 17:25
The Importance of Orbital Analysis, frequency, or waveform. The common denominator in such circuits is the circuit loading and signal degradation which inevitably occurs when analog signals are transmitted between the unit under test (UUT) and the test equipment.作者: Gustatory 時(shí)間: 2025-3-30 22:43
LSI/VLSI ASIC Level Techniques,ion of complex devices with many varied functions has led to the need for rigorous and highly structured device design practices if adequate tests are to be generated in a timely and cost-effective manner.作者: 我悲傷 時(shí)間: 2025-3-31 04:07
F. Mayor-Zaragozaion coincided; mobilisation of the villagers was regarded as the representation of the nation. In such a context, Foucauldian bio-politics coincided with the increasing politicisation of villagers’ bodies and lives. In this chapter, I will also show the embeddedness of resistance in this process. Vi作者: 厭倦嗎你 時(shí)間: 2025-3-31 06:37 作者: 遺產(chǎn) 時(shí)間: 2025-3-31 10:11
Wie sehen die regulatorischen Rahmenbedingungen aus?.Wie sieht der ?kologische Fu?abdruck aus?.Wie tragen die neuen Verfahren zur regionalen Wirtschaft bei und unterstützen damit die gesellschaftliche Akzeptanz978-3-662-60649-0作者: 賠償 時(shí)間: 2025-3-31 14:26 作者: SLUMP 時(shí)間: 2025-3-31 18:49
,Product Data Technology — A Basis for Virtual Product Development,ing the competitiveness of industrial enterprises. Significant technical progress has been achieved by introducing modern CAX-systems and by establishing and using internet, intranets and extranets. Information and communication technology therefore is changing business processes and working culture
