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標(biāo)題: Titlebook: Advanced Thermal Stress Analysis of Smart Materials and Structures; Zengtao Chen,Abdolhamid Akbarzadeh Book 2020 Springer Nature Switzerla [打印本頁(yè)]

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書(shū)目名稱Advanced Thermal Stress Analysis of Smart Materials and Structures讀者反饋學(xué)科排名





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978-3-030-25203-8Springer Nature Switzerland AG 2020
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A. Naylor,R. D. Shentall,D. C. Westal fields are elucidated. Moreover, the piezoelectric and piezomagnetic materials as the two common components of smart materials and structures are introduced. Finally, some potential applications of these advanced smart materials are mentioned?and their multiphysical behavior is studied.
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Struktur und Dehnungsverhalten von KollagenThe design of high performance micro/macro-scale composite structures working at high temperature and humidity environmental conditions needs an accurate heat and moisture transfer analysis through the solid structure.
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Die Kr?fte bei menschlicher K?rperbewegungBesides being the snack of choice of the Chinese Giant panda, the bamboo plant also represents a near-perfect natural example of a functionally graded material.
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Front Mattern the use of this meditation. In addition, we suggest that therapists and their clients learn and use samatha, a physiologically calming meditation, to enhance the utility of the SOF meditation during emotionally arousing situations in their life. In the lexicon of mindfulness-based interventions, m
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Book 2020with the multiphysical behaviour of smart materials and structures.? .The book contains six chapters and starts with a?brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL),
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2522-560X ion in thermal stress analysis of smart materials and struct. .This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.? .The book contains si
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Book 2020ons. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry..A series of uncoupled thermal stress analyses on one-dimensional structures are also included. T
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