標題: Titlebook: Wafer-Level Chip-Scale Packaging; Analog and Power Sem Shichun Qu,Yong Liu Book 2015 Springer Science+Business Media New York 2015 Analog T [打印本頁] 作者: 淺吟低唱 時間: 2025-3-21 17:56
書目名稱Wafer-Level Chip-Scale Packaging影響因子(影響力)
作者: Obstreperous 時間: 2025-3-21 21:37
Stackable Wafer-Level Analog Chip-Scale Package,ally mentioned as well. More frequently, heat dissipation is one of the mostly concerned areas for the stacked package. Cost of manufacturing the 3D structure seems to be the main hurdle for wider adoptions of the more aggressive 3D package concepts.作者: fiction 時間: 2025-3-22 03:46
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.作者: HARD 時間: 2025-3-22 05:40
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.作者: 高歌 時間: 2025-3-22 10:55 作者: 皺痕 時間: 2025-3-22 13:45
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging,miconductor industry. This chapter covers in more detail how advances in both the analog and power advanced wafer-level package fan-in/fan-out design and 3D integration have co-enabled significant advances in analog and power device capability during recent years. Extrapolating the same trends in re作者: Cloudburst 時間: 2025-3-22 19:15
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.作者: Keshan-disease 時間: 2025-3-23 00:24
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.作者: miniature 時間: 2025-3-23 02:28 作者: Veneer 時間: 2025-3-23 07:22 作者: 不舒服 時間: 2025-3-23 13:09 作者: Torrid 時間: 2025-3-23 14:58 作者: 合群 時間: 2025-3-23 20:48 作者: Innocence 時間: 2025-3-23 23:33
Wafer-Level Discrete Power Mosfet Package Design,de various diodes, bipolars, metal–oxide semiconductor field-effect transistors (Mosfets), and insulated gate bipolar transistor (IGBTs). As the needs of miniaturization, one trend of the discrete power Mosfet packages is to move the discrete power devices into various wafer-level chip-scale package作者: Cholagogue 時間: 2025-3-24 04:32
Wafer-Level Packaging TSV/Stack Die for Integration of Analog and Power Solution,few years ago are today commonplace thanks in part to advances in WLCSP electronic package design. From portable applications such as in mobile telecommunications to consumer electronics, each imposes its own individual demands on the development of WLCSP. To meet such a diverse range of application作者: zonules 時間: 2025-3-24 10:16 作者: Exonerate 時間: 2025-3-24 12:46 作者: sinoatrial-node 時間: 2025-3-24 17:17
Thermal Management, Design, and Analysis for WLCSP,the device does not operate in a normal way. It is also well known that the failure rates of semiconductor devices increase exponentially as the junction temperature rises. Figure 7.1 shows a FLIR camera image of temperature distribution inside a smart phone, which gives the sources of heat dissipat作者: 言行自由 時間: 2025-3-24 19:45
Electrical and Multiple Physics Simulation for Analog and Power WLCSP, electrical performance of different devices, effect of assembly reflow process on electrical properties, and the resistance of a solder joint, have been done to improve a product’s electrical performance [1–3]. In recent years, the investigation for the electrical performance of a WLCSP has been pa作者: 補角 時間: 2025-3-25 00:40 作者: 公社 時間: 2025-3-25 06:33
WLCSP Assembly,d circuit board (PCB), solder reflow, and optional underfill. Figure 9.1 provides a schematic diagram of a typical assembly line setup involving WLCSP, in which solder paste or flux is first printed or dispensed on the PCB respectively before WLCSP pick and placement. Reflow is followed to finish th作者: visceral-fat 時間: 2025-3-25 09:12
WLCSP Assembly,d circuit board (PCB), solder reflow, and optional underfill. Figure 9.1 provides a schematic diagram of a typical assembly line setup involving WLCSP, in which solder paste or flux is first printed or dispensed on the PCB respectively before WLCSP pick and placement. Reflow is followed to finish th作者: CESS 時間: 2025-3-25 14:20 作者: 艦旗 時間: 2025-3-25 16:42
WLCSP Typical Reliability and Test,ll form factor, and low cost. This technology results in a lower cost per die (vs. traditional wirebond) when the die count per wafer is high. As the number of I/O per die increases (and thus the die size and the distance to neutral point increases), the WLCSP may not achieve prescribed solder joint作者: 革新 時間: 2025-3-25 20:35
Book 2015ation, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly,作者: 殘暴 時間: 2025-3-26 01:20 作者: 貞潔 時間: 2025-3-26 06:24
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging, can drive continued enhancements in usability, efficiency, reliability, and overall cost of analog and power semiconductor solutions. Challenges of die shrinkage in both wafer-level analog and power semiconductor packaging in next-generation design are presented and discussed.作者: EXCEL 時間: 2025-3-26 11:03
Wafer-Level Discrete Power Mosfet Package Design,sonal computers, servers, network, and telecom systems, it demands higher performance from the components that make up the power management system. This chapter introduces the design of discrete power package and the analysis of the wafer-level discrete power package performance.作者: Cupidity 時間: 2025-3-26 16:10 作者: B-cell 時間: 2025-3-26 19:28
Electrical and Multiple Physics Simulation for Analog and Power WLCSP,d switch speed of the WLCSP circuit. The electromigration issue of WLCSP, which is a multi-physics problem, becomes more critical due to the high current density in analog and power electronics. This chapter will introduce the electrical parasitic RLC simulation and electromigration simulation methods for WLCSP and wafer level interconnects.作者: bypass 時間: 2025-3-27 00:47 作者: 不能平靜 時間: 2025-3-27 02:20
duces the development of the analog and power SIP/3D/TSV/staAnalog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP pack作者: 認識 時間: 2025-3-27 08:17 作者: 問到了燒瓶 時間: 2025-3-27 12:39
Thermal Management, Design, and Analysis for WLCSP,device induces an increase in the junction temperature. This depends on the amount of power dissipation and the thermal resistance between the junction and the WLCSP bumps, an ambient, and some other specified reference point. This chapter introduces the thermal management, design, analysis, and cooling methods for WLCSP.作者: GLUT 時間: 2025-3-27 16:00 作者: 火車車輪 時間: 2025-3-27 20:55
Shichun Qu,Yong Liuve a linear integral equation, which is then solved by the Tikhonov method with the identity as the regularization operator. We prove in this paper that the resulting equation is well-condition and has clustered spectrum. Hence if the conjugate gradient method is used to solve the equation, we expec作者: 乳白光 時間: 2025-3-28 00:43 作者: Affiliation 時間: 2025-3-28 03:25
Shichun Qu,Yong Liuot taken into account. A way to derive an enhanced constitutive model for masonry, closely related to the behaviour of its constituent materials (mortar and bricks) and to its geometry (bond pattern, thickness of the mortar joints, etc.), is to take advantage of the homogenization techniques, which 作者: diabetes 時間: 2025-3-28 09:37 作者: Vertical 時間: 2025-3-28 10:35
Shichun Qu,Yong Liual students at the University of Michigan, none of the existing texts seemed exactly right. On the one hand, the many decent, even inspiring, books on elementary computational statistics stress the nuts and bolts of using packaged programs and emphasize model interpretation more than numerical analy作者: Vertebra 時間: 2025-3-28 18:11
Shichun Qu,Yong Liutific disciplines and a resurgence of interest in the modern as well as the clas- sical techniques of applied mathematics. This renewal of interest, both in research and teaching, has led to the establishment of the series Texts in Applied Mathematics (TAM). The development of new courses is a natur作者: 陪審團每個人 時間: 2025-3-28 19:47 作者: 具體 時間: 2025-3-28 23:45 作者: 來這真柔軟 時間: 2025-3-29 05:34
Shichun Qu,Yong Liu is unknown to you, you must take the road that is unknown to you St. John of the Cross This is a book on the numerical approximation ofpartial differential equations (PDEs). Its scope is to provide a thorough illustration of numerical methods (especially those stemming from the variational formulat作者: Mammal 時間: 2025-3-29 07:19 作者: 脖子 時間: 2025-3-29 12:45 作者: 姑姑在炫耀 時間: 2025-3-29 18:18
Shichun Qu,Yong Liu multiple shooting, collocation and other local discretizations can share a common structure. The identification of this common structure permits us to analyse how various components of a method interact and also permits us to consider the assembly of a collection of modular routines which will even作者: JIBE 時間: 2025-3-29 22:13 作者: 取消 時間: 2025-3-30 02:03 作者: 積云 時間: 2025-3-30 06:11 作者: LUMEN 時間: 2025-3-30 11:21 作者: 寬容 時間: 2025-3-30 14:06 作者: 分解 時間: 2025-3-30 16:52
Shichun Qu,Yong Liuhese polynomials have been deduced, via tensor product, from certain de la Vallée Poussin type means on ., which generalize classical delayed arithmetic means of Fourier partial sums. They are based on arbitrary sequences of filter coefficients, not necessarily connected with a smooth filter functio作者: 和平主義 時間: 2025-3-30 20:44 作者: Kaleidoscope 時間: 2025-3-31 02:33
Shichun Qu,Yong Liuheorem that is uniform in the parameter .?∈?.. In turn, this then leads to ..-quasi-optimal rates of convergence (., algebraic orders of convergence) for the Galerkin approximations of the solution ., where the approximation spaces are defined using the “polynomial chaos expansion” of . with respect作者: theta-waves 時間: 2025-3-31 07:40 作者: 狂怒 時間: 2025-3-31 12:52
Shichun Qu,Yong Liufurther increases the accuracy of our computations without increase of the computational time. In order to facilitate these techniques, we use spline approximation of the elastic cross-section, which is more accurate than the widely used tables of Jablonski.作者: 過于光澤 時間: 2025-3-31 15:14
Shichun Qu,Yong Liuenerally well posed: in linear elasticity, it yields the macroscopic elastic characteristics of masonry (in the case of running bond masonry, the four constants defining the equivalent orthotropic material) [1]. In the non-linear range (damage or plasticity), it may be used to determine the failure 作者: Acupressure 時間: 2025-3-31 19:37 作者: Cholesterol 時間: 2025-3-31 22:47 作者: Tortuous 時間: 2025-4-1 01:50 作者: Antioxidant 時間: 2025-4-1 07:17
Shichun Qu,Yong Liues only simple arithmetic in the derivation of the discretization equations and in writing the corresponding programs. During 1950–1970 FDM was the most important numerical method used to solve practical problems ([5–7]). With the development of high speed computers having large scale storage capabi作者: 仔細閱讀 時間: 2025-4-1 10:55
Shichun Qu,Yong Liueoretical aspects that are needed in the applications, such as the solution of the Riemann problem, with occasional insights into more sophisticated problems. The present book is divided into six chapters, including an introductory chapter. For the reader‘s convenience, we shall resume in this Intro作者: Dorsal 時間: 2025-4-1 15:08
Shichun Qu,Yong Liu a number of (initial-) boundary value problems of interest in several fields of applications. Part I is devoted to the description and analysis of general numerical methods for the discretization of partial differential equations. A comprehensive theory of Galerkin methods and its variants (Petrov-作者: Amorous 時間: 2025-4-1 22:24
Shichun Qu,Yong Liu of the time and frequency domain representations of signals. While this book assumes some familiarity with traditional methods the emphasis is altogether quite different. The aim is to describe general methods for carrying out optimal signal processing.978-1-4612-6880-2978-1-4612-0717-7Series ISSN 1431-8784 Series E-ISSN 2197-1706 作者: organic-matrix 時間: 2025-4-2 02:00
Shichun Qu,Yong Liuhe convergence requirements of the corresponding iteration schemes (used to solve the discretized problem) has been investigated. Appropriate modifications to these methods which permit the effective solution of such problems will be discussed. We will also identify a subfamily of the Runge-Kutta me作者: 現(xiàn)代 時間: 2025-4-2 05:16 作者: OATH 時間: 2025-4-2 08:07 作者: 無能性 時間: 2025-4-2 14:46
Shichun Qu,Yong Liuand and Dr. John Brauer of McNeal-Schwendler Corp. for their advice on transient eddy current computation; and Dr. Zoltan Cendes of Ansoft Corp. for information about their adaptive mesh generator. Again, I would like to acknowledge the support for this second edition by my wife, Candace. Again, I c
