標(biāo)題: Titlebook: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics; G. Q. Zhang,L. J. Ernst,O. Saint Leger Book 2000 Springer Science+ [打印本頁] 作者: legerdemain 時(shí)間: 2025-3-21 19:43
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作者: Infant 時(shí)間: 2025-3-21 20:16 作者: FLAT 時(shí)間: 2025-3-22 01:16
Simulation in the Industry,orting many Siemens divisions, who are manufacturing assembly boards (PCB). Especially for the new technologies we give support to ensure the product qualities and we help to find out critical manufacturing parameters and to optimize and to qualify components, boards, assembly materials and the manufacturing parameters.作者: Ablation 時(shí)間: 2025-3-22 06:47
Polymer Material Characterization and Modeling,view of presently available material models is presented. In particular a cure dependent linear-viscoelastic model is discussed more in detail. With this model the investigation of processing induced stress fields during and after fabrication is possible.作者: 入伍儀式 時(shí)間: 2025-3-22 12:12 作者: chastise 時(shí)間: 2025-3-22 14:43
https://doi.org/10.1007/BFb0006761orting many Siemens divisions, who are manufacturing assembly boards (PCB). Especially for the new technologies we give support to ensure the product qualities and we help to find out critical manufacturing parameters and to optimize and to qualify components, boards, assembly materials and the manu作者: 完整 時(shí)間: 2025-3-22 21:06
Infinite Dimensional Linear Systems Theorydescription of typical reliability concerns at component and PCB level is given and the effects of temperature on the reliability of microelectronics devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly a作者: 蟄伏 時(shí)間: 2025-3-22 22:27
Ruth F. Curtain,Anthony J. Pritchardof reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM ob作者: 首創(chuàng)精神 時(shí)間: 2025-3-23 05:14 作者: 寬容 時(shí)間: 2025-3-23 08:02 作者: Banquet 時(shí)間: 2025-3-23 09:41
https://doi.org/10.1007/978-1-4757-5462-9aporization during reflow, the representative volume element (RVE) approach, by which the micro-void effect can be taken into consideration, is introduced in this paper. A theoretical model is established to calculate the whole-field vapor pressure in plastic materials. FEA models are built for both作者: Flirtatious 時(shí)間: 2025-3-23 14:00
Infinite Group Actions on Polyhedratheoretical investigations of stresses within electronic material compounds induced by environmental conditions, especially temperature changes, require both the characterization of materials properties and materials interface properties. Measurement results on typical commercially available electro作者: crumble 時(shí)間: 2025-3-23 18:34 作者: 銼屑 時(shí)間: 2025-3-23 23:48 作者: Self-Help-Group 時(shí)間: 2025-3-24 05:57
Morse Theory and Bestvina–Brady Groupsexploited more efficiently by using mathematical optimization methods. This enables the designer to optimize products and processes. We describe two ways of simulation-based optimization and discuss the advantages and disadvantages of both methods.作者: 匍匐 時(shí)間: 2025-3-24 08:31 作者: colloquial 時(shí)間: 2025-3-24 10:42 作者: 出血 時(shí)間: 2025-3-24 16:40
https://doi.org/10.1007/978-1-4612-0385-8view of presently available material models is presented. In particular a cure dependent linear-viscoelastic model is discussed more in detail. With this model the investigation of processing induced stress fields during and after fabrication is possible.作者: 違反 時(shí)間: 2025-3-24 22:56
Morse Theory and Bestvina–Brady Groupsexploited more efficiently by using mathematical optimization methods. This enables the designer to optimize products and processes. We describe two ways of simulation-based optimization and discuss the advantages and disadvantages of both methods.作者: 消息靈通 時(shí)間: 2025-3-25 02:07 作者: 凹處 時(shí)間: 2025-3-25 04:14
Infinite Group Actions on PolyhedraThis paper gives an overview of the current state of non-linear finite element computer programs in relation to the analysis of structures. In addition, it concentrates on two specific areas, namely the introduction of techniques for adaptive re-meshing and the simulation of the propagation of delamination.作者: 與野獸博斗者 時(shí)間: 2025-3-25 10:01 作者: 耕種 時(shí)間: 2025-3-25 12:07
Perspectives of Non-Linear Simulation,This paper gives an overview of the current state of non-linear finite element computer programs in relation to the analysis of structures. In addition, it concentrates on two specific areas, namely the introduction of techniques for adaptive re-meshing and the simulation of the propagation of delamination.作者: 航海太平洋 時(shí)間: 2025-3-25 19:48 作者: 遺忘 時(shí)間: 2025-3-25 23:15
, EuroSimE2000. For the first time, peoplefrom the electronics industry, research institutes, software companiesand universities joined together to discuss present and possiblefuture thermal and mechanical related problems and challenges inmicro-electronics; the state-of-the-art methodologies for th作者: OASIS 時(shí)間: 2025-3-26 03:38 作者: Between 時(shí)間: 2025-3-26 06:42
Thermal and Mechanical Problems in Microelectronics,devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly and packaging community are described and possible solutions are introduced.作者: dominant 時(shí)間: 2025-3-26 12:24 作者: Indolent 時(shí)間: 2025-3-26 15:16
Simulation-based optimization in virtual thermo-mechanical prototyping of electronic packages,in this paper shows that combining reliable nonlinear FEM-based simulation models with this optimization strategy is an effective and efficient method for virtual thermo-mechanical prototyping of electronic packages.作者: 泄露 時(shí)間: 2025-3-26 17:20 作者: 深淵 時(shí)間: 2025-3-26 22:11
Ruth F. Curtain,Anthony J. Pritchard relaxation test procedure for time dependent deformation data. FEM simulation has subsequently been applied to evaluate the experimental raw data to extract material parameters according to the material models provided by ANSYS ?. Crack propagation was investigated by isothermal mechanical cycling.作者: photopsia 時(shí)間: 2025-3-27 03:31
Solder Material Characterisation and Modelling, relaxation test procedure for time dependent deformation data. FEM simulation has subsequently been applied to evaluate the experimental raw data to extract material parameters according to the material models provided by ANSYS ?. Crack propagation was investigated by isothermal mechanical cycling.作者: sclera 時(shí)間: 2025-3-27 08:35
Infinite Dimensional Morse Theory,be solved, the numerical issues involved and the context in which the simulation results are to be used. This paper summarises issues to be considered before simulations are performed and then proceeds to consider specific issues in the choice of discretisation of space and time.作者: 安慰 時(shí)間: 2025-3-27 12:16 作者: 過份艷麗 時(shí)間: 2025-3-27 15:25
https://doi.org/10.1007/978-3-031-48443-8pected thermal fatigue life. Combing these FE simulations with an optimisation tool, the optimal underfill material is proposed. The optimisation is based on a parameter sensitivity analysis using DOE techniques. The optimal properties for the underfill are a high elastic modulus and a CTE closely matched to the CTE of the solder joint.作者: Infect 時(shí)間: 2025-3-27 19:53 作者: outrage 時(shí)間: 2025-3-27 23:37 作者: Arb853 時(shí)間: 2025-3-28 02:41
https://doi.org/10.1007/978-1-4757-5462-9ressure introduces additional mismatch to the package, which is directly related to the vapor pressure distribution, rather than the moisture distribution. Moisture desorption during reflow is also studied and it has significant effect on the moisture distribution, but not on the vapor pressure dist作者: Femish 時(shí)間: 2025-3-28 08:10
Infinite Group Actions on Polyhedra observe growing interface delaminations by using micro deformation measurements on the basis of a gray scale correlation method. Both numerical and experimental investigations provide the basis for a better understanding of failure mechanisms, and should contribute to an increase of applications in作者: 狂熱文化 時(shí)間: 2025-3-28 10:43
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics作者: 生意行為 時(shí)間: 2025-3-28 16:03
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics978-1-4757-3159-0作者: 喃喃而言 時(shí)間: 2025-3-28 20:59 作者: 圣人 時(shí)間: 2025-3-29 02:17 作者: 者變 時(shí)間: 2025-3-29 06:27 作者: Creditee 時(shí)間: 2025-3-29 08:13
Thermal and Mechanical Problems in Microelectronics,description of typical reliability concerns at component and PCB level is given and the effects of temperature on the reliability of microelectronics devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly a作者: crucial 時(shí)間: 2025-3-29 11:52
Solder Material Characterisation and Modelling,of reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM ob作者: d-limonene 時(shí)間: 2025-3-29 16:26 作者: 規(guī)范要多 時(shí)間: 2025-3-29 22:50
Generic Issues in Numerical Modelling,; appropriate simulation is a vital component of any ‘right first time’ philosophy. Many excellent numerical modelling packages exist which enable simulation of thermal and mechanical behaviour, but the usefulness of simulation results depends crucially on the users’ understanding of the problem to 作者: Neuropeptides 時(shí)間: 2025-3-30 01:56 作者: 起皺紋 時(shí)間: 2025-3-30 07:53
Simulation for fatigue, cracks and delamination,theoretical investigations of stresses within electronic material compounds induced by environmental conditions, especially temperature changes, require both the characterization of materials properties and materials interface properties. Measurement results on typical commercially available electro作者: 修正案 時(shí)間: 2025-3-30 11:57 作者: 勉勵(lì) 時(shí)間: 2025-3-30 14:29
Thermal Fatigue Reliability Optimisation of Flip Chip Assemblies,derfill material. However, the solder joint reliability is still very dependent on the choice of the underfill material. Using thermo-mechanical simulations, based on non linear finite element simulations, the induced inelastic strains in the solder joints are calculated, and give a value for the ex作者: 徹底檢查 時(shí)間: 2025-3-30 19:43
Product and Process Optimization with Simulation,exploited more efficiently by using mathematical optimization methods. This enables the designer to optimize products and processes. We describe two ways of simulation-based optimization and discuss the advantages and disadvantages of both methods.作者: Repetitions 時(shí)間: 2025-3-30 23:31
The Human Predicament and Metaphysical Methodially synthetic, and that judgements that are truly ethical have ‘objective’ significance. I cannot hope, and will not pretend to attempt, to fulfil so large a programme in so small a space: at most I shall seek, in considering some of the more important problems that arise in connexion with a specu
