標(biāo)題: Titlebook: 3D Stacked Chips; From Emerging Proces Ibrahim (Abe) M. Elfadel,Gerhard Fettweis Book 2016 Springer International Publishing Switzerland 20 [打印本頁] 作者: 柳條筐 時間: 2025-3-21 18:52
書目名稱3D Stacked Chips影響因子(影響力)
書目名稱3D Stacked Chips影響因子(影響力)學(xué)科排名
書目名稱3D Stacked Chips網(wǎng)絡(luò)公開度
書目名稱3D Stacked Chips網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱3D Stacked Chips被引頻次
書目名稱3D Stacked Chips被引頻次學(xué)科排名
書目名稱3D Stacked Chips年度引用
書目名稱3D Stacked Chips年度引用學(xué)科排名
書目名稱3D Stacked Chips讀者反饋
書目名稱3D Stacked Chips讀者反饋學(xué)科排名
作者: badinage 時間: 2025-3-21 22:53
https://doi.org/10.1057/9780230375826erent uniform and non-uniform quantization approaches. The results show, that even in the presence of significant ADC clock jitter and tight ADC quantization restrictions, remarkable crosstalk mitigation can be accomplished.作者: Provenance 時間: 2025-3-22 01:53
21st-Century Japanese Managementl TSV structures. System-level measurements complete the results shown in this chapter. It is verified that the TSVs used as transmission medium are much more broadband than the available VCSELs and photodiodes. Due to the low transmission distances, even non-waveguiding schemes show low loss.作者: 急性 時間: 2025-3-22 06:10
https://doi.org/10.1057/9780230509856e computational demand on a microprocessor chip may render on-chip optical communications unstable in a read-world, thermally challenging environment. In this chapter, we will discuss different approaches to minimize the effect of thermal variability on the performance of silicon photonics devices.作者: 濕潤 時間: 2025-3-22 10:07
Book 2016nd carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.作者: exclusice 時間: 2025-3-22 14:13
‘Modernist’ Women Writers and Narrative Artented for long distance on-chip communication and for intra-chip-stack TSV based communication. After presenting a TSV behavioral description, models, hardware results, and a method for equivalent circuit parameter extraction, an energy efficient, capacitive coupling TSV transceiver is presented.作者: 火花 時間: 2025-3-22 19:34
https://doi.org/10.1057/9780230377325output clock generation to meet these clocking requirements of low power and chip footprint. The achieved performance is shown using measurement results from silicon implementation in 28?nm Super-Low-Power CMOS technology.作者: 傳授知識 時間: 2025-3-23 00:46
1950s “Rocketman” TV Series and Their Fans boundaries between chip, package, and system. Insights gained from an actual implementation for testing an 3D interposer system suggest that certain IC design steps are better migrated to the package level, which would result in a more system centric physical implementation flows.作者: Chandelier 時間: 2025-3-23 01:28
Book 2016devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.? The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, a作者: 教育學(xué) 時間: 2025-3-23 07:35 作者: 抱狗不敢前 時間: 2025-3-23 10:10 作者: Collected 時間: 2025-3-23 16:21
with the latest features of version 10 for .NET 6.?.You‘ll review the essential C# 10 and earlier syntax, not previously covered, in a well-organized format that can be used as a handy reference.? Specifically, unions, generic attributes, CallerArgumentExpression, params span, Records,?Init only se作者: 改良 時間: 2025-3-23 21:10 作者: 字的誤用 時間: 2025-3-24 01:12
Copper-Based TSV: Interposer Windows 10. It presents the essential C# 7 syntax in a well-organized format that can be used as a handy reference..In the .C# 7 Quick Syntax Reference., you will find a concise reference to the C# language syntax: short, simple, and focused code examples; a well laid out table of contents; and a c作者: 主動 時間: 2025-3-24 04:05 作者: Ambiguous 時間: 2025-3-24 06:59
Energy Efficient TSV Based Communication Employing 1-Bit Quantization at the Receiverhitecture of most computers in use today. A typical von Neumann system has three major components: the central processing unit (CPU), or microprocessor; physical memory; and input/output (I/O). In von Neumann architecture (VNA) machines, such as the 80x86 family, the CPU is where all the computation作者: PRO 時間: 2025-3-24 13:16 作者: CHECK 時間: 2025-3-24 15:14 作者: 尖叫 時間: 2025-3-24 20:29 作者: 摻和 時間: 2025-3-24 23:52 作者: 散布 時間: 2025-3-25 06:46
Cantilever Design for Tunable WDM Filters Based on Silicon Microring Resonatorsanguage. It presents the essential C++ syntax in a well-organized format that can be used as a handy reference..You won’t find any technical jargon, bloated samples, drawn out history lessons, or witty stories in this book. What you will find is a language reference that is concise, to the point and作者: 釘牢 時間: 2025-3-25 09:35
t issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.978-3-319-79305-4978-3-319-20481-9作者: 眼界 時間: 2025-3-25 11:42 作者: GOAD 時間: 2025-3-25 18:00
Space Fever: From Fantasy to Realityit is imperative to find novel structures and materials to be incorporated in the memory cells which would allow tunnel oxide and voltage scaling. In this study, MOSFET- and MOSCAP-based memory devices are investigated along with the use of 2-nm silicon nanoparticles (Si-NPs) for charge storage. Ato作者: 母豬 時間: 2025-3-25 21:06
Space Fever: From Fantasy to Reality chapter, we present the key specifications for thermal sensors for 3D designs and discuss various sensing mechanisms and choices for data converter design. We explain in detail the parasitic BJT thermal sensor core with proportional to absolute temperature (PTAT) current generation. We also discuss作者: Foment 時間: 2025-3-26 02:25
Making the Universe Safe for Democracy: ratively until the maximal on-chip temperature falls below a pre-selected threshold. To do so, one important step is to accurately determine the location and number of thermal TSVs which have the largest impact on reducing hotspot temperatures. The experimental results show the suitability of our al作者: 嫌惡 時間: 2025-3-26 06:58
https://doi.org/10.1057/9780230509856led, and a summary of the state-of-the-art frequency tuning techniques. A detailed opto-mechanical analysis is then performed for the cantilever design, complemented with both mechanical and optical numerical computations.作者: hemoglobin 時間: 2025-3-26 10:38
What Josef Steindl Means to My Generations have to be very compact to enable high optical link parallelism. This chapter describes the recent progress of broadband integrated circuit (IC) design for compact high-speed energy-efficient optical intraconnects. Since the data modulation of lasers is one of the challenges to achieve high data r作者: 蚊帳 時間: 2025-3-26 14:31 作者: 逃避系列單詞 時間: 2025-3-26 19:49 作者: 慢慢啃 時間: 2025-3-26 22:17 作者: Obverse 時間: 2025-3-27 03:46 作者: Wordlist 時間: 2025-3-27 07:47 作者: LATE 時間: 2025-3-27 11:11
Two-nanometer Laser Synthesized Si-Nanoparticles for Low Power Memory Applicationssual Studio as one of the world’s most popular programming tools.Who This Book Is For.Those with very little orno experience in computer programming, who know how to use a computer, install a program, and navigate the web.978-1-4842-7146-9978-1-4842-7147-6作者: Inexorable 時間: 2025-3-27 14:03 作者: 銀版照相 時間: 2025-3-27 19:39
Integrated Optical Devices for 3D Photonic Transceiverss. Object-oriented programming (OOP) methodologies are employed to im- plement these ADT concepts. In OOP, data and operations for an ADT are combined into a single entity (object). ADTs are used to specifiy the objects-arrays, stacks, queues, trees, and graphs. OOP allows the pro- grammer to more closely mim978-1-4612-7618-0978-1-4612-2636-9作者: 補(bǔ)充 時間: 2025-3-28 01:46
Cantilever Design for Tunable WDM Filters Based on Silicon Microring Resonatorserators, Pointers and References.What are Arrays, Strings, Conditionals, Loops and more.How to use Functions.How to work with Constructors and Inheritance.How to use Access Levels, Static, Enum, String and Union, and more.What are Custom Conversions, Namespaces, Constants, and Preprocessor.How to do作者: 是比賽 時間: 2025-3-28 04:15 作者: 托運(yùn) 時間: 2025-3-28 10:00
Clock Generators for Heterogeneous MPSoCs Within 3D Chip Stacks978-1-4302-0797-9作者: climax 時間: 2025-3-28 12:24
Accurate Temperature Measurement for 3D Thermal Management978-1-4842-3318-4作者: Feigned 時間: 2025-3-28 17:30
Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias978-1-4842-2595-0作者: Negligible 時間: 2025-3-28 21:57
Athermal Photonic Circuits for Optical On-Chip Interconnects978-1-4302-6707-2作者: Outmoded 時間: 2025-3-29 01:07
Review of Interdigitated Back Contacted Full Heterojunction Solar Cell (IBC-SHJ): A Simulation Appro作者: 大氣層 時間: 2025-3-29 05:10
Optical Through-Silicon Viasshop, were greatly pleased with the excellence of the lectures and so were led to the idea of publishing the proceedings of the conference. There are basically two kinds of contributions. On on978-3-540-67562-4978-3-642-57288-3作者: Lymphocyte 時間: 2025-3-29 07:37 作者: 大喘氣 時間: 2025-3-29 13:14 作者: 面包屑 時間: 2025-3-29 15:37 作者: 推延 時間: 2025-3-29 20:26
Paradox, Undecidability, and the Noveliconductor industry. It is not clear whether this prediction has become a self-fulfilling prophecy, but it certainly defined a guideline for the entire industrial sector associated with microelectronics, and the industry has kept a steady pace of miniaturization, doubling the device density every 18作者: BAIT 時間: 2025-3-30 03:09 作者: 按等級 時間: 2025-3-30 07:01
‘Modernist’ Women Writers and Narrative Arte design of highly integrated, heterogeneous, and compact systems with reduced overall power consumption, but very limited heat dissipation capability. This chapter presents a holistic packet-in packet-out point-to-point link architecture suitable for constructing a 3D network-on-chip (NoC) for conn作者: 鬧劇 時間: 2025-3-30 09:17 作者: 紀(jì)念 時間: 2025-3-30 15:01
Cynthia J. Miller,A. Bowdoin Ripered to be designed more carefully. In order to avoid the conventional approach of multilevel ADCs, considering only energy efficient 1-bit comparators can be an alternative. To overcome the loss in terms of achievable rate due to coarse quantization the sampling rate is chosen much larger as suggeste作者: SLAY 時間: 2025-3-30 19:00 作者: BLA 時間: 2025-3-31 00:35
Space Fever: From Fantasy to Realityelated to the gate length scaling which is constrained by the gate stack, namely, the tunnel oxide thickness. In fact, the gate length is required to be commensurate with the gate stack in order to maintain a good gate control and to avoid short channel effects. However, in conventional flash memori作者: 是比賽 時間: 2025-3-31 01:00 作者: FAWN 時間: 2025-3-31 05:45
1950s “Rocketman” TV Series and Their Fansations of distributed heterogeneous design environments on EDA methodologies and flows. The 3D IC design process is considered along the three axes of structural, physical and functional design, and key interfaces for information exchange are identified. In such interfaces, standards play a crucial 作者: 反應(yīng) 時間: 2025-3-31 11:13 作者: Jacket 時間: 2025-3-31 15:29
https://doi.org/10.1057/9780230378551 and the glass fiber in the 1960s. Different application areas such as data center connectivity and long-haul transmission have led to different optical communication solutions. Chip-to-chip communication is a driver for the convergence of these approaches since this is where board-to-board communic
