標(biāo)題: Titlebook: Advanced Thermal Design of Electronic Equipment; Ralph Remsburg Book 1998 Chapman & Hall 1998 Phase.heat transfer.material.performance.rel [打印本頁] 作者: Fixate 時(shí)間: 2025-3-21 17:38
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書目名稱Advanced Thermal Design of Electronic Equipment讀者反饋
書目名稱Advanced Thermal Design of Electronic Equipment讀者反饋學(xué)科排名
作者: Encoding 時(shí)間: 2025-3-21 23:01
and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliab978-1-4613-4633-3978-1-4419-8509-5作者: 幻影 時(shí)間: 2025-3-22 02:20
Front Matterl world in which ruminants forage for a living. I posit that the dispersion of food in the landscape is a species-specific construct with the result that the foodscape of two species foraging in the same landscape will differ because of their differing views of food and their differing ability to se作者: 透明 時(shí)間: 2025-3-22 07:29 作者: Maximize 時(shí)間: 2025-3-22 08:46
Radiation Heat Transfer in Electronic Equipment,..Resource Management for Distributed Multimedia Systems. is acomprehensive view of resource management for a broad technicalaudience that includes computer scientists and engineers involved indeveloping multimedia applications.978-1-4612-8613-4978-1-4613-1413-4作者: 哭得清醒了 時(shí)間: 2025-3-22 15:00
Heat Transfer With Phase Change,ecent research has identified several factors responsible for the declining N content in lowland soils: nitrate accumulation in soils during the dry phase followed by its loss on reflooding, small amounts of crop residues returned to the soils, little use of organic manures and symbiotic N. fixing s作者: WATER 時(shí)間: 2025-3-22 17:37
Acoustics for Electronic Equipment,ased by 280% and 400% when WCD was pre-treated with OR and DS, respectively. Furthermore, DS pre-treated particles revealed enhanced micro-porosities in form of peels and cracks. Significant amounts of gangue minerals (e.g. aluminium and silicon) reported to the tailings, presupposing reduced SR and作者: LAIR 時(shí)間: 2025-3-22 22:34
Introduction to Thermal Design of Electronic Equipment,s to understand state formation, political reordering and the on-going negotiation of political settlements of various types throughout post-colonial Melanesia. It considers how extractive resource industries c978-981-10-8120-0作者: 表兩個(gè) 時(shí)間: 2025-3-23 03:09 作者: 散步 時(shí)間: 2025-3-23 06:56
Front Matterr nutrient, energy and protein requirements from a landscape composed of two ‘food’ patches that differ in their relative densities of these important nutritional variables. Amongst their findings they conclude that, overall, small species are less able to balance their nutritional requirements when作者: 指令 時(shí)間: 2025-3-23 10:19
Introduction to Thermal Design of Electronic Equipment,rce conflict in the Global South.Provides a cutting edge pol.This Pivot offers a comprehensive cross-country study of the effects of large-scale resource extraction in Asia Pacific, considering how large-scale extractive industries engender contentious social, political and economic questions. Addre作者: 容易生皺紋 時(shí)間: 2025-3-23 17:05
Fluid Dynamics for Electronic Equipment,alyze the performance of the enhanced power saving class type III with self-similar traffic. According to the operating principle of the sleep mode in the enhanced power saving class type III, considering the self-similar nature of massive multimedia packets in wireless mobile networks, we build a d作者: 征服 時(shí)間: 2025-3-23 21:16 作者: deface 時(shí)間: 2025-3-23 22:15 作者: 增減字母法 時(shí)間: 2025-3-24 05:02
Combined Modes of Heat Transfer for Electronic Equipment,results which include simulations at link, network and transNowadays, satellites are used for a variety of purposes, including sensors and data collection, weather, maritime navigation and timing, Earth observation, and communications. In particular, satellite transmissions have an important role in作者: 整潔 時(shí)間: 2025-3-24 09:57
Acoustics for Electronic Equipment, leaching (SAL). Oxidative roasting (OR) has often been employed to modify mineralogy of WCD for enhanced recovery. But for challenging side reactions (SR) and poor porosity structure (PS), copper recovery from WCD remains poor even after OR pre-treatment. Employing density separation (DS) to pre-tr作者: 想象 時(shí)間: 2025-3-24 11:23 作者: 極端的正確性 時(shí)間: 2025-3-24 17:07 作者: ensemble 時(shí)間: 2025-3-24 19:07
Patricia Stapleton,Andrew Byerss in this text will allow the reader to move beyond the conventional fluid motion of forced-air convection methods. More advanced cooling techniques include liquid immersion, multiphase cooling, and jet impingement.作者: modish 時(shí)間: 2025-3-25 02:32 作者: flimsy 時(shí)間: 2025-3-25 06:20
https://doi.org/10.1007/978-3-031-06274-2 are: the temperature difference between an object and its surroundings, the surface characteristics of the object and its surroundings, and the view that the object has of its surroundings. Typically, the temperature difference is the delta between the device case and an outer chassis, or an outer 作者: ethereal 時(shí)間: 2025-3-25 08:40 作者: Scintillations 時(shí)間: 2025-3-25 13:43
Thomas Lemke,Christiane Lohkamp some of the energy devoted to forced convection is lost to mechanical energy as vibration and acoustic energy. Although the fundamental theory of acoustics treats vibrations and wave propagation, the subject is a multidisciplinary science. To the electronic packaging engineer, the field of acoustic作者: 津貼 時(shí)間: 2025-3-25 17:21
https://doi.org/10.1007/978-1-4419-8509-5Phase; heat transfer; material; performance; reliability作者: osculate 時(shí)間: 2025-3-25 23:59
http://image.papertrans.cn/a/image/146350.jpg作者: Ischemic-Stroke 時(shí)間: 2025-3-26 03:56 作者: 食料 時(shí)間: 2025-3-26 05:08
Patricia Stapleton,Andrew Byerss in this text will allow the reader to move beyond the conventional fluid motion of forced-air convection methods. More advanced cooling techniques include liquid immersion, multiphase cooling, and jet impingement.作者: 加劇 時(shí)間: 2025-3-26 10:13 作者: 牛的細(xì)微差別 時(shí)間: 2025-3-26 16:00
Patricia Stapleton,Andrew Byersnd reliability are tremendously reduced, as shown in Figure 1.1. Researchers estimate that every 10°C increase in junction temperature reduces the semiconductor life by 50%. The basic objective, then, is to hold the junction temperature below the maximum temperature specified by the semiconductor manufacturer.作者: conifer 時(shí)間: 2025-3-26 16:57 作者: innovation 時(shí)間: 2025-3-26 23:16 作者: 合法 時(shí)間: 2025-3-27 04:43
ion in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One 作者: 蜈蚣 時(shí)間: 2025-3-27 08:33 作者: 遵循的規(guī)范 時(shí)間: 2025-3-27 10:22 作者: meditation 時(shí)間: 2025-3-27 13:50 作者: ELUDE 時(shí)間: 2025-3-27 20:03
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