標題: Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo [打印本頁] 作者: 小巷 時間: 2025-3-21 19:17
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits影響因子(影響力)
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits影響因子(影響力)學科排名
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits網(wǎng)絡(luò)公開度
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits網(wǎng)絡(luò)公開度學科排名
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits被引頻次
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits被引頻次學科排名
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits年度引用
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits年度引用學科排名
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits讀者反饋
書目名稱Design for High Performance, Low Power, and Reliable 3D Integrated Circuits讀者反饋學科排名
作者: 老人病學 時間: 2025-3-21 23:35
Regular Versus Irregular TSV Placement for 3D IC. To solve this problem effectively, we study two TSV assignment algorithms, compare them with other TSV assignment algorithms, and analyze the impact of the quality of TSV assignment algorithms on 3D ICs. Experimental results show that the wirelength of 3D ICs is shorter than that of 2D ICs by up t作者: Transfusion 時間: 2025-3-22 01:43
Steiner Routing for 3D IC. In addition, our TSV relocation results in 9% maximum temperature reduction at no additional area cost. We also provide extensive experimental results including (i) the wirelength and delay distribution of various types of 3D interconnects, (ii) the impact of TSV RC parasitics on routing and TSV r作者: Irrepressible 時間: 2025-3-22 04:48
Low Power Clock Routing for 3D IChat the overall power consumption is minimized. Related SPICE simulation indicates that: (1) a 3D clock network that uses multiple TSVs significantly reduces the clock power compared with the single-TSV case; (2) as the TSV capacitance increases, the power savings of a multiple-TSV clock network dec作者: coagulate 時間: 2025-3-22 11:09 作者: 挫敗 時間: 2025-3-22 15:18
3D Clock Routing for Pre-bond Testabilityinimum skew and constrained slew. Compared with the single-TSV solution, SPICE simulation results show that our multi-TSV approach significantly reduces the clock power by up to 15.9 % for two-die and 29.7 % for four-die stacks. In addition, the wirelength is reduced by up to 24.4 and 42.0 %..The ma作者: 挫敗 時間: 2025-3-22 18:59
3D IC Cooling with Micro-Fluidic Channelse goal of our holistic approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space exploration for early design stage. We also provide an in-depth comparison between T-TSV vs. MFC based cooling method and discuss how to employ DOE and RSM techniques 作者: 我要沮喪 時間: 2025-3-22 22:34 作者: WITH 時間: 2025-3-23 01:22
General Principles of Preoperative Planning. To solve this problem effectively, we study two TSV assignment algorithms, compare them with other TSV assignment algorithms, and analyze the impact of the quality of TSV assignment algorithms on 3D ICs. Experimental results show that the wirelength of 3D ICs is shorter than that of 2D ICs by up t作者: CAMEO 時間: 2025-3-23 09:21
Subcapital Fracture of Fifth Metacarpal. In addition, our TSV relocation results in 9% maximum temperature reduction at no additional area cost. We also provide extensive experimental results including (i) the wirelength and delay distribution of various types of 3D interconnects, (ii) the impact of TSV RC parasitics on routing and TSV r作者: MINT 時間: 2025-3-23 09:58 作者: Substitution 時間: 2025-3-23 16:45 作者: affinity 時間: 2025-3-23 21:24
https://doi.org/10.1007/978-94-024-2026-5inimum skew and constrained slew. Compared with the single-TSV solution, SPICE simulation results show that our multi-TSV approach significantly reduces the clock power by up to 15.9 % for two-die and 29.7 % for four-die stacks. In addition, the wirelength is reduced by up to 24.4 and 42.0 %..The ma作者: 偏離 時間: 2025-3-24 01:29
I. Stefanou,J. Sulem,I. Vardoulakise goal of our holistic approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space exploration for early design stage. We also provide an in-depth comparison between T-TSV vs. MFC based cooling method and discuss how to employ DOE and RSM techniques 作者: 偽造 時間: 2025-3-24 04:53
https://doi.org/10.1007/978-3-642-82961-1 TSVs and STIs. Overall, TSV-STI-stress-induced timing variations can be as much as ± 15 % at the cell level. Thus, as an application to layout optimization, we exploit the stress-induced mobility enhancement to improve performance of 3D ICs. We show that stress-aware layout perturbation could reduc作者: Oafishness 時間: 2025-3-24 08:02
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits作者: bromide 時間: 2025-3-24 11:08 作者: Arthr- 時間: 2025-3-24 17:16 作者: 不公開 時間: 2025-3-24 21:13
K.T. Chau,R.H.C. Wong,T.-f. Wongh-quality solutions in short runtime under the multi-objective goals. We provide comprehensive experimental results on making tradeoffs among performance, thermal, area, and wirelength for 3D ICs..The materials presented in this chapter are based on [25].作者: 索賠 時間: 2025-3-25 00:39 作者: 獎牌 時間: 2025-3-25 06:09 作者: FORGO 時間: 2025-3-25 07:34 作者: Airtight 時間: 2025-3-25 15:36
ntegrity, and thermal analysis for 3D IC designs.Provides fuThis book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level 作者: LITHE 時間: 2025-3-25 17:55
Nikolaos L. Ninis,Stavros K. Kourkoulis with the gate count. Two approaches are proposed to alleviate TSV-to-TSV coupling, namely TSV shielding and buffer insertion. Analysis results show that both approaches are effective in reducing the TSV-caused-coupling and improving timing..The materials presented in this chapter are based on [.].作者: MAL 時間: 2025-3-25 22:33 作者: 廣口瓶 時間: 2025-3-26 01:49
Mechanical Behaviour and Propertiesistribution within a TSV and its power wire connections. Second, we build and validate effective TSV models for current density distributions. Finally, these models are integrated with global power wires for detailed chip-scale power grid analysis..The materials presented in this chapter are based on [.].作者: Adulate 時間: 2025-3-26 04:57 作者: 戰(zhàn)役 時間: 2025-3-26 12:00
Maria Rosa Valluzzi,Claudio Modena-power cells are vertically overlapping below the TSVs. These methods are employed in a force-directed 3D placement successfully and outperform several state-of-the-art placers published in recent literature..The materials presented in this chapter are based on [1].作者: Ptosis 時間: 2025-3-26 15:28
Book 2013-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full det作者: vascular 時間: 2025-3-26 17:38 作者: Panacea 時間: 2025-3-26 22:36 作者: jabber 時間: 2025-3-27 02:52 作者: Ethics 時間: 2025-3-27 06:09
Chip/Package Co-analysis of Mechanical Stress for 3D ICons and reliability analysis. Finally, we study the mechanical reliability issues in practical 3D chip/package designs including wide-I/O and block-level 3D ICs..The materials presented in this chapter are based on [6].作者: Myocyte 時間: 2025-3-27 11:23 作者: 溫室 時間: 2025-3-27 16:10 作者: 雄辯 時間: 2025-3-27 21:23 作者: grenade 時間: 2025-3-28 00:36
Regular Versus Irregular TSV Placement for 3D ICicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a作者: 過份艷麗 時間: 2025-3-28 04:15
Steiner Routing for 3D ICtruction and tree refinement. Our tree construction algorithm builds a delay-oriented Steiner tree under a given thermal profile. We show that our 3D tree construction involves minimization of two-variable Elmore delay function. In our tree refinement algorithm, we reposition the through-silicon-via作者: 舊石器 時間: 2025-3-28 08:52
Buffer Insertion for 3D IC study the fact that Through-Silicon-Vias (TSVs) have large parasitic capacitances that increase signal slew. Next, we develop a buffer insertion algorithm that improves the delay of both 3D and 2D nets in a 3D IC with explicit consideration of signal slew. The effectiveness of this technique is dem作者: 大氣層 時間: 2025-3-28 14:09
Low Power Clock Routing for 3D IC ICs). First, we study the impact of the TSV count and the TSV RC parasitics on clock power consumption. Several techniques are introduced to reduce the clock power consumption and slew of the 3D clock distribution network. We analyze how these design factors affect the overall wirelength, clock pow作者: 支架 時間: 2025-3-28 14:39 作者: 有雜色 時間: 2025-3-28 21:56 作者: itinerary 時間: 2025-3-29 01:27
TSV-to-TSV Coupling Analysis and Optimizationg model. Analysis results show that TSVs cause significant coupling noise and timing problems despite the fact that TSV count is much smaller compared with the gate count. Two approaches are proposed to alleviate TSV-to-TSV coupling, namely TSV shielding and buffer insertion. Analysis results show t作者: 可互換 時間: 2025-3-29 05:59
TSV Current Crowding and Power Integrityior works model TSVs and power wire segments as single resistors, which cannot capture the detailed current distribution and may miss trouble spots associated with current crowding. This chapter studies DC current crowding and its impact on 3D power integrity. First, we explore the current density d作者: Enervate 時間: 2025-3-29 07:58 作者: 違法事實 時間: 2025-3-29 14:48 作者: Angioplasty 時間: 2025-3-29 18:03
Thermal-Aware Gate-Level Placement for 3D ICpread on each die to reduce the local power density and vertically aligned across dies simultaneously to increase thermal conductivity to the heatsink. Second, we move high-power logic cells to the location that has higher conductivity to the heatsink while moving TSVs in the upper dies so that high作者: 說不出 時間: 2025-3-29 20:56
3D IC Cooling with Micro-Fluidic Channelsave been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic channel (MFC) based cooling. In case of power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. 作者: Hectic 時間: 2025-3-30 01:19 作者: 催眠 時間: 2025-3-30 07:39 作者: 留戀 時間: 2025-3-30 09:40 作者: cataract 時間: 2025-3-30 13:04 作者: intuition 時間: 2025-3-30 19:56 作者: ANTIC 時間: 2025-3-30 23:31 作者: acetylcholine 時間: 2025-3-31 01:29
978-1-4899-8696-2Springer Science+Business Media New York 2013作者: ingestion 時間: 2025-3-31 08:28
General Principles of Preoperative Planningicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a
