標(biāo)題: Titlebook: 3D Microelectronic Packaging; From Fundamentals to Yan Li,Deepak Goyal Book 20171st edition Springer International Publishing AG, part of S [打印本頁] 作者: EXERT 時(shí)間: 2025-3-21 17:17
書目名稱3D Microelectronic Packaging影響因子(影響力)
作者: 失誤 時(shí)間: 2025-3-22 00:04 作者: Perceive 時(shí)間: 2025-3-22 01:02
https://doi.org/10.1057/9781137475022der volume. The dimension of the microbump may be one to three orders less than the C4 bump and BGA solder ball. The fast reaction between solder and the major metallization layers during reflow, thermal compressing bonding, and afterwards functioning results in the vast proportion of intermetallic 作者: LUMEN 時(shí)間: 2025-3-22 04:48 作者: llibretto 時(shí)間: 2025-3-22 12:28 作者: 禁令 時(shí)間: 2025-3-22 16:35 作者: Engaging 時(shí)間: 2025-3-22 20:09 作者: FLAIL 時(shí)間: 2025-3-22 22:17
Building Your Sales Transformation Roadmap,res is because for mobile and wearable devices, the frequency of impact and dropping to the ground is high. On EM and TM in microbumps and TSV, we emphasize the enhanced failure mode due to Joule heating.作者: Expostulate 時(shí)間: 2025-3-23 02:23
How European Was the Revolution of 1848/49?t Secondary Ion Mass Spectrometry (TOF-SIMS), and Electron Backscatter Diffraction (EBSD) to 3D packages are reviewed along with the key FI and FA challenges. 3D package FA Strategies of building up efficient FI-FA flow and in-depth root cause studies to provide solution paths are discussed and demo作者: 文件夾 時(shí)間: 2025-3-23 06:51
Materials and Processing of TSV,hlagen. Für die aktuelle Auflage wurden neue Funktionalít?ten zur Blechbearbeitung aufgenommen, die Qualit?t ausgesuchter Bilder verbessert sowie das Literaturverzeichnis aktualisiert. Die Auflage basiert auf R20..Ausgew?hlte 3D-Modelle lassen sich unter www.springervieweg.de/onlineplus herunterladen..978-3-8348-2131-7作者: Crepitus 時(shí)間: 2025-3-23 11:30 作者: geometrician 時(shí)間: 2025-3-23 17:25 作者: 嘲笑 時(shí)間: 2025-3-23 18:48
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages,hinenbaukonstruktion herzustellen. Eine kurze Einführung in CATIA V5 enth?lt Kapitel 3. Der Umgang mit Dateien in CATIA V5 wird im Kapitel 4 beschrieben. Grundlagen der Bauteilkonstruktion werden in Kapitel 5 vermitte978-3-8348-9004-7作者: CURT 時(shí)間: 2025-3-24 01:24
Back Matternd Anlagenbau hineinspielen..Zus?tzlich wurden grundlegende Ausführungen zum Modellbegriff und zum Systembegriff? aufgenommen, da diese die Basis für viele CAx-Anwendungen darstellen und den Bogen zur Systemtechnik spannen..978-3-540-36039-1作者: 協(xié)定 時(shí)間: 2025-3-24 04:24 作者: decode 時(shí)間: 2025-3-24 10:24 作者: Deject 時(shí)間: 2025-3-24 12:19
Fundamentals and Failures in Die Preparation for 3D Packaging,978-3-658-17333-3作者: 車床 時(shí)間: 2025-3-24 15:49 作者: Clumsy 時(shí)間: 2025-3-24 19:23 作者: 法律 時(shí)間: 2025-3-25 03:00 作者: 不適當(dāng) 時(shí)間: 2025-3-25 03:50
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology,978-3-322-91811-6作者: 道學(xué)氣 時(shí)間: 2025-3-25 10:53 作者: 表被動(dòng) 時(shí)間: 2025-3-25 11:52
Processing and Reliability of Solder Interconnections in Stacked Packaging,978-3-322-92878-8作者: 躲債 時(shí)間: 2025-3-25 16:50
Interconnect Quality and Reliability of 3D Packaging,978-3-322-80326-9作者: interpose 時(shí)間: 2025-3-25 22:28 作者: 截?cái)?nbsp; 時(shí)間: 2025-3-26 00:30 作者: 不適 時(shí)間: 2025-3-26 07:55
Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages,des Maschinenbaus und Praktikern den Einstieg in das Konstruieren mit CATIA V5 weitgehendst im Selbststudium durch eigenes Tun zu erm?glichen. Vorkenntnisse sind nicht erforderlich. Wer aber schon über ein Basiswissen in CATIA V5 verfügt, kann z. B. auch mit den übungen in Kapitel 9 beginnen. Die Er作者: Original 時(shí)間: 2025-3-26 12:01 作者: 橢圓 時(shí)間: 2025-3-26 14:25
Back Matteren.Includes supplementary material: .Dieses gut eingeführte Buch vermittelt die Grundlagen von CAx-Systemen und bietet einem breiten Leserkreis in knapper und übersichtlicher Form das Rüstzeug für die erfolgreiche Anwendung von CAx-Systemen. Die beschriebenen Vorgehensweisen und Beispiele basieren a作者: glans-penis 時(shí)間: 2025-3-26 18:25 作者: inchoate 時(shí)間: 2025-3-26 23:15 作者: 出沒 時(shí)間: 2025-3-27 03:16 作者: Rejuvenate 時(shí)間: 2025-3-27 08:30 作者: conservative 時(shí)間: 2025-3-27 11:47 作者: 法律的瑕疵 時(shí)間: 2025-3-27 15:43 作者: Onerous 時(shí)間: 2025-3-27 17:57
https://doi.org/10.1057/9781137475022of the bonding technology and process materials. The in situ bonding technology termed as Thermal Compression Bonding (TCB) typically controls force, temperature, and displacement, which are applied to packages when to reflow microbump solder interconnect of 3D TSV die. Consequently, this chapter wo作者: 使更活躍 時(shí)間: 2025-3-28 01:42 作者: 不能和解 時(shí)間: 2025-3-28 03:46 作者: 無法破譯 時(shí)間: 2025-3-28 07:00 作者: REIGN 時(shí)間: 2025-3-28 12:09 作者: 萬靈丹 時(shí)間: 2025-3-28 15:26
A Brief Consideration of the Hip-Hop Biopic,acity with low cost and low energy consumption. However, crucial reliability issues often arise in 3D integrated circuits (ICs) packaging due to high thermal stress and moisture stress at both die and package level. In this chapter, TSV-related reliability issues such as the measurement of thermal s作者: 不能妥協(xié) 時(shí)間: 2025-3-28 19:03
7 Steps to Sales Force Transformationnctionality of hand-held, consumer electronics. Similarly, reducing the size, weight, and power (SWaP) requirements of high-reliability electronics is an omnipresent goal of the military, space, and satellite communities. Yet, there remains to be an information gap with respect to the long-term perf作者: Fester 時(shí)間: 2025-3-29 01:08
Building Your Sales Transformation Roadmap,y issues. For the 3D packages, interconnects may include microbump, TSV, UBM, copper traces, etc. We compare them to the quality and reliability concerns observed in the existing interconnects, as well as the methodology to predict the field performances. We shall cover microstructure changes and fa作者: 過度 時(shí)間: 2025-3-29 03:40 作者: calamity 時(shí)間: 2025-3-29 08:02
https://doi.org/10.1007/978-3-319-44586-13D microelectronic packages; Advanced materials in 3D packages; Failure analysis microelectronic packa作者: hemorrhage 時(shí)間: 2025-3-29 14:34 作者: Canary 時(shí)間: 2025-3-29 16:10
3D Microelectronic Packaging978-3-319-44586-1Series ISSN 1437-0387 Series E-ISSN 2197-6643 作者: 假裝是我 時(shí)間: 2025-3-29 20:54 作者: Emmenagogue 時(shí)間: 2025-3-30 02:32
Springer Series in Advanced Microelectronicshttp://image.papertrans.cn/012/image/100744.jpg作者: 打折 時(shí)間: 2025-3-30 05:21
,Epilogue: Privacy and Drama, 1640–1660,st-level interconnect solder joints and damascene Cu interconnects, failure mechanisms and factors that modulate the EM of micro bumps, TSV, and its connected Cu layers are also summarized. The impact of the unique micro bump dimensions and structures on EM will be highlighted.作者: 冰河期 時(shí)間: 2025-3-30 08:49
Book 20171st editionetails, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bond
