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標題: Titlebook: Wafer-Level Integrated Systems; Implementation Issue Stuart K. Tewksbury Book 1989 Kluwer Academic Publishers 1989 Flip-Flop.Generator.Prog [打印本頁]

作者: 解放    時間: 2025-3-21 19:25
書目名稱Wafer-Level Integrated Systems影響因子(影響力)




書目名稱Wafer-Level Integrated Systems影響因子(影響力)學科排名




書目名稱Wafer-Level Integrated Systems網(wǎng)絡(luò)公開度




書目名稱Wafer-Level Integrated Systems網(wǎng)絡(luò)公開度學科排名




書目名稱Wafer-Level Integrated Systems被引頻次




書目名稱Wafer-Level Integrated Systems被引頻次學科排名




書目名稱Wafer-Level Integrated Systems年度引用




書目名稱Wafer-Level Integrated Systems年度引用學科排名




書目名稱Wafer-Level Integrated Systems讀者反饋




書目名稱Wafer-Level Integrated Systems讀者反饋學科排名





作者: 雀斑    時間: 2025-3-21 23:41

作者: cylinder    時間: 2025-3-22 01:37
978-1-4612-8898-5Kluwer Academic Publishers 1989
作者: biosphere    時間: 2025-3-22 05:17

作者: CHAFE    時間: 2025-3-22 11:10
General Testing Techniques,he emphasis is on general purpose schemes, such as scan path design of VLSI circuits and syndrome test compression. Special purpose testing schemes (e.g. [5,6,7,8]) developed for specific system functions (PLA’s, random access memories, linear matrix operations, etc) are considered separately in the next chapter.
作者: 易彎曲    時間: 2025-3-22 13:48

作者: 大方一點    時間: 2025-3-22 19:36
Interconnect Issues,This chapter reviews several system performance limits imposed on electronic digital systems by their electrical interconnection fabric. Relaxing such limits is perhaps the major motivation for WSI, though different WSI projects typically address different interconnection issues.
作者: Parley    時間: 2025-3-22 21:23
Interconnect Issues,This chapter reviews several system performance limits imposed on electronic digital systems by their electrical interconnection fabric. Relaxing such limits is perhaps the major motivation for WSI, though different WSI projects typically address different interconnection issues.
作者: Tonometry    時間: 2025-3-23 01:31

作者: 嚙齒動物    時間: 2025-3-23 07:12

作者: 熔巖    時間: 2025-3-23 13:44

作者: 債務    時間: 2025-3-23 16:09

作者: monochromatic    時間: 2025-3-23 18:42

作者: 外星人    時間: 2025-3-23 22:13

作者: Living-Will    時間: 2025-3-24 05:38

作者: Introvert    時間: 2025-3-24 10:17

作者: cancellous-bone    時間: 2025-3-24 12:15

作者: DIS    時間: 2025-3-24 16:30
Stuart K. Tewksburyto do. A good understanding of the basic biology offoodborne organisms is more critical for food scientists now than in previous decades. With so many microbiologists in the 1990s devoting their attention to genes and molecules, one objective of this text is to provide a work that places emphasis on
作者: 千篇一律    時間: 2025-3-24 20:06
Stuart K. Tewksburyok, almost forty years ago, I did not forsee that its completion would take such a long time, although I was well aware that some of Hegel‘s texts stubbornly resist a thorough deciphering of their meaning and argumenta- tion. Having written a dissertation on the young Hegel‘s moral, political, and r
作者: 甜食    時間: 2025-3-25 00:34

作者: 蹣跚    時間: 2025-3-25 04:57

作者: fiscal    時間: 2025-3-25 09:29

作者: Culpable    時間: 2025-3-25 12:47
Stuart K. Tewksburysubjects in a university-level mathematical education. The standard courses in the classical differential geometry of curves and surfaces which were given instead (and still are given in some places) have come gradually to be viewed as anachronisms. However, there has been hitherto no unanimous agre
作者: 策略    時間: 2025-3-25 19:36

作者: AIL    時間: 2025-3-25 23:06
Stuart K. Tewksburyods in mathematical physics" has been organized in Acireale (Catania, Sicily, October 27- 31, 1992). The Workshop was aimed to enlighten the present state ofthis rapidly expanding branch of applied mathematics. Main topics of the Conference were: ? classical Lie groups applied for constructing invar
作者: Eructation    時間: 2025-3-26 03:17

作者: perimenopause    時間: 2025-3-26 08:02

作者: 不知疲倦    時間: 2025-3-26 10:19
Stuart K. Tewksburyve decay processes. Modern hot-atom chemistry includes a broad range of disciplines such as fundamental studies from physical chemistry of gas-phase energetic reactions to inorganic solid-state chemistry, as well as recent practical applications in life sciences and energy-related research. In spite
作者: 有權(quán)威    時間: 2025-3-26 16:33
Stuart K. Tewksburyt perceptual image quality. The early years of the 21st century have witnessed a tremendous growth in the use of digital images as a means for representing and communicating information. A considerable percentage of this literature is devoted to methods for improving the appearance of images, or for
作者: 欄桿    時間: 2025-3-26 18:08
Stuart K. Tewksburysive because it does not use human navigators who are, unavoidably, highly trained and thus expensive people. What is more, unmanned deep space travel would be impossible without automatic navigation. Navigation can be automated with the radio systems Loran, Omega, and the Global Positioning System
作者: 否決    時間: 2025-3-26 23:29

作者: nerve-sparing    時間: 2025-3-27 02:03

作者: nascent    時間: 2025-3-27 05:59
Optical Interconnections,usly will remain electrical. The main question is not whether optical communications will be used within a computing machine but instead how deeply such optical techniques will penetrate into the interconnection hierarchy.
作者: 機密    時間: 2025-3-27 10:23
Introduction,wafer scale integration (WSI) has not led to widespread commercial wafer-scale products suggests that the approach is fatally flawed and of little interest. However, it is more appropriate to regard the failures of WSI as failures in competing with an aggressively expanding silicon VLSI technology w
作者: Exhilarate    時間: 2025-3-27 17:35
Introduction,wafer scale integration (WSI) has not led to widespread commercial wafer-scale products suggests that the approach is fatally flawed and of little interest. However, it is more appropriate to regard the failures of WSI as failures in competing with an aggressively expanding silicon VLSI technology w
作者: Ibd810    時間: 2025-3-27 21:22
Fabrication Defects, (i.e. resist-level patterns) are common to virtually all fabrication processes. Wafer defects are considered in Section 3.1 while lithography defects are discussed in Section 3.2. There are also major defect mechanisms arising during deposition and etching of the thin film dielectric and metalizati
作者: Complement    時間: 2025-3-27 22:54
Fabrication Defects, (i.e. resist-level patterns) are common to virtually all fabrication processes. Wafer defects are considered in Section 3.1 while lithography defects are discussed in Section 3.2. There are also major defect mechanisms arising during deposition and etching of the thin film dielectric and metalizati
作者: 滴注    時間: 2025-3-28 02:49
Reliability and Failures,sis and modeling have been developed (e.g. [1,2]). WSI provides reconfiguration or other repair strategies to avoid faulty components, assuming that the faults are known. The emphasis has been on initial yield of functional circuitry, with less attention of achieving tolerance for in-service faults.
作者: CIS    時間: 2025-3-28 10:07

作者: Militia    時間: 2025-3-28 12:38
Yield Models and Analysis,effects. Defects during patterning or film depositions can lead to shorts, open lines or defective transistors, as discussed in the previous chapter. Such defect-based faults are considered in this chapter. However, faults also arise through degradation in features, such as electromigration failure
作者: 序曲    時間: 2025-3-28 17:31

作者: outskirts    時間: 2025-3-28 19:55

作者: gregarious    時間: 2025-3-29 02:14
General Testing Techniques,he emphasis is on general purpose schemes, such as scan path design of VLSI circuits and syndrome test compression. Special purpose testing schemes (e.g. [5,6,7,8]) developed for specific system functions (PLA’s, random access memories, linear matrix operations, etc) are considered separately in the
作者: 充氣球    時間: 2025-3-29 05:07
Function-Specific Testing,l-purpose testing schemes. Three distinct circuit functions (memory arrays, regular logic arrays and programmable logic arrays) are used as examples of the various techniques which can be used. A major issue for special purpose testing is reduction of the size of the set of test vectors, drawing on
作者: Temporal-Lobe    時間: 2025-3-29 09:14

作者: 寬大    時間: 2025-3-29 15:23

作者: 進取心    時間: 2025-3-29 16:46
Physical Restructuring,monolithic IC/WSI circuits. The term “.” is generally here used to represent physical alteration of the circuit interconnection links, including switches along interconnection paths. The alterations may involve addition or deletion of connections between physical interconnections or physical program
作者: dagger    時間: 2025-3-29 22:03

作者: 或者發(fā)神韻    時間: 2025-3-30 03:17
Programmable Electronic Reconfiguration Switches, are prominently used in experimental logic circuits designed for yield enhancement. Figure 10.1 shows the general model of an electronic switch for reconfiguration of interconnections. In addition to the specific switching of an input line . to an output line ., the open/closed state of the switch
作者: manifestation    時間: 2025-3-30 07:28

作者: RENAL    時間: 2025-3-30 09:21

作者: 思想流動    時間: 2025-3-30 16:18

作者: Servile    時間: 2025-3-30 18:57
Silicon Wafer Hybrids,h the circuit board fabricated on a silicon wafer. Lewis [1], at the conclusion of his study of package performance, suggests flip-chip, beam lead or tape (TAB) mounting of unpackaged ICs directly on a crystal substrate.. Tewksbury [2] suggested flip-chip mounting of VLSI ICs on silicon wafers, usin
作者: 根除    時間: 2025-3-30 23:11
Optical Interconnections,s natural to consider alternative approaches to provide communications within a high-performance system. Optical interconnects have received considerable attention [1] – [11]. Already, optical networks are being developed for local area networks to provide high performance networking between compute
作者: OVERT    時間: 2025-3-31 01:32
Optical Interconnections,s natural to consider alternative approaches to provide communications within a high-performance system. Optical interconnects have received considerable attention [1] – [11]. Already, optical networks are being developed for local area networks to provide high performance networking between compute
作者: Fortuitous    時間: 2025-3-31 08:53

作者: Acclaim    時間: 2025-3-31 10:44
Silicon Wafer Hybrids,g a silicon wafer template to allow stacking of substrates and construction of 3-dimensional wafer stacks. Grinberg, Nudd and Etchells [3] also suggested stacked wafers, in this case monolithic WSI circuits for image processing architectures. Extensive effort has been directed at commercial applications of such advanced packaging (e.g. [4,5]).
作者: anagen    時間: 2025-3-31 15:32
Silicon Wafer Hybrids,g a silicon wafer template to allow stacking of substrates and construction of 3-dimensional wafer stacks. Grinberg, Nudd and Etchells [3] also suggested stacked wafers, in this case monolithic WSI circuits for image processing architectures. Extensive effort has been directed at commercial applications of such advanced packaging (e.g. [4,5]).
作者: AWRY    時間: 2025-3-31 19:19

作者: Indicative    時間: 2025-3-31 22:39
Introduction,ractical constraints are emerging. It is within this future perspective that wafer scale integration emerges as a natural evolution of present device-oriented VLSI chip technologies to future system-oriented wafer-level technologies.
作者: 使迷醉    時間: 2025-4-1 02:01

作者: 祖先    時間: 2025-4-1 06:54

作者: 蔓藤圖飾    時間: 2025-4-1 10:15

作者: 人工制品    時間: 2025-4-1 14:32
Programmable Electronic Reconfiguration Switches,information may have to be externally loaded into the storage node (typically a flip-flop or a latch). In Figure 10.1, this external loading is provided by two global lines, one providing the switch state and the other a control signal loading that state into the storage node.
作者: Hemiplegia    時間: 2025-4-1 19:19
Programmable Electronic Reconfiguration Switches,information may have to be externally loaded into the storage node (typically a flip-flop or a latch). In Figure 10.1, this external loading is provided by two global lines, one providing the switch state and the other a control signal loading that state into the storage node.
作者: BOOM    時間: 2025-4-1 23:23
Fabrication Defects, the specific defect mechanisms impacting interconnections. Any process line is a dynamically changing set of carefully engineered equipment, adjusted for example through evaluation of test wafers to achieve the highest possible yield of IC’s meeting reliability and performance requirements. Because
作者: 自傳    時間: 2025-4-2 03:19
Fabrication Defects, the specific defect mechanisms impacting interconnections. Any process line is a dynamically changing set of carefully engineered equipment, adjusted for example through evaluation of test wafers to achieve the highest possible yield of IC’s meeting reliability and performance requirements. Because
作者: sleep-spindles    時間: 2025-4-2 07:03
Reliability and Failures,ilure mechanisms seen in silicon VLSI. Studies of the impact of scaling devices to smaller sizes on reliability are also reviewed, suggesting that the reliability issue will become more prominent as device dimensions shrink.
作者: bronchiole    時間: 2025-4-2 11:38

作者: 四海為家的人    時間: 2025-4-2 16:50
Yield Models and Analysis,rs catch such violations. Another category of faults arises from statistical parameter variations arising during processing. Yield degradation due to such fabrication variations are called . [1,2,3], resulting in circuits which do not operate within specification. Though of considerable importance i
作者: A保存的    時間: 2025-4-2 19:37

作者: 離開真充足    時間: 2025-4-3 02:02
Function-Specific Testing,tion, routing and response analysis of test vectors can be implemented using the general purpose testing structures (e.g. scan path testing, response compression, TMR, etc.) discussed in the previous chapter. The techniques discussed below begin with testing of memory arrays, where the contents of e
作者: Fibrin    時間: 2025-4-3 06:26
Function-Specific Testing,tion, routing and response analysis of test vectors can be implemented using the general purpose testing structures (e.g. scan path testing, response compression, TMR, etc.) discussed in the previous chapter. The techniques discussed below begin with testing of memory arrays, where the contents of e
作者: PAD416    時間: 2025-4-3 08:07
Formal Models of Reconfiguration,low movement through the array becomes limited by the longest delay path. For example, the uniform length, nearest neighbor interconnections of an ideal systolic array provide much of the impetus for systolic array designs in the first place. Introduction of reconfiguration schemes, which introduce
作者: 別名    時間: 2025-4-3 13:39





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