作者: flamboyant 時(shí)間: 2025-3-21 22:46 作者: 婚姻生活 時(shí)間: 2025-3-22 01:29
Wojciech Malyour bibliography of more than 500 refer- ences, and we also have attempted to review the most important scientific papers on prin- ciples and practice of ionizing radiation therapy in a constructive way. We are grateful to Professor Gorson, Dr. Breneman, and Professor Lindel6f, who generously contributed chap978-1-4613-9043-5978-1-4613-9041-1作者: BIDE 時(shí)間: 2025-3-22 04:47 作者: integrated 時(shí)間: 2025-3-22 11:34 作者: 休閑 時(shí)間: 2025-3-22 16:47
W. Kent Fuchs,Sy-Yen KuoM Parts," International Journal of Powder Metallurgy, Vol. 5, April, 1969. 2. P. F. Mathews, "Effects of Processing Variables on the Properties of Sintered Aluminum Compacts,!! International Journal of Powder Metallurgy, Vol. 4, October, 1968. 3. J. H. Dudas and K. J. Brondyke, "Aluminum P/M Parts - Their Pro978-1-4615-8965-5978-1-4615-8963-1作者: Trabeculoplasty 時(shí)間: 2025-3-22 17:08 作者: Indent 時(shí)間: 2025-3-22 22:22 作者: 晚來的提名 時(shí)間: 2025-3-23 03:10 作者: calorie 時(shí)間: 2025-3-23 06:40
J. F. McDonald,S. Dabral,H. T. Linpists and then in Part II, tie this trend into the historical tradition of functionalism. Both the common features of clinical func- tionalism and the specific ideas and methods of James, Janet, Burrow, Taft, and Thorne are presented. I believe it will be a revelation to many readers to see the contemporary s978-1-4684-1160-7978-1-4684-1158-4作者: justify 時(shí)間: 2025-3-23 11:23
R. Wayne Johnson,Richard C. Jaeger,Travis N. Blalocke of electronics in the design and construction of certain automobile parts. Examples of these are the use of transistors, diodes and printed circuits on flat and flexible bases, notably for instrument panels, while minia- turized versions of printed circuits are finding wider applications in automobile compo978-94-011-6883-0978-94-011-6881-6作者: nocturia 時(shí)間: 2025-3-23 14:57 作者: FAST 時(shí)間: 2025-3-23 21:04 作者: 流利圓滑 時(shí)間: 2025-3-24 01:49
High Yield In-Situ Fabrication of Multilevel Interconnections for WSI,f in-situ processing is the elimination entirely of the use of liquids in wet processing steps, the introduction of all deposition and etching reactants as gases or vapors in ultra clean vessels, and the use of extreme chemical purity. Often this implies the use of low level or even ultra high vacuu作者: Spinous-Process 時(shí)間: 2025-3-24 03:32
Book 1989n to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuit作者: 畏縮 時(shí)間: 2025-3-24 07:25
test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuit978-1-4612-8896-1978-1-4613-1621-3作者: Amylase 時(shí)間: 2025-3-24 12:17 作者: 使長胖 時(shí)間: 2025-3-24 15:38 作者: 思考才皺眉 時(shí)間: 2025-3-24 21:16 作者: 有雜色 時(shí)間: 2025-3-25 01:12 作者: 合乎習(xí)俗 時(shí)間: 2025-3-25 04:04 作者: 憤怒歷史 時(shí)間: 2025-3-25 11:03
N. R. Strader,J. C. Hardenelopments and Applications in Microbeam Analysis" which th th took place from the 11 to 15 May 1997 in Torquay (UK). EMAS was founded in 1986 by scientists from many European countries in order to stimulate research in microbe am analysis and into its development and application. The society now has作者: 滑稽 時(shí)間: 2025-3-25 14:23 作者: 朝圣者 時(shí)間: 2025-3-25 18:47
W. Kent Fuchs,Sy-Yen Kuoomic considerations and production rates desired. Batch furnaces have lowest investment costs and are adequate for low to medium production whereas continuous furnaces are more costly but provide higher production rates. strong, well-sintered P/M parts can be obtained in atmos- pheres of nitrogen, d作者: FER 時(shí)間: 2025-3-25 19:58 作者: 整潔漂亮 時(shí)間: 2025-3-26 03:50 作者: 連詞 時(shí)間: 2025-3-26 06:34
Jack Raffel,Allan H. Anderson,Glenn H. Chapmanods for the efficient modeling and accurate solution of contemporary real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applicat作者: concise 時(shí)間: 2025-3-26 10:48
Jack Raffel,Allan H. Anderson,Glenn H. Chapmane efficient modeling and accurate solution of modern real-world EMC problems. Intended to be self-contained, it performs a detailed presentation of all well-known algorithms, elucidating on their merits or weaknesses, and accompanies the theoretical content with a variety of applications. Outlining 作者: 可憎 時(shí)間: 2025-3-26 15:52 作者: Assault 時(shí)間: 2025-3-26 18:05
R. Wayne Johnson,Richard C. Jaeger,Travis N. Blalockof the book up to date, by the addition of a new Chapter 13 which deals with the more important developments that have occurred in the interim. This method has been adopted in order to simplify and to expedite the preparation of the present edition. As with the other Manuals of the Series, the eleme作者: miracle 時(shí)間: 2025-3-26 22:23 作者: LATER 時(shí)間: 2025-3-27 01:28 作者: 纖細(xì) 時(shí)間: 2025-3-27 07:19
Wafer-Scale Multichip Packaging Technology,With the many difficulties facing monolithic wafer-scale integration, there has been a significant amount of recent activity focusing on thin-film, multichip packaging approaches utilizing silicon wafers for the substrate. The breadth of these activities can be seen in Table 1, from Hagge [1].作者: 依法逮捕 時(shí)間: 2025-3-27 13:06
978-1-4612-8896-1Kluwer Academic Publishers 1989作者: 食草 時(shí)間: 2025-3-27 16:16 作者: KEGEL 時(shí)間: 2025-3-27 19:05
https://doi.org/10.1007/978-1-4613-1621-3Programmable Logic; Signal; Software; VLSI; Wafer; computer vision; development; diagnosis; integrated circu作者: 領(lǐng)導(dǎo)權(quán) 時(shí)間: 2025-3-27 23:30
Promise and Pitfalls of WSI,d then, like the phoenix, a new set of innovators and investors rise from the ashes to make yet another attempt. By itself, this very process is informative. Talented people do not invest their time and money in ill conceived enterprises. They believed the risks could be managed, and that the prize was worth the effort.作者: 字的誤用 時(shí)間: 2025-3-28 04:04 作者: Locale 時(shí)間: 2025-3-28 06:28 作者: Instinctive 時(shí)間: 2025-3-28 11:20
Architectural Yield Optimization,ductor researchers [1]. The expected benefits of smaller size, increased reliability, reduced cost, shorter signal delays, and simpler packaging are significant. Unfortunately, most of the previously reported attempts have been surpassed by increased density, improved circuitry, and better packaging of conventional integrated circuits.作者: 少量 時(shí)間: 2025-3-28 16:52 作者: 軍械庫 時(shí)間: 2025-3-28 22:50
Spare Allocation/Reconfiguration for WSI,m reliability. The focus is on spare allocation algorithms for architectures with dedicated spares and redundant interconnects. Integration of diagnosis and spare allocation is also examined. In conclusion an example computer-aided design and analysis workbench for reconfiguration algorithms and reconfigurable architectures is presented.作者: 打算 時(shí)間: 2025-3-29 00:35
Laser Restructurable Technology and Design,ystems have been fabricated and three of much larger size are being designed. Figure 1 shows one of these packaged WS circuits. The accomplishments and current research status of this project, which was conceived in 1979 [1], are described in this chapter.作者: Pert敏捷 時(shí)間: 2025-3-29 06:33
Laser Restructurable Technology and Design,ystems have been fabricated and three of much larger size are being designed. Figure 1 shows one of these packaged WS circuits. The accomplishments and current research status of this project, which was conceived in 1979 [1], are described in this chapter.作者: 使痛苦 時(shí)間: 2025-3-29 10:49 作者: GEAR 時(shí)間: 2025-3-29 13:41
Promise and Pitfalls of WSI,d then, like the phoenix, a new set of innovators and investors rise from the ashes to make yet another attempt. By itself, this very process is informative. Talented people do not invest their time and money in ill conceived enterprises. They believed the risks could be managed, and that the prize 作者: Aphorism 時(shí)間: 2025-3-29 15:38
Feasibility of Large Area Integrated Circuits,ea have been much better publicized than successes. The especially spectacular failure of Trilogy [1] is still very well remembered though much less understood. Consequently, despite the undisputable potential of WSI, large area VLSI systems are still considered to be economically justifiable for mi作者: 山間窄路 時(shí)間: 2025-3-29 21:44 作者: 懶鬼才會(huì)衰弱 時(shí)間: 2025-3-30 02:22
Architectural Yield Optimization,ductor researchers [1]. The expected benefits of smaller size, increased reliability, reduced cost, shorter signal delays, and simpler packaging are significant. Unfortunately, most of the previously reported attempts have been surpassed by increased density, improved circuitry, and better packaging作者: 合唱隊(duì) 時(shí)間: 2025-3-30 07:50 作者: 說不出 時(shí)間: 2025-3-30 08:58 作者: 艦旗 時(shí)間: 2025-3-30 13:56
Spare Allocation/Reconfiguration for WSI,m reliability. The focus is on spare allocation algorithms for architectures with dedicated spares and redundant interconnects. Integration of diagnosis and spare allocation is also examined. In conclusion an example computer-aided design and analysis workbench for reconfiguration algorithms and rec作者: machination 時(shí)間: 2025-3-30 20:25
A WSI Image Processor, resolution image processing modules. Indeed, a number of VLSI chips, incorporating from 8 to 72 processing elements on a single Silicon die, are currently in development for the construction of SIMD image processing arrays. However, such image processing modules remain large and expensive, attracti作者: 指耕作 時(shí)間: 2025-3-30 21:18
A WSI Image Processor, resolution image processing modules. Indeed, a number of VLSI chips, incorporating from 8 to 72 processing elements on a single Silicon die, are currently in development for the construction of SIMD image processing arrays. However, such image processing modules remain large and expensive, attracti作者: Pander 時(shí)間: 2025-3-31 04:51 作者: Engaging 時(shí)間: 2025-3-31 05:25
The 3-D Computer: An Integrated Stack of WSI Wafers,he attainment of an ever higher processing capability per unit volume. From the vacuum tube through the transistor, to the microelectronic era, and through a multitude of accompanying advances in physical packaging, the drive has consistently been to increase the amount of functional capability that作者: 變色龍 時(shí)間: 2025-3-31 10:42 作者: Melanoma 時(shí)間: 2025-3-31 15:46 作者: 昏迷狀態(tài) 時(shí)間: 2025-3-31 19:03
High Yield In-Situ Fabrication of Multilevel Interconnections for WSI, this concept usually refers to a sequence of operations carried out in a single work chamber, or a series of such work chambers [1]. Figure 1 conceptually illustrates such a system which in this case is designed for Ultra High Vacuum (UHV) processing. The transfer from chamber to chamber is highly 作者: 啞巴 時(shí)間: 2025-3-31 23:12 作者: miracle 時(shí)間: 2025-4-1 05:54
Wafer-Scale Testing/Design for Testability,ies. As digital systems become more complex, they are characterized by more internal circuitry per I/O line and larger internal state spaces. This makes testing complex systems as integrated units very difficult. The testing problem can be made more tractable by partitioning them into subsystems tha作者: ENDOW 時(shí)間: 2025-4-1 06:28 作者: 無能力之人 時(shí)間: 2025-4-1 11:24 作者: cuticle 時(shí)間: 2025-4-1 16:59
The 3-D Computer: An Integrated Stack of WSI Wafers,pany higher levels of integration have been the driving constraints. In virtually all instances, though, the end goal has been the same: increase the packaging density of the active electronic elements.作者: Nonthreatening 時(shí)間: 2025-4-1 19:15 作者: 誘惑 時(shí)間: 2025-4-2 01:15
afer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells ar
