標(biāo)題: Titlebook: Advances in Electronic Circuit Packaging; Volume 3 Lawrence L. Rosine (Editor, EDN (Electrical Design Book 1963 Springer Science+Business M [打印本頁] 作者: Herbaceous 時(shí)間: 2025-3-21 20:02
書目名稱Advances in Electronic Circuit Packaging影響因子(影響力)
書目名稱Advances in Electronic Circuit Packaging影響因子(影響力)學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging網(wǎng)絡(luò)公開度
書目名稱Advances in Electronic Circuit Packaging網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging被引頻次
書目名稱Advances in Electronic Circuit Packaging被引頻次學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging年度引用
書目名稱Advances in Electronic Circuit Packaging年度引用學(xué)科排名
書目名稱Advances in Electronic Circuit Packaging讀者反饋
書目名稱Advances in Electronic Circuit Packaging讀者反饋學(xué)科排名
作者: 死貓他燒焦 時(shí)間: 2025-3-22 00:00 作者: exacerbate 時(shí)間: 2025-3-22 01:19
Designing and Packaging Electronic Modular Enclosures That Never Leave the Ground,et. Fuelling further the discussion on HEIstransformations allows capturing changes in the function, objectives andscope of higher education and research institutions, the move beyond sectoraland disciplinary boundaries and the increasingly blurred boundaries ofacademic professions and of scientific作者: pineal-gland 時(shí)間: 2025-3-22 04:50
Flexibility in Control/Display Panel Packaging,ssive Era and early twentieth century, with the rise of feminists, progressive reformers, and educational philosophers. Although Gildersleeve?is nearly forgotten, her importance to women’s higher education, women’s inclusion in the US military, and world peace is captured in this blend of historical analysis and life history.978-3-319-46861-7作者: 無法治愈 時(shí)間: 2025-3-22 11:46
A Unique Approach to Welded Packaging,al and economic crisis in the East Asian countries — as capital inflows slackened. They tightened their monetary policies, thereby slowing their economies somewhat. Nevertheless, 1997 and the first half of 1998 saw the most favourable combination of relatively high growth and low inflation in many years.作者: 現(xiàn)實(shí) 時(shí)間: 2025-3-22 15:13
How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment,estions for the study of the self that derive from the data on religious conversion. This interest dictated the scope as well as the methods of the present investigation. Namely, I have chosen to study individuals who have indeed changed visibly as a result of their conversion. My inquiry was based on self-re978-1-4899-0932-9978-1-4899-0930-5作者: 修飾 時(shí)間: 2025-3-22 20:56 作者: 我不怕犧牲 時(shí)間: 2025-3-22 22:03 作者: SNEER 時(shí)間: 2025-3-23 04:32 作者: 進(jìn)入 時(shí)間: 2025-3-23 06:49
Selection of Packaging Materials for Oceanographic Instruments,we have. As a commentator once quipped: ‘If Marx had not precisely analysed capitalism we would still call it post-feudalism.’ A post-Cold War era indeed; but how much change is there, and what is really going on?作者: JOG 時(shí)間: 2025-3-23 12:29
Packaging of Electronic Systems Utilizing Commercially Available Integrated Circuits,ntries vary considerably. Countries where labour and the left are weak are moving toward a corporate collectivist pattern. Where labour and the left are strong, the political economies are transitional forms between capitalism and socialism.作者: Legend 時(shí)間: 2025-3-23 16:01 作者: MOCK 時(shí)間: 2025-3-23 22:03 作者: blight 時(shí)間: 2025-3-23 22:45
Keynote Address,ticians)have been subject to widespread public criticism, confronting the state becomes a salient issue. When these parties manage to frame this issue as one of democracy, they take ownership of it, and this th978-3-031-06295-7978-3-031-06293-3作者: generic 時(shí)間: 2025-3-24 03:18 作者: Unsaturated-Fat 時(shí)間: 2025-3-24 06:45
Digital Micromodular Equipment (MICROPAC) Design Concepts, off the slab. Indeed, one foot actually overhangs the slab as if it were about to depart. In the geometric shape of an isosceles triangle, the intimidating figure asserts the dependence of content upon form.作者: 萬花筒 時(shí)間: 2025-3-24 11:04 作者: ALERT 時(shí)間: 2025-3-24 17:57 作者: 盟軍 時(shí)間: 2025-3-24 20:32
Transient Thermal Analysis of the Weld-Pak Package,978-3-319-43835-1作者: indignant 時(shí)間: 2025-3-24 23:11 作者: Carminative 時(shí)間: 2025-3-25 03:20
https://doi.org/10.1007/978-1-4899-7309-2circuit; electronic circuit; electronics作者: 提升 時(shí)間: 2025-3-25 07:57 作者: 步履蹣跚 時(shí)間: 2025-3-25 12:43
Overview: 978-1-4899-7296-5978-1-4899-7309-2作者: 察覺 時(shí)間: 2025-3-25 18:00 作者: strdulate 時(shí)間: 2025-3-25 23:26 作者: 粗魯?shù)娜?nbsp; 時(shí)間: 2025-3-26 03:23
http://image.papertrans.cn/a/image/147928.jpg作者: 脫離 時(shí)間: 2025-3-26 07:23 作者: bizarre 時(shí)間: 2025-3-26 10:55 作者: AER 時(shí)間: 2025-3-26 12:44
Xin Ren,Kai Dong,Rong Zhu,Lingzhi YangC (.module Digital Processor And Computer). As a by-product of the MICROPAC program, equipment design techniques for the economical mounting and interconnection of and heat transfer from digital micromodules have been developed and are described herein. It is shown that the circuitry booklet techniq作者: 船員 時(shí)間: 2025-3-26 19:45
https://doi.org/10.1007/978-3-030-99881-3of ?34° to 150°C and a typical package, 12 by 8 by 6 in., were used. Containers should be fabricated from wrought metals drawn to shape or machined from a solid wrought block. If joints are welded, the materials should be carefully selected to minimize porosity and the development of residual stress作者: GLADE 時(shí)間: 2025-3-26 23:59
Matthew N. Hansen,Jeffrey D. Clogstonbased on the theory of single-pass air-cooled heat exchangers with uniform heat flux for laminar and turbulent flow. General expressions are derived which predict the amount of cooling air required on a normalized basis as a function of parameters such as average package “filling factor” for both th作者: 原告 時(shí)間: 2025-3-27 04:35 作者: 不如屎殼郎 時(shí)間: 2025-3-27 09:16
https://doi.org/10.1007/978-1-4939-7352-1 microelectronic hardware with maximum efficiency. Included in the presentation is a review of thin-film processes, discussions of the basic packaging system and logic circuitry, as well as consideration of pertinent environmental factors.作者: 孵卵器 時(shí)間: 2025-3-27 12:06
The Minerals, Metals & Materials SeriesThis paper describes a balanced design approach established at the Electronic Systems and Products Division of the Martin Company. Included are several economic evaluations to illustrate the advantage in using this approach during the design phase.作者: BATE 時(shí)間: 2025-3-27 14:19
https://doi.org/10.1007/978-3-031-22576-5This paper describes a design program to achieve flexible and pleasing control/display panel packaging for the Ballistic Missile Early Warning System at Thule, Greenland. The object is to provide an optimum combination of initial cost, cost to change, and packing factor in the equipment consoles.作者: Finasteride 時(shí)間: 2025-3-27 21:50
The Minerals, Metals & Materials SeriesThis paper discusses a new high-speed, completely transistorized, airborne digital data processor, designed and manufactured at the General Electric Light Electronics Department for the AEW control system of the Grumman W2F-1 Hawkeye aircraft.作者: 消息靈通 時(shí)間: 2025-3-28 00:03
Guangheng Ji,Xu Gao,Wanlin WangThis paper will describe a packaging concept aimed at achieving component densities higher than with normal “l(fā)aydown” techniques; providing for ease of engineering-change activity; automated assembly; and utilizing both welded and soldered connections. There was no direct attempt at miniaturization.作者: adipose-tissue 時(shí)間: 2025-3-28 05:59
https://doi.org/10.1007/978-3-031-50304-7This paper describes a prefabricated weldable circuitry, Intercon, capable of use at all three packaging levels. A series of figures illustrates the various applications of Intercon.作者: agenda 時(shí)間: 2025-3-28 08:42
Knowledge Generating Experiments,This paper deals with the effects of ambient air density on the weightflow of air delivered by an air moving device to a package requiring cooling, and shows the way in which this change in weightflow governs the component temperature rise above ambient temperature. A typical example indicating the use of the contained information is presented.作者: explicit 時(shí)間: 2025-3-28 10:41 作者: 意見一致 時(shí)間: 2025-3-28 18:10
Barry W. Neun,Marina A. DobrovolskaiaThis paper presents a description of the development and pilot production of microelectronic circuitry at Sylvania Electronic Systems. Special attention is given to material and process requirements and the special production equipment that had to be developed.作者: LINE 時(shí)間: 2025-3-28 18:51 作者: 荒唐 時(shí)間: 2025-3-28 23:39
Timothy M. Potter,Marina A. DobrovolskaiaThis paper presents a discussion of microelectric connections and microminiature electronic design. Included are a section on circuit design philosophy, descriptions of conductive adhesives currently in use, and a discussion of the gold foil and gallium alloy connection techniques.作者: Etching 時(shí)間: 2025-3-29 06:29 作者: liposuction 時(shí)間: 2025-3-29 10:50
Keynote Address,theories.States that repressive acts of the state have been .This book analyzes the transformation of ethnic and religious political parties in Turkey with special focus on their role in the country’s democratization and regime changes. Turkey went through a process of autocratization under the rule作者: 漸變 時(shí)間: 2025-3-29 11:31
Designing and Packaging Electronic Modular Enclosures That Never Leave the Ground,utional and organizational boundaries”. Several signals of shiftingboundaries can be envisaged in higher education and research institutionswhich could be glimpsed through organizations, the institutions and changesto the academic profession. That of boundaries crossing in Higher Educationis a compl作者: 概觀 時(shí)間: 2025-3-29 16:29
Flexibility in Control/Display Panel Packaging,impact.One of the first book length works focusing on GilderThis book examines the life of Virginia Gildersleeve, the dean of Barnard College from 1911 to 1947, who dedicated her life to expanding?women’s collegiate opportunities to match those of men, and to allow women entry into professional and 作者: 放大 時(shí)間: 2025-3-29 22:08 作者: 轎車 時(shí)間: 2025-3-30 03:23 作者: 外形 時(shí)間: 2025-3-30 07:55 作者: NIP 時(shí)間: 2025-3-30 11:06
A Unique Approach to Welded Packaging, per cent in the previous decade. As a result, per capita GDP fell by more than 10 per cent in the 1980s. There were few exceptions — Chile and Colombia among them — to this declining trend in real income. The recession of 1981–2 in the industrial countries and the debt crisis that erupted in the su作者: insightful 時(shí)間: 2025-3-30 13:41
How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment,l disciplines. As the title of this book indicates, my own interest in religious conversion is not sociological, historical, nor anthropolog- ical. My primary interest is not even in the domain of the psychology of religion. That is, this book is not a comprehensive review of the social psychologica作者: 在前面 時(shí)間: 2025-3-30 16:49
Space Seal Study,eat importance, especially at a time when humanity is more divided than ever. Machine Learning has endless possibilities, but if used improperly, it could have far-reaching and lasting negative effects. Many of the ethical problems regarding Machine Learning have already arisen in analogous forms th作者: homeostasis 時(shí)間: 2025-3-30 23:18 作者: 剝皮 時(shí)間: 2025-3-31 01:35
A Packaging Method for Thin-Film Microelectronic Systems,estern European society. In company with such concepts as ‘industrial society’ as used by Saint Simon and Spencer, ‘contract’ as deployed by Maine, and ‘gesellschaft’ as elaborated by T?nnies, the term ‘capitalism’ possessed two important features. First, all such notions entailed a sense of qualita作者: COLIC 時(shí)間: 2025-3-31 06:57 作者: EXCEL 時(shí)間: 2025-3-31 10:19
